The DOI matches its Crossref record; 2 of the 2 references it cites were found in a registry or an index.
Data reduction in 3ω method for thin-film thermal conductivity determination
Abstract
The 3ω method has been proven to be very useful for determining the thermal conductivity of thin films and their substrates. Several simplifications are often used in determining the thermal conductivity of the films based on the experimentally measured 3ω signal. These simplifications, however, have limited range of applicability. In this work, we present a detailed analysis and mathematical modeling of the 3ω method applied for different experimental conditions. Effects considered include the finite substrate thickness, anisotropic nature of the film and substrate thermal conductivity, the film-substrate thermal property contrasts, the effect of heat capacitance of the heater, and the effect of thermal boundary resistance. Several experimental results are analyzed using the models presented. This work shows that the 3ω method can be extended to a wide range of sample conditions, with anisotropic conductivities in both the substrate and the film, and with small film-substrate conductivity contrast.
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Borca-Tasciuc et al. presented a general solution for heat conduction across a multilayer-film-on-substrate system.
“Borca-Tasciuc et al. presented a general solution for heat conduction across a multilayer-film-on-substrate system [13].”
From Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials (2016) · cites this paper as [13]
Citations
Cites
Thermal conductivity measurement from 30 to 750 K: the 3ω method
Cahill, D. G. (1990) · Review of Scientific Instruments · doi:10.1063/1.1141498 · Cited by 1,928
Thermal conductivity of amorphous solids above the plateau
Cahill, D. G., & Pohl, R. O. (1987) · Physical Review B · doi:10.1103/physrevb.35.4067 · Cited by 813
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Research works printed but not linked: 11
- 1997, J. Appl. Phys., 81, 2590, 10.1063/1.363923 · DOI · Paper page
- 1997, Appl. Phys. Lett., 70, 2957, 10.1063/1.118755 · DOI
- 1998, Mater. Res. Soc. Symp. Proc., 545, 473, 10.1557/PROC-545-473 · DOI
- 1998, ASME HTD, 357-3, 187
- 1999, ASME HTD, 364-3, 117
- 1999, J. Appl. Phys., 86, 3959, 10.1063/1.371314 · DOI
- 2000, Phys. Rev. B, 61, 3091, 10.1103/PhysRevB.61.3091 · DOI
- 2000, Superlattices Microstruct., 28, 199, 10.1006/spmi.2000.0900 · DOI
- 2000, ASME HTD, 366-2, 381
- 2000, ASME HTD, 366-2, 393
- 1998, J. Appl. Phys., 83, 5783, 10.1063/1.367500 · DOI
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Zhao, D., Qian, X., Gu, X., Jajja, S. A., & Yang, R. (2016) · Journal of Electronic Packaging · doi:10.1115/1.4034605 · Cited by 559
1 ω , 2 ω , and 3ω methods for measurements of thermal properties
Dames, C., & Chen, G. (2005) · Review of Scientific Instruments · doi:10.1063/1.2130718 · Cited by 275
Self-citationZhu, J., Tang, D., Wang, W., Liu, J., Holub, K. W., & Yang, R. (2010) · Journal of Applied Physics · doi:10.1063/1.3504213 · Cited by 232
Accurate dependence of gallium nitride thermal conductivity on dislocation density
Mion, C., Muth, J. F., Preble, E. A., & Hanser, D. (2006) · Applied Physics Letters · doi:10.1063/1.2335972 · Cited by 228
Anisotropy of the Thermal Conductivity in GaAs/AlAs Superlattices
Luckyanova, M. N., Johnson, J. A., Maznev, A. A., Garg, J., Jandl, A., Bulsara, M. T., Fitzgerald, E. A., Nelson, K. A., & Chen, G. (2013) · Nano Letters · doi:10.1021/nl4001162 · Cited by 96
Self-citationBhardwaj, R. G., & Khare, N. (2022) · International Journal of Thermophysics · doi:10.1007/s10765-022-03056-3 · Cited by 25
Experimental Techniques for Thin-Film Thermal Conductivity Characterization
Borca-Tasciuc, T., & Chen, G. (2006) · Physics of Solids and Liquids · doi:10.1007/0-387-26017-x_9 · Cited by 23
Self-citation
Metadata
- Authors
- Borca-Tasciuc, T., Kumar, A. R., & Chen, G.
- Affiliations
- Mechanical and Aerospace Engineering Department, Nanoscale Heat Transfer and Thermoelectrics Laboratory, University of California at Los Angeles, Los Angeles, California 90095-1597
- Venue
- Review of Scientific Instruments
- Publisher
- AIP Publishing
- Published
- 2001-04-01
- Volume
- 72
- Issue
- 4
- Pages
- 2139-2147
- ISSN
- 0034-6748
- 1089-7623
- Cited by
- 439
- References
- 2
- Language
- en
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