Cited by 100Polymer composites and self-healingAdvanced Materials and MechanicsEpoxy Resin Curing Processes

A facile approach to fabricate a UV/heat dual-responsive triple shape memory polymer

Wu, Y., Hu, J., Zhang, C., Han, J., Wang, Y., Kumar, B.·2015·Journal of Materials Chemistry A

Abstract

In the present work, a facile approach was employed to fabricate a UV/heat dual-responsive triple shape memory polymer (SMP) by simply mixing Zn(Mebip) 2 (NTf 2 ) 2 , a metallosupramolecular unit formed by coordinating 2,6-bis( N -methyl-benzimidazolyl)-pyridine (Mebip) ligands to zinc di[bis(trifluoromethylsulfonyl)-imide] (Zn(NTf 2 ) 2 ), into one part of epoxy resin.

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Crossref · 10.1039/c4ta04881d

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32 of 32 references verified0 citation errors · 0 not checkable

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  • ZnO SMCs include imidazole-zinc ion coordinated shape-memory hydrogel, triple-shape-memory poly(acrylonitrile 2-methacryloyloxyethyl phosphorylcholine) from dipole-dipole-zinc ion coordination, epoxy-based SMP containing metallosupramolecular unit, and ZnO NRs in PU matrix.

    “They are containing imidazole-zinc ion for the production of coordinated shapememory hydrogel [174], triple-shape-memory poly(acrylonitrile 2-methacryloyloxyethyl phosphorylcholine) from dipoledipole-zinc ion coordination [175] or epoxy-based SMP containing metallosupramolecular unit formed by coordinating 2,6-bis( N -methyl-benzimidazolyl)-pyridine ligands to zinc di[bis(trifluoromethylsulfonyl)-”

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Authors
Wu, Y., Hu, J., Zhang, C., Han, J., Wang, Y., & Kumar, B.
Affiliations
Hong Kong Polytechnic University (HK)
Corresponding author
Hu, J.
Venue
Journal of Materials Chemistry A
Published
2015
Volume
3
Issue
1
Pages
97-100
ISSN
  • 2050-7488 (ISSN-L)
  • 2050-7496
OpenAlex
W2170809609
Cited by
100
References
32
Citations by year
2026: 1 · 2025: 4 · 2024: 7 · 2023: 6 · 2022: 7 · 2021: 4 · 2020: 9 · 2019: 14 · 2018: 13 · 2017: 11 · 2016: 15 · 2015: 9
FWCI
8.15
Type
journal article
Language
en
Open access
closed
Locations
  • Journal of Materials Chemistry A (publishedVersion)
  • PolyU Institutional Research Archive (Hong Kong Polytechnic University) (submittedVersion)
Funders
Zhejiang University
Topics
  • Physical Sciences › Materials Science › Polymers and Plastics › Polymer composites and self-healing
  • Physical Sciences › Engineering › Mechanical Engineering › Advanced Materials and Mechanics
  • Physical Sciences › Engineering › Mechanical Engineering › Epoxy Resin Curing Processes
Keywords
shape memory polymers, dual-responsive materials, epoxy resin, photothermal response

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