Cited by 367Thermal properties of materials3D IC and TSV technologiesThermography and Photoacoustic Techniques

The DOI matches its Crossref record; 16 of the 16 references it cites were found in a registry or an index.

Measurement of thermal conductivity of silicon dioxide thin films using a 3ω method

Yamane, Tsuneyuki, Nagai, Naoto, Katayama, Shin-ichiro, Todoki, Minoru·2002·Journal of Applied Physics

DOI 10.1063/1.1481958

Open this paper in CoChat — free account

Abstract

The thermal conductivity of SiO2 thin films prepared using various procedures has been studied using a 3ω method. The thermal conductivity of SiO2 thin films of above approximately 500 nm thickness decreases as the porosity of the specimen, which is determined by infrared absorption spectroscopy, increases. Below approximately 250 nm thickness, the observed thermal conductivity of the SiO2 thin films systematically decreases as a function of film thickness. The data have been analyzed based on a SiO2-thickness-independent thermal conductivity and interfacial resistance. The total estimated interfacial resistance between the metal strip and the film, and between the film and the substrate is about 2×10−8 m2 KW−1.

Integrity signals

Registry

Crossref · 10.1063/1.1481958

Cites

16 of 16 references verified0 citation errors · 0 not checkable

Statistics

Recomputing p-values needs the paper’s full text.

Claims the paper makes

This paper’s full text isn’t openly available, so its claims and self-check weren’t run. The registry and citation checks still apply.

Claims other papers make about this one

Each is checked against this paper’s own text: does it say what the citing paper says it does?

Thermal conductivity measurement from 30 to 750 K: the 3ω method
Cahill, D. G. (1990) · Review of Scientific Instruments · doi:10.1063/1.1141498 · Cited by 1,928
Infrared Absorption at Longitudinal Optic Frequency in Cubic Crystal Films
Berreman, D. W. (1963) · Physical Review · doi:10.1103/physrev.130.2193 · Cited by 1,032
Heat transport in thin dielectric films
Lee, S.-M., & Cahill, D. G. (1997) · Journal of Applied Physics · doi:10.1063/1.363923 · Cited by 732
Thermal conductivity of a -Si:H thin films
Cahill, D. G., Katiyar, M., & Abelson, J. R. (1994) · Physical Review B · doi:10.1103/physrevb.50.6077 · Cited by 523
Thermal conductivity of sputtered oxide films
Lee, S. M., Cahill, D. G., & Allen, T. H. (1995) · Physical review. B, Condensed matter · doi:10.1103/physrevb.52.253 · Cited by 280
Application of the three omega thermal conductivity measurement method to a film on a substrate of finite thickness
Kim, J. H., Feldman, A., & Novotny, D. B. (1999) · Journal of Applied Physics · doi:10.1063/1.371314 · Cited by 217
Optical properties of thin films and the Berreman effect
Harbecke, B., Heinz, B., & Große, P. (1985) · Applied Physics A · doi:10.1007/bf00616061 · Cited by 212
Thermal conductivity of sputtered and evaporated SiO2 and TiO2 optical coatings
Cahill, D. G., & Allen, T. H. (1994) · Applied Physics Letters · doi:10.1063/1.112355 · Cited by 168
Thermal conductivity of dielectric thin films
Lambropoulos, J. C., Jolly, M. R., Amsden, C. A., Gilman, S. E., Sinicropi, M. J., Diakomihalis, D., & Jacobs, S. D. (1989) · Journal of Applied Physics · doi:10.1063/1.343963 · Cited by 164
Effect of porosity on infrared-absorption spectra of silicon dioxide
Chou, J., & Lee, S. (1995) · Journal of Applied Physics · doi:10.1063/1.358877 · Cited by 104

Flagged first, then by citations

Show all 16 references

Research works printed but not linked: 1

1984, Appl. Phys. A: Solids Surf., 38, 263

Sorted by citations

Energy dissipation and transport in nanoscale devices
Pop, E. (2010) · Nano Research · doi:10.1007/s12274-010-1019-z · Cited by 1,308
Heat Generation and Transport in Nanometer-Scale Transistors
Pop, E., Sinha, S., & Goodson, K. E. (2006) · Proceedings of the IEEE · doi:10.1109/jproc.2006.879794 · Cited by 712
Broadband phonon mean free path contributions to thermal conductivity measured using frequency domain thermoreflectance
Regner, K. T., Sellan, D. P., Su, Z., Amon, C. H., McGaughey, A. J. H., & Malen, J. A. (2013) · Nature Communications · doi:10.1038/ncomms2630 · Cited by 646
Thermal conductivity of carbon nanotube networks: a review
Kumanek, B., & Janas, D. W. (2019) · Journal of Materials Science · doi:10.1007/s10853-019-03368-0 · Cited by 497
Ballistic to diffusive crossover of heat flow in graphene ribbons
Bae, M., Li, Z., Akšamija, Z., Martin, P., Xiong, F., Ong, Z., Knežević, I., & Pop, E. (2013) · Nature Communications · doi:10.1038/ncomms2755 · Cited by 326
Thermal Conductivity of Amorphous Materials
Zhou, W., Cheng, Y., Chen, K., Xie, G., Wang, T., & Zhang, G. (2019) · Advanced Functional Materials · doi:10.1002/adfm.201903829 · Cited by 333
Thermal conductivity accumulation in amorphous silica and amorphous silicon
Larkin, J. M., & McGaughey, A. J. H. (2014) · Physical Review B · doi:10.1103/physrevb.89.144303 · Cited by 308
3-Omega Measurements of Vertically Oriented Carbon Nanotubes on Silicon
Hu, X., Padilla, A. A., Xu, J., Fisher, T. S., & Goodson, K. E. (2005) · ASME Journal of Heat and Mass Transfer · doi:10.1115/1.2352778 · Cited by 237
Silicon Photonic Platform for Passive Waveguide Devices: Materials, Fabrication, and Applications
Su, Y., Zhang, Y., Qiu, C., Guo, X., & Sun, L. (2020) · Advanced Materials Technologies · doi:10.1002/admt.201901153 · Cited by 234
2D Materials Enabled Next‐Generation Integrated Optoelectronics: from Fabrication to Applications
Cheng, Z., Cao, R., Wei, K., Yao, Y., Liu, X., Kang, J., Dong, J., Shi, Z., Zhang, H., & Zhang, X. (2021) · Advanced Science · doi:10.1002/advs.202003834 · Cited by 234
Origin of photoresponse in black phosphorus phototransistors
Low, T., Engel, M., Steiner, M. B., & Avouris, P. (2014) · Physical Review B · doi:10.1103/physrevb.90.081408 · Cited by 211
Slow-light-enhanced energy efficiency for graphene microheaters on silicon photonic crystal waveguides
Yan, S., Zhu, X., Frandsen, L. H., Xiao, S., Mortensen, N. A., Dong, J., & Ding, Y. (2017) · Nature Communications · doi:10.1038/ncomms14411 · Cited by 207
Graphene-on-Diamond Devices with Increased Current-Carrying Capacity: Carbon sp 2 -on-sp 3 Technology
Yu, J., Liu, G., Sumant, A. V., Goyal, V., & Balandin, A. A. (2012) · Nano Letters · doi:10.1021/nl204545q · Cited by 186
Thermal transport in amorphous materials: a review
Wingert, M. C., Zheng, J., Kwon, S., & Chen, R. (2016) · Semiconductor Science and Technology · doi:10.1088/0268-1242/31/11/113003 · Cited by 160
Analysis of Self-Heating Effects in Ultrathin-Body SOI MOSFETs by Device Simulation
Fiegna, C., Yang, Y., SANGIORGI, E., & O'Neill, A. G. (2008) · IEEE Transactions on Electron Devices · doi:10.1109/ted.2007.911354 · Cited by 156
Optical Measurement of Thermal Conductivity Using Fiber Aligned Frequency Domain Thermoreflectance
Malen, J. A., Baheti, K., Tong, T., Zhao, Y., Hudgings, J. A., & Majumdar, A. (2011) · Journal of Heat Transfer · doi:10.1115/1.4003545 · Cited by 145
High-Field Transport and Velocity Saturation in Synthetic Monolayer MoS2
Smithe, K. K. H., English, C., Suryavanshi, S. V., & Pop, E. (2018) · Nano Letters · doi:10.1021/acs.nanolett.8b01692 · Cited by 139
Size effects on the thermal conductivity of amorphous silicon thin films
Braun, J. L., Baker, C. H., Giri, A., Elahi, M. M. M., Artyushkova, K., Beechem, T. E., Norris, P. M., Leseman, Z. C., Gaskins, J. T., & Hopkins, P. E. (2016) · Physical review. B./Physical review. B · doi:10.1103/physrevb.93.140201 · Cited by 137
Thermal conducting properties of aligned carbon nanotubes and their polymer composites
Ji, T., Feng, Y., Qin, M., & Feng, W. (2016) · Composites Part A Applied Science and Manufacturing · doi:10.1016/j.compositesa.2016.10.009 · Cited by 136
A review of boron carbon nitride thin films and progress in nanomaterials
Nehate, S. D., Saikumar, A. K., Prakash, A., & Sundaram, K. B. (2020) · Materials Today Advances · doi:10.1016/j.mtadv.2020.100106 · Cited by 128
Cooling of photoexcited carriers in graphene by internal and substrate phonons
Low, T., Perebeinos, V., Kim, R., Freitag, M., & Avouris, P. (2012) · Physical Review B · doi:10.1103/physrevb.86.045413 · Cited by 126
Review—Investigation and Review of the Thermal, Mechanical, Electrical, Optical, and Structural Properties of Atomic Layer Deposited High-kDielectrics: Beryllium Oxide, Aluminum Oxide, Hafnium Oxide, and Aluminum Nitride
Gaskins, J. T., Hopkins, P. E., Merrill, D. R., Bauers, S. R., Hadland, E. C., Johnson, D. C., Koh, D., Yum, J., Banerjee, S. K., Nordell, B. J., et al. (2017) · ECS Journal of Solid State Science and Technology · doi:10.1149/2.0091710jss · Cited by 131
Thermal Phenomena in Nanoscale Transistors
Pop, E., & Goodson, K. E. (2006) · Journal of Electronic Packaging · doi:10.1115/1.2188950 · Cited by 121
Analysis of the 3-omega method for thermal conductivity measurement
Wang, H., & Sen, M. (2008) · International Journal of Heat and Mass Transfer · doi:10.1016/j.ijheatmasstransfer.2008.10.020 · Cited by 123
Breakdown current density in h-BN-capped quasi-1D TaSe 3 metallic nanowires: prospects of interconnect applications
Stolyarov, M. A., Liu, G., Bloodgood, M. A., Aytan, E., Jiang, C., Samnakay, R., Salguero, T. T., Nika, D. L., Rumyantsev, S., Shur, M. S., et al. (2016) · Nanoscale · doi:10.1039/c6nr03469a · Cited by 116
Two-dimensional materials for future information technology: status and prospects
Qiu, H., Yu, Z., Zhao, T., Zhang, Q., Xu, M., Li, P., Li, T., Bao, W., Chai, Y., Chen, S. L., et al. (2024) · Science China Information Sciences · doi:10.1007/s11432-024-4033-8 · Cited by 121
Two‐Dimensional Materials for Integrated Photonics: Recent Advances and Future Challenges
Wu, J., Ma, H., Yin, P., Ge, Y., Zhang, Y., Li, L., Zhang, H., & Lin, H. (2020) · Small Science · doi:10.1002/smsc.202000053 · Cited by 117
Anisotropic thermal conductivity measurement of carbon-fiber/epoxy composite materials
Tian, T., & Cole, K. D. (2012) · International Journal of Heat and Mass Transfer · doi:10.1016/j.ijheatmasstransfer.2012.06.059 · Cited by 112
Thermoelectric transport across graphene/hexagonal boron nitride/graphene heterostructures
Chen, C.-C., Li, Z., Shi, L., & Cronin, S. B. (2014) · Nano Research · doi:10.1007/s12274-014-0550-8 · Cited by 111
Phonon thermal transport and its tunability in GaN for near-junction thermal management of electronics: A review
Tang, D.-S., & Cao, B.-Y. (2022) · International Journal of Heat and Mass Transfer · doi:10.1016/j.ijheatmasstransfer.2022.123497 · Cited by 113
Upper limit to the thermal penetration depth during modulated heating of multilayer thin films with pulsed and continuous wave lasers: A numerical study
Braun, J. L., & Hopkins, P. E. (2017) · Journal of Applied Physics · doi:10.1063/1.4982915 · Cited by 103
Tuning the Ignition Performance of a Microchip Initiator by Integrating Various Al/MoO 3 Reactive Multilayer Films on a Semiconductor Bridge
Xu, J., Tai, Y., Ru, C., Dai, J., Ye, Y., Shen, R., & Zhu, P. (2017) · ACS Applied Materials & Interfaces · doi:10.1021/acsami.6b14662 · Cited by 99
Dissipative Kerr Solitons in a III‐V Microresonator
Moille, G. T., Chang, L., Xie, W., Rao, A., Lu, X., Davanço, M., Bowers, J. E., & Srinivasan, K. (2020) · Laser & Photonics Review · doi:10.1002/lpor.202000022 · Cited by 99
Thermal conductivity measurement and interface thermal resistance estimation using SiO2 thin film
Chien, H.-C., Yao, D., Huang, M., & Chang, T.-Y. (2008) · Review of Scientific Instruments · doi:10.1063/1.2927253 · Cited by 99
A practical extension of the 3ω method to multilayer structures
Olson, B. W., Graham, S. L., & Chen, K. (2005) · Review of Scientific Instruments · doi:10.1063/1.1896619 · Cited by 95
Ultra-low thermal conductivity thermal barrier coatings from recycled fly-ash cenospheres
Chávez-Valdez, A., Arizmendi-Morquecho, A. M., Vargas, G., Almanza-Robles, J. M., & Alvarez-Quintana, J. (2011) · Acta Materialia · doi:10.1016/j.actamat.2011.01.011 · Cited by 89
Thermally Conductive Hexagonal Boron Nitride/Polymer Composites for Efficient Heat Transport
Yao, C., Leahu, G., Holicky, M., Liu, S., Fenech‐Salerno, B., Lai, M. C., Larciprete, M. C., Ducati, C., Divitini, G., Voti, R. L., et al. (2024) · Advanced Functional Materials · doi:10.1002/adfm.202405235 · Cited by 88
Improved Working Temperature and Capacitive Energy Density of Biaxially Oriented Polypropylene Films with Alumina Coating Layers
Bao, Z., Du, X., Ding, S., Chen, J., Dai, Z., Liu, C., Wang, Y., Yin, Y., & Li, X. (2022) · ACS Applied Energy Materials · doi:10.1021/acsaem.1c03735 · Cited by 84
Mechanism of the Defect Formation in Supported Graphene by Energetic Heavy Ion Irradiation: the Substrate Effect
Li, W., Wang, X., Zhang, X., Zhao, S., Duan, H., & Xue, J. (2015) · Scientific Reports · doi:10.1038/srep09935 · Cited by 83
Thermal conductivity of cubic and hexagonal mesoporous silica thin films
Coquil, T., Richman, E. K., Hutchinson, N. J., Tolbert, S. H., & Pilon, L. (2009) · Journal of Applied Physics · doi:10.1063/1.3182826 · Cited by 80
Analytical Thermal Model for Self-Heating in Advanced FinFET Devices With Implications for Design and Reliability
Xu, C., Kolluri, S. K., Endo, K., & Banerjee, K. (2013) · IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems · doi:10.1109/tcad.2013.2248194 · Cited by 79
Light-Tunable 1T-TaS2 Charge-Density-Wave Oscillators
Zhu, C., Chen, Y., Liu, F., Zheng, S., Li, X., Chaturvedi, A., Zhou, J., Fu, Q., He, Y., Zeng, Q., et al. (2018) · ACS Nano · doi:10.1021/acsnano.8b05756 · Cited by 74
Two-Dimensional Phonon Polariton Heat Transport
Tranchant, L., Hamamura, S., Ordoñez-Miranda, J., Yabuki, T., Vega-Flick, A., Cervantes-Alvarez, F., Alvarado-Gil, J. J., Volz, S. G., & Miyazaki, K. (2019) · Nano Letters · doi:10.1021/acs.nanolett.9b02214 · Cited by 75
Great enhancements in the thermoelectric power factor of BiSbTe nanostructured films with well-ordered interfaces
Chang, H.-C., Chen, C., & Kuo, Y. K. (2013) · Nanoscale · doi:10.1039/c3nr01499a · Cited by 72
Toward Air Stability of Thin GaSe Devices: Avoiding Environmental and Laser‐Induced Degradation by Encapsulation
Zhao, Q., Frisenda, R., Gant, P., de Lara, D. P., Munuera, C., Garcı́a-Hernández, M., Niu, Y., Wang, T., Jie, W., & Castellanos-Gómez, A. (2018) · Advanced Functional Materials · doi:10.1002/adfm.201805304 · Cited by 73
Experimental evidence of very long intrinsic phonon mean free path along the c-axis of graphite
Fu, Q., Yang, J., Chen, Y., Li, D., & Xu, D. (2015) · Applied Physics Letters · doi:10.1063/1.4906348 · Cited by 71
High Temperature Thermal Conductivity of Amorphous Al2 O 3 Thin Films Grown by Low Temperature ALD
Cappella, A., Battaglia, J., Schick, V., Kusiak, A., Lamperti, A., Wiemer, C., & Hay, B. (2013) · Advanced Engineering Materials · doi:10.1002/adem.201300132 · Cited by 70
Thermal conductivity of ultra low-k dielectrics
Delan, A., Rennau, M., Schulz, S. E., & Geßner, T. (2003) · Microelectronic Engineering · doi:10.1016/s0167-9317(03)00417-9 · Cited by 73
Flexible β‐Ga2O3 Nanomembrane Schottky Barrier Diodes
Swinnich, E., Hasan, M. N., Zeng, K., Dove, Y., Singisetti, U., Mazumder, B., & Seo, J. (2019) · Advanced Electronic Materials · doi:10.1002/aelm.201800714 · Cited by 67
Surface plasmon enhanced photoconductance of gold nanoparticle arrays with incorporated alkane linkers
Mangold, M. A., Weiss, C., Calame, M., & Holleitner, A. W. (2009) · Applied Physics Letters · doi:10.1063/1.3116148 · Cited by 66
Low-Frequency Acoustic Phonon Temperature Distribution in Electrically Biased Graphene
Jo, I., Hsu, I.-K., Lee, Y. J., Sadeghi, M. M., Kim, S., Cronin, S. B., Tutuc, E., Banerjee, S. K., Yao, Z., & Shi, L. (2010) · Nano Letters · doi:10.1021/nl102858c · Cited by 66
Thermal conduction across a boron nitride and SiO 2 interface
Li, X., Yan, Y., Dong, L., Guo, J., Aiyiti, A., Xu, X., & Li, B. (2017) · Journal of Physics D Applied Physics · doi:10.1088/1361-6463/aa59a8 · Cited by 67
Thermal issues and their effects on heat-assisted magnetic recording system (invited)
Xu, B., Liu, Z. J., Ji, R., Toh, Y. T., Hu, J., Li, J. M., Zhang, J., Ye, K. D., & Chia, C. W. (2012) · Journal of Applied Physics · doi:10.1063/1.3671421 · Cited by 62
Thermal analysis of ultra-thin body device scaling [SOI and FinFet devices]
Pop, E., Dutton, R. W., & Goodson, K. E. (2004) · Technical digest - International Electron Devices Meeting/Technical digest · doi:10.1109/iedm.2003.1269420 · Cited by 61
A review in thermal management for advanced chip packaging from chip to heat sink
Kim, M. S., Kim, J., Park, W., & Kang, J. S. (2025) · Microelectronics Reliability · doi:10.1016/j.microrel.2025.115782 · Cited by 60
Size Effects in the Thermal Conductivity of Amorphous Polymers
Feng, T., He, J., Rai, A., Hun, D., Líu, J., & Shrestha, S. S. (2020) · Physical Review Applied · doi:10.1103/physrevapplied.14.044023 · Cited by 54
Enhanced thermal conductivity of polycrystalline aluminum nitride thin films by optimizing the interface structure
Pan, T., Zhang, Y., Huang, J., Zeng, B., Hong, D., Wang, S. L., Zeng, H. Z., Gao, M., Huang, W., & Lin, Y. (2012) · Journal of Applied Physics · doi:10.1063/1.4748048 · Cited by 52
Thermal Conductivity and Cure Kinetics of Epoxy-Boron Nitride Composites—A Review
Hutchinson, J. M., & Moradi, S. (2020) · Materials · doi:10.3390/ma13163634 · Cited by 52
Measurement of Thermal Conductivity of TiO2 Thin Films Using 3ω Method
Kim, D. J., Kim, D. S., Cho, S., Kim, S. W., Lee, S. H., & Kim, J. C. (2004) · International Journal of Thermophysics · doi:10.1023/b:ijot.0000022340.65615.22 · Cited by 52
Substrate-dependence of monolayer MoS2 thermal conductivity and thermal boundary conductance
Gabourie, A. J., Köroğlu, Ç., & Pop, E. (2022) · Journal of Applied Physics · doi:10.1063/5.0089247 · Cited by 51
Layer-by-layer thermal conductivities of the Group III nitride films in blue/green light emitting diodes
Su, Z., Huang, L., Liu, F., Freedman, J. P., Porter, L. M., Davis, R. F., & Malen, J. A. (2012) · Applied Physics Letters · doi:10.1063/1.4718354 · Cited by 51
Impact of Geometry, Doping, Temperature, and Boundary Conductivity on Thermal Characteristics of 14-nm Bulk and SOI FinFETs
Sun, J.-Y., Li, X., Sun, Y., & Shi, Y. (2020) · IEEE Transactions on Device and Materials Reliability · doi:10.1109/tdmr.2020.2964734 · Cited by 51
Wide bandwidth frequency-domain thermoreflectance: Volumetric heat capacity, anisotropic thermal conductivity, and thickness measurements
Ziade, E. (2020) · Review of Scientific Instruments · doi:10.1063/5.0021917 · Cited by 50
Impact of self-heating and substrate effects on small-signal output conductance in UTBB SOI MOSFETs
Makovejev, S., Raskin, J. ‐., Arshad, M. K. M., Flandre, D., Olsen, S. H., Andrieu, F., & Kilchytska, V. (2011) · Solid-State Electronics · doi:10.1016/j.sse.2011.10.027 · Cited by 49
Measurement and evaluation of the interfacial thermal resistance between a metal and a dielectric
Chien, H.-C., Yao, D., & Hsu, C. (2008) · Applied Physics Letters · doi:10.1063/1.3039806 · Cited by 48
Record-Low thermal boundary resistance at bonded GaN/diamond interface by controlling ultrathin heterogeneous amorphous layer
Xu, B., Mu, F., Liu, Y. J., Guo, R., Hu, S., & Shiomi, J. (2024) · Acta Materialia · doi:10.1016/j.actamat.2024.120458 · Cited by 52
Integrated Circuit Cooling Using Heterogeneous Micropin-Fin Arrays for Nonuniform Power Maps
Sarvey, T. E., Hu, Y., Green, C. E., Kottke, P. A., Woodrum, D. C., Joshi, Y. K., Fedorov, A. G., Sitaraman, S. K., & Bakir, M. S. (2017) · IEEE Transactions on Components Packaging and Manufacturing Technology · doi:10.1109/tcpmt.2017.2704525 · Cited by 47
AC thermal imaging of a microwire with a fluorescent nanocrystal: Influence of the near field on the thermal contrast
Aigouy, L., Saïdi, E., Lalouat, L., Labéguerie-Egéa, J., Mortier, M., Löw, P., & Bergaud, C. (2009) · Journal of Applied Physics · doi:10.1063/1.3233940 · Cited by 46
Thermal Conductivity of Ordered Mesoporous Titania Films Made from Nanocrystalline Building Blocks and Sol−Gel Reagents
Coquil, T., Reitz, C., Brezesinski, T., Nemanick, E. J., Tolbert, S. H., & Pilon, L. (2010) · The Journal of Physical Chemistry C · doi:10.1021/jp103251t · Cited by 46
Thermal conductivity measurement of fluids using the 3ω method
Lee, S. M. (2009) · Review of Scientific Instruments · doi:10.1063/1.3082036 · Cited by 44
The past and future of multi-gate field-effect transistors: Process challenges and reliability issues
Sun, Y., Yu, X., Zhang, R., Chen, B., & Cheng, R. (2021) · Journal of Semiconductors · doi:10.1088/1674-4926/42/2/023102 · Cited by 44
Measurement of the thermal conductivity of TiO2 thin films by using the thermo-reflectance method
Mun, J., Kim, S. W., Kato, R., Hatta, I., Lee, S. H., & Kang, K. H. (2006) · Thermochimica Acta · doi:10.1016/j.tca.2006.11.018 · Cited by 42
Thermal-aware device design of nanoscale bulk/SOI FinFETs: Suppression of operation temperature and its variability
Takahashi, T., Beppu, N., Chen, K., Oda, S., & Uchida, K. (2011) · Technical digest - International Electron Devices Meeting/Technical digest · doi:10.1109/iedm.2011.6131672 · Cited by 41
Two-dimensional optoelectronic devices for silicon photonic integration
Tang, Z., Chen, S. L., Li, D., Wang, X., & Pan, A. (2022) · Journal of Materiomics · doi:10.1016/j.jmat.2022.11.007 · Cited by 40
Photothermal Enhancement in Core-Shell Structured Plasmonic Nanoparticles
Li, Q., Zhang, W., Zhao, D., & Qiu, M. (2014) · Plasmonics · doi:10.1007/s11468-014-9673-8 · Cited by 40
Modeling and Analysis of Self-Heating in FinFET Devices for Improved Circuit and EOS/ESD Performance
Kolluri, S. K., Endo, K., Suzuki, E., & Banerjee, K. (2007) · Technical digest - International Electron Devices Meeting/Technical digest · doi:10.1109/iedm.2007.4418895 · Cited by 40
Effect of grain size on thermal transport in post-annealed antimony telluride thin films
Park, N., Lee, W., Hong, J.-E., Park, T.-H., Yoon, S., Im, H., Kim, H. S., & Lee, S. (2015) · Nanoscale Research Letters · doi:10.1186/s11671-015-0733-6 · Cited by 40
Enhancing the thermoelectric properties of super-lattice Al2O3/ZnO atomic film via interface confinement
Lee, J., Park, T.-H., Lee, S.-H., Park, N., Lee, W., Lim, J. H., Lee, S.-K., & Park, J. (2016) · Ceramics International · doi:10.1016/j.ceramint.2016.06.032 · Cited by 40
Engineering Interfacial Effects in Electron and Phonon Transport of Sb2Te3/MoS2 Multilayer for Thermoelectric ZT Above 2.0
Ahmad, M., Agarwal, K., Munoz, S. G., Ghosh, A., Kodan, N., Kolosov, O., & Mehta, B. R. (2022) · Advanced Functional Materials · doi:10.1002/adfm.202206384 · Cited by 39
Characterization of silicon dioxide film by high spatial resolution cathodoluminescence spectroscopy
Yoshikawa, M., Matsuda, K., Yamaguchi, Y., Matsunobe, T., Nagasawa, Y., Fujino, H., & Yamane, T. (2002) · Journal of Applied Physics · doi:10.1063/1.1520726 · Cited by 37
Self-citation
All-plasmonic switching based on thermal nonlinearity in a polymer plasmonic microring resonator
Perron, D., Wu, M., Horvath, C., Bachman, D., & Van, V. (2011) · Optics Letters · doi:10.1364/ol.36.002731 · Cited by 37
Thermoelectric performance of PbSe quantum dot films
Yang, D., Lu, C., Yin, H. M., & Herman, I. P. (2013) · Nanoscale · doi:10.1039/c3nr01875j · Cited by 38
Thermal conductivity and thermal boundary resistance of amorphous Al2O3 thin films on germanium and sapphire
Paterson, J., Singhal, D., Tainoff, D., Richard, J., & Bourgeois, O. (2020) · Journal of Applied Physics · doi:10.1063/5.0004576 · Cited by 36
Nanoscale temperature sensing using the Seebeck effect
Bakker, F. L., Flipse, J., & van Wees, B. J. (2012) · Journal of Applied Physics · doi:10.1063/1.3703675 · Cited by 35
Single-resonance silicon nanobeam filter with an ultra-high thermo-optic tuning efficiency over a wide continuous tuning range
Zhang, Y., He, Y., Zhu, Q., Guo, X., Qiu, C., Su, Y., & Soref, R. A. (2018) · Optics Letters · doi:10.1364/ol.43.004518 · Cited by 35
Thermal conductivity measurement of amorphous Si/SiGe multilayer films by 3 omega method
Shen, B., Zeng, Z., Lin, C., & Hu, Z. (2012) · International Journal of Thermal Sciences · doi:10.1016/j.ijthermalsci.2012.10.022 · Cited by 34
Tuning thermal conductance across sintered silicon interface by local nanostructures
Sakata, M., Hori, T., Oyake, T., Maire, J. K., Nomura, M., & Shiomi, J. (2015) · Nano Energy · doi:10.1016/j.nanoen.2015.03.038 · Cited by 34
A single-mask thermal displacement sensor in MEMS
Krijnen, B., Hogervorst, R. P., van Dijk, J. W., Engelen, J. B. C., Woldering, L. A., Brouwer, D. M., Abelmann, L., & Soemers, H. M. J. R. (2011) · Journal of Micromechanics and Microengineering · doi:10.1088/0960-1317/21/7/074007 · Cited by 33
Experimental and numerical study of anisotropic thermal conductivity of magnetically aligned PDMS/Ni particle composites
Su, J., Liu, X., Charmchi, M., & Sun, H. (2016) · International Journal of Heat and Mass Transfer · doi:10.1016/j.ijheatmasstransfer.2016.02.023 · Cited by 33
Integrated Optical Modulator Based on Transition between Photonic Bands
Gövdeli, A., Sarihan, M. C., Karaca, U., & Kocaman, S. (2018) · Scientific Reports · doi:10.1038/s41598-018-20097-7 · Cited by 33
Thermal conductivity measurement of submicrometer-scale silicon dioxide films by an extended micro-Raman method
Huang, S., Ruan, X., Zou, J. T., Fu, X., & Yang, H. (2009) · Microsystem Technologies · doi:10.1007/s00542-009-0824-3 · Cited by 32
General bidirectional thermal characterization via the 3ω technique
Bauer, M. L., & Norris, P. M. (2014) · Review of Scientific Instruments · doi:10.1063/1.4884638 · Cited by 33
Thermal microscopy of electronic materials
Heiderhoff, R., Makris, A., & Riedl, T. (2015) · Materials Science in Semiconductor Processing · doi:10.1016/j.mssp.2015.12.014 · Cited by 32
Dual-Wavelength Laser Flash Raman Spectroscopy Method for In-Situ Measurements of the Thermal Diffusivity: Principle and Experimental Verification
Fan, A., Hu, Y., Ma, W., Wang, H., & Zhang, X. (2019) · Journal of Thermal Science · doi:10.1007/s11630-019-1084-x · Cited by 32
Electro-Thermal Characteristics of Junctionless Nanowire Gate-All-Around Transistors Using Compact Thermal Conductivity Model
Kumar, N., Kumar, S., Kaushik, P. K., Gupta, A. K., & Singh, P. (2023) · IEEE Transactions on Electron Devices · doi:10.1109/ted.2023.3268249 · Cited by 32
Reduced self-heating by strained silicon substrate engineering
O'Neill, A. G., Agaiby, R., Olsen, S. H., Yang, Y., Hellström, P., Östling, M., Oehme, M., Lyutovich, K., Kasper, E., Eneman, G., et al. (2008) · Applied Surface Science · doi:10.1016/j.apsusc.2008.02.172 · Cited by 32
Precise Thermal Characterization of Confined Nanocrystalline Silicon by a 3ω Method
Kihara, T., HARADA, T., & Koshida, N. (2005) · Japanese Journal of Applied Physics · doi:10.1143/jjap.44.4084 · Cited by 31
Optimisation of modulation period of TiO2/Al reactive multilayer films for laser-driven flyer plates
Guo, W., Wu, L., Ningxi, 孟. M., Chen, Y., Ma, Z., Zhou, X., Zhang, W., Shen, R., & Ye, Y. (2018) · Chemical Engineering Journal · doi:10.1016/j.cej.2018.10.175 · Cited by 31
Thermal conductivity and interfacial effect of parylene C thin film using the 3-omega method
Guermoudi, A. A., Cresson, P. Y., Ouldabbes, A., Boussatour, G., & Lasri, T. (2020) · Journal of Thermal Analysis and Calorimetry · doi:10.1007/s10973-020-09612-z · Cited by 31
Thermal phenomena in nanoscale transistors
Pop, E., & Goodson, K. E. (2004) · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · doi:10.1109/itherm.2004.1319147 · Cited by 32

Authors: Yamane, T., Nagai, N., Katayama, S.-I., & Todoki, M.
Affiliations: Toray Research Center, Inc. (Japan) (JP)
ORCID: Nagai, Naoto
Venue: Journal of Applied Physics
Publisher: AIP Publishing
Published: 2002-06-15
Volume: 91
Issue: 12
Pages: 9772-9776
ISSN: 0021-8979 (ISSN-L)
1089-7550
DOI: 10.1063/1.1481958
OpenAlex: W2052807145
Cited by: 367
References: 16
Citations by year: 2026: 10 · 2025: 15 · 2024: 10 · 2023: 18 · 2022: 17 · 2021: 14 · 2020: 30 · 2019: 26 · 2018: 24 · 2017: 22 · 2016: 15 · 2015: 23 · 2014: 25 · 2013: 19 · 2012: 19
FWCI: 3.04
Type: journal article
Language: en
Open access: closed
Locations: Journal of Applied Physics (publishedVersion)
Topics: Physical Sciences › Materials Science › Materials Chemistry › Thermal properties of materials
Physical Sciences › Engineering › Electrical and Electronic Engineering › 3D IC and TSV technologies
Physical Sciences › Engineering › Mechanics of Materials › Thermography and Photoacoustic Techniques
Keywords: thermal conductivity, SiO2 thin films, 3ω method, porosity, film thickness dependence, interfacial thermal resistance, metal/film interface, film-substrate interface, infrared absorption spectroscopy

About these checks

Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.

Statistics and arithmetic are recomputed, not judged.

Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.

What counts as a claim ›How we measure confidence ›How we check this ›

Are you an author, or do you see a problem with this page? Request a review

Measurement of thermal conductivity of silicon dioxide thin films using a 3ω method

Abstract

Overview

Integrity signals

Verification

Claims the paper makes

Claims other papers make about this one

Citations

Cites

Cited by

Related

Metadata

Record

About these checks