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The dynamic competition between stress generation and relaxation mechanisms during coalescence of Volmer–Weber thin films

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Physical Origins of Intrinsic Stresses in Volmer–Weber Thin Films

Floro, J. A., Chason, E., Cammarata, R. C., & Srolovitz, D. J. (2002) · MRS Bulletin · doi:10.1557/mrs2002.15 · Cited by 312

Surface stress model for intrinsic stresses in thin films

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Measurements of stress during vapor deposition of copper and silver thin films and multilayers

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Review Article: Stress in thin films and coatings: Current status, challenges, and prospects

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A practical guide to pulsed laser deposition

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Tutorial: Understanding residual stress in polycrystalline thin films through real-time measurements and physical models

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Grain growth and complex stress evolution during Volmer–Weber growth of polycrystalline thin films

Yu, H. Z., & Thompson, C. V. (2014) · Acta Materialia · doi:10.1016/j.actamat.2013.12.031 · Cited by 169

A kinetic analysis of residual stress evolution in polycrystalline thin films

Chason, E. (2012) · Thin Solid Films · doi:10.1016/j.tsf.2012.11.001 · Cited by 167

In situ stress observation in oxide films and how tensile stress influences oxygen ion conduction

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Origins of residual stress in thin films: Interaction between microstructure and growth kinetics

Engwall, A. M., Rao, Z., & Chason, E. (2016) · Materials & Design · doi:10.1016/j.matdes.2016.07.089 · Cited by 105

A Kinetic Model for Stress Generation in Thin Films Grown from Energetic Vapor Fluxes

Chason, E., Karlson, M., Colin, J. J., Magnfält, D., Sarakinos, K., & Abadias, G. (2016) · Journal of Applied Physics · doi:10.1063/1.4946039 · Cited by 90

Atom insertion into grain boundaries and stress generation in physically vapor deposited films

Magnfält, D., Abadias, G., & Sarakinos, K. (2013) · Applied Physics Letters · doi:10.1063/1.4817669 · Cited by 90

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Peña, T., Chowdhury, S. A., Azizimanesh, A., Sewaket, A., Askari, H., & Wu, S. M. (2021) · 2D Materials · doi:10.1088/2053-1583/ac08f2 · Cited by 85

Volmer-Weber growth stages of polycrystalline metal films probed by in situ and real-time optical diagnostics

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Thin-film coating; historical evolution, conventional deposition technologies, stress-state micro/nano-level measurement/models and prospects projection: a critical review

Mbam, S. O., Nwonu, S. E., Orelaja, O. A., Nwigwe, U. S., & Gou, X. (2019) · Materials Research Express · doi:10.1088/2053-1591/ab52cd · Cited by 76

Compressive intrinsic stress originates in the grain boundaries of dense refractory polycrystalline thin films

Magnfält, D., Fillon, A., Boyd, R. D., Helmersson, U., Sarakinos, K., & Abadias, G. (2016) · Journal of Applied Physics · doi:10.1063/1.4941271 · Cited by 60

Mechanisms of Stress Generation in Thin Films and Coatings

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Understanding Residual Stress in Electrodeposited Cu Thin Films

Chason, E., Engwall, A. M., Pei, F., Lafouresse, M. C., Bertocci, U., Stafford, G. R., Murphy, J., Lenihan, C., & Buckley, D. N. (2013) · Journal of The Electrochemical Society · doi:10.1149/2.048312jes · Cited by 52

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Engwall, A. M., Shin, S. J., Bae, J. H., & Wang, Y. M. (2019) · Surface and Coatings Technology · doi:10.1016/j.surfcoat.2019.02.055 · Cited by 48

Kinetic model for thin film stress including the effect of grain growth

Chason, E., Engwall, A. M., Rao, Z., & Nishimura, T. (2018) · Journal of Applied Physics · doi:10.1063/1.5030740 · Cited by 47

Postcoalescence Evolution of Growth Stress in Polycrystalline Films

González-González, A., Polop, C., & Vasco, E. (2013) · Physical Review Letters · doi:10.1103/physrevlett.110.056101 · Cited by 44

Sputter deposited NbCxNy films: Effect of nitrogen content on structure and mechanical and tribological properties

Zhang, K., Wen, M., Wang, S., Deng, R., Gall, D., & Zheng, W. (2014) · Surface and Coatings Technology · doi:10.1016/j.surfcoat.2014.07.086 · Cited by 43

Nano-scale residual stress depth profiling in Cu/W nano-multilayers as a function of magnetron sputtering pressure

Brandt, L. R., Salvati, E., Bourhis, É. L., Moxham, T., Dolbnya, I. P., & Korsunsky, A. M. (2019) · Surface and Coatings Technology · doi:10.1016/j.surfcoat.2019.125142 · Cited by 43

Correlation of shape changes of grain surfaces and reversible stress evolution during interruptions of polycrystalline film growth

Yu, H. Z., & Thompson, C. V. (2014) · Applied Physics Letters · doi:10.1063/1.4871214 · Cited by 40

Preparation and properties of erbium oxide films deposited by radio frequency magnetron sputtering

Wu, Y., Zhu, S., Liu, T., Li, F., Zhang, Y., Rao, Y., & Zhang, Y. (2014) · Applied Surface Science · doi:10.1016/j.apsusc.2014.04.086 · Cited by 39

Fast and slow stress evolution mechanisms during interruptions of Volmer-Weber growth

Yu, H. Z., Leib, J., Boles, S. T., & Thompson, C. V. (2014) · Journal of Applied Physics · doi:10.1063/1.4863600 · Cited by 37

A deterministic approach to the thermal synthesis and growth of 1D metal oxide nanostructures

Baranov, O., Košiček, M., Filipič, G., & Cvelbar, U. (2021) · Applied Surface Science · doi:10.1016/j.apsusc.2021.150619 · Cited by 35

Kinetics and magnitude of the reversible stress evolution during polycrystalline film growth interruptions

Flötotto, D., Wang, Z. M., Jeurgens, L. P. H., & Mittemeijer, E. J. (2015) · Journal of Applied Physics · doi:10.1063/1.4928162 · Cited by 34

Engineering Stress in Thin Films: An Innovative Pathway Toward 3D Micro and Nanosystems

Truong, T., Nguyen, T., Zhao, H., Nguyen, N., Dinh, T., Park, Y., Nguyen, T., Yamauchi, Y., Nguyen, N., & Phan, H. (2021) · Small · doi:10.1002/smll.202105748 · Cited by 34

Engineering mass transport properties in oxide ionic and mixed ionic-electronic thin film ceramic conductors for energy applications

Garbayo, Í., Baiutti, F., Morata, À., & Tarancón, A. (2018) · Journal of the European Ceramic Society · doi:10.1016/j.jeurceramsoc.2018.09.004 · Cited by 32

Synthesis of thin films and coatings by high power impulse magnetron sputtering

Sarakinos, K., & Martinu, L. (2019) · Elsevier eBooks · doi:10.1016/b978-0-12-812454-3.00013-9 · Cited by 29

A unified kinetic model for stress relaxation and recovery during and after growth interruptions in polycrystalline thin films

Jagtap, P., & Chason, E. (2020) · Acta Materialia · doi:10.1016/j.actamat.2020.04.013 · Cited by 27

Residual Stress in Electrodeposited Cu Thin Films: Understanding the Combined Effects of Growth Rate and Grain Size

Engwall, A. M., Rao, Z., & Chason, E. (2017) · Journal of The Electrochemical Society · doi:10.1149/2.0921713jes · Cited by 26

Kinetics and mechanisms of stress relaxation in sputtered silver thin films

Hérault, Q., Gozhyk, I., Balestrieri, M., Montigaud, H., Grachev, S. Y., & Lazzari, R. (2021) · Acta Materialia · doi:10.1016/j.actamat.2021.117385 · Cited by 26

Understanding and Improving Mechanical Stability in Electrodeposited Cu and Bi for Dynamic Windows Based on Reversible Metal Electrodeposition

McAndrews, G. R., Yeang, A. L., Cai, Y., Barile, C. J., & McGehee, M. D. (2022) · Advanced Energy Materials · doi:10.1002/aenm.202202843 · Cited by 26

Role of atomic migration in nanocrystalline stability: Grain size and thin film stress states

Kapoor, M., & Thompson, G. B. (2014) · Current Opinion in Solid State and Materials Science · doi:10.1016/j.cossms.2014.11.001 · Cited by 26

Growth of patterned island arrays to identify origins of thin film stress

Chason, E., Shin, J.-W., Chen, C.-H., Engwall, A. M., Miller, C., Hearne, S., & Freund, L. B. (2014) · Journal of Applied Physics · doi:10.1063/1.4870051 · Cited by 26

The influence of deposition parameters on the stress evolution of sputter deposited copper

Kaub, T., Rao, Z., Chason, E., & Thompson, G. B. (2018) · Surface and Coatings Technology · doi:10.1016/j.surfcoat.2018.10.059 · Cited by 26

Surface residual stress in amorphous SiO2 insulating layer on Si substrate near a Cu through-silicon via (TSV) investigated by nanoindentation

Kim, H., Jeon, H., Lee, D., & Kim, J. (2021) · Materials Science in Semiconductor Processing · doi:10.1016/j.mssp.2021.106153 · Cited by 23

Effects of oblique-angle deposition on intrinsic stress evolution during polycrystalline film growth

Yu, H. Z., & Thompson, C. V. (2014) · Acta Materialia · doi:10.1016/j.actamat.2014.05.060 · Cited by 23

In-situ high temperature stress analysis of Ti(C,N) coatings on functionally graded cemented carbides by energy dispersive synchrotron X-ray diffraction

Garcia, J. L., Pinto, H. C., Ramos‐Moore, E., Espinoza, C., Östby, J., & Coelho, R. S. (2015) · International Journal of Refractory Metals and Hard Materials · doi:10.1016/j.ijrmhm.2015.12.001 · Cited by 23

Effect of stoichiometric conditions and growth mode on threading dislocations filtering in AlN/c-Al2O3 templates grown by PA MBE

Nechaev, D. V., Koshelev, O. A., Ratnikov, V. V., Brunkov, P. N., Myasoedov, A. V., Sitnikova, A. A., Ivanov, S. V., & Jmerik, V. N. (2019) · Superlattices and Microstructures · doi:10.1016/j.spmi.2019.106368 · Cited by 22

Efficient multi-path heat dissipation of aluminum framework composites assisted with high crystalline carbon coatings

Wang, B., Yan, Y., Lin, J., Cai, Y., Cao, J. H., & Qi, J. (2023) · Carbon · doi:10.1016/j.carbon.2023.118040 · Cited by 21

Depression of critical temperature due to residual strain induced by PLD deposition on YBa2Cu3O7-δ thin films

Favre, S., Ariosa, D., Yelpo, C., Mazini, M., & Faccio, R. (2021) · Materials Chemistry and Physics · doi:10.1016/j.matchemphys.2021.124507 · Cited by 21

Phase stability and in situ growth stresses in Ti/Nb thin films

Wan, L., Yu, X.-X., & Thompson, G. B. (2014) · Acta Materialia · doi:10.1016/j.actamat.2014.07.046 · Cited by 20

Tunable optoelectronic properties of pulsed dc sputter-deposited ZnO:Al thin films: Role of growth angle

Kumar, M., Singh, R., Nandy, S., Ghosh, A., Rath, S., & Som, T. (2016) · Journal of Applied Physics · doi:10.1063/1.4955056 · Cited by 20

Understanding residual stress in thin films: Analyzing wafer curvature measurements for Ag, Cu, Ni, Fe, Ti, and Cr with a kinetic model

Rao, Z., Berman, S. E., Yang, P., Depla, D., & Chason, E. (2021) · Journal of Applied Physics · doi:10.1063/5.0058919 · Cited by 20

Effect of pyrazine in PEDOT:PSS thin films: Structural, optical, optoelectrical, and electrical analysis

Teesetsopon, P., Treewut, P., Sripetch, S., Nasomjai, P., & Tubtimtae, A. (2022) · Optical Materials · doi:10.1016/j.optmat.2023.113465 · Cited by 19

Atomistic view on thin film nucleation and growth by using highly ionized and pulsed vapour fluxes

Sarakinos, K., Magnfält, D., Elofsson, V., & Lü, B. (2014) · Surface and Coatings Technology · doi:10.1016/j.surfcoat.2014.04.015 · Cited by 19

Residual stress development in lattice mismatched epitaxial thin films via atomic and molecular layer depositions

Galib, M., Orhan, O. K., Liu, J., & Ponga, M. R. (2024) · Journal of the Mechanics and Physics of Solids · doi:10.1016/j.jmps.2024.105897 · Cited by 18

Kinetic Monte Carlo simulations of stress and morphology evolution in polycrystalline thin films

Chason, E., & Bower, A. F. (2019) · Journal of Applied Physics · doi:10.1063/1.5085313 · Cited by 18

The effect of Si content on microstructure and mechanical properties of Ti–Al–Ta–Si–N coatings

Shugurov, A. R., Kuzminov, E. D., Garanin, Y. A., Панин, А. В., & Dmitriev, A. I. (2023) · Vacuum · doi:10.1016/j.vacuum.2023.112422 · Cited by 18

Influence of polyimide on thermal stress evolution in polyimide/Cu thick film composite

Li, H., Cheng, G., Xu, G., & Luo, L. (2016) · Journal of Materials Science Materials in Electronics · doi:10.1007/s10854-016-4841-6 · Cited by 18

Electrodeposition of Fe–Ni alloy on Au(111) substrate: Metastable BCC growth via hydrogen evolution and interactions

Lin, Q., Hoglund, E. R., & Zangari, G. (2020) · Electrochimica Acta · doi:10.1016/j.electacta.2020.135876 · Cited by 18

Stress engineering using low oxygen background pressures during Volmer–Weber growth of polycrystalline nickel films

Yu, H. Z., & Thompson, C. V. (2014) · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · doi:10.1116/1.4902957 · Cited by 18

The effect of kinetics on intrinsic stress generation and evolution in sputter-deposited films at conditions of high atomic mobility

Jamnig, A., Pliatsikas, N., Sarakinos, K., & Abadias, G. (2020) · Journal of Applied Physics · doi:10.1063/1.5130148 · Cited by 17

Probing the composition dependence of residual stress distribution in tungsten-titanium nanocrystalline thin films

Sinojiya, R. J., Paulachan, P., Chamasemani, F. F., Bodlos, R., Hammer, R., Zálešák, J., Reisinger, M., Scheiber, D., Kečkéš, J., Romaner, L., et al. (2023) · Communications Materials · doi:10.1038/s43246-023-00339-6 · Cited by 17

Stress evolution during growth of 1-D island arrays: Kinetics and length scaling

Chason, E., Engwall, A. M., Miller, C., Chen, C.-H., Bhandari, A., Soni, S. K., Hearne, S., Freund, L. B., & Sheldon, B. W. (2014) · Scripta Materialia · doi:10.1016/j.scriptamat.2014.10.012 · Cited by 16

Real-time monitoring of stress evolution during thin film growth by in situ substrate curvature measurement

Gilardi, E., Fluri, A., Lippert, T. K., & Pergolesi, D. (2018) · Journal of Applied Physics · doi:10.1063/1.5054092 · Cited by 16

In-Situ Stress Measurements during Cobalt Electrodeposition

Graciano, V. P., Bertocci, U., & Stafford, G. R. (2019) · Journal of The Electrochemical Society · doi:10.1149/2.0311901jes · Cited by 16

Distribution of Nanodomains in Heterogeneous Ni-Superalloys: Effect on Microstructure and Mechanical Deformation

Goodelman, D. C., & Hodge, A. M. (2022) · Acta Materialia · doi:10.1016/j.actamat.2023.118940 · Cited by 15

Effects of residual stress and microstructure on extremely anisotropic grain growth in nanotwinned Cu films

Lin, H.-E., Tran, D.-P., Lin, G.-H., Chuang, H.-J., & Chen, C. (2024) · Materials Characterization · doi:10.1016/j.matchar.2024.113891 · Cited by 15

Controlling surface morphology by nanocrystalline/amorphous competitive self-phase separation in thin films: Thickness-modulated reflectance and interference phenomena

Borroto, A., Bruyère, S., Migot, S., Pierson, J. F., Gries, T., Mücklich, F., & Horwat, D. (2019) · Acta Materialia · doi:10.1016/j.actamat.2019.09.036 · Cited by 15

Relating residual stress to thin film growth processes via a kinetic model and real-time experiments

Chason, E., & Engwall, A. M. (2015) · Thin Solid Films · doi:10.1016/j.tsf.2015.06.061 · Cited by 15

Effect of antimony doping on the structural, optical, and optoelectrical properties of aluminum sulfide thin films synthesized by the electrodeposition method

Menmee, P., Tubtimtae, A., & Wongrat, E. (2023) · Physica B Condensed Matter · doi:10.1016/j.physb.2023.414659 · Cited by 14

Ti segregation in regulating the stress and microstructure evolution in W-Ti nanocrystalline films

Kaub, T., & Thompson, G. B. (2017) · Journal of Applied Physics · doi:10.1063/1.4991880 · Cited by 14

Investigation of the deposition of α-tantalum (110) films on a-plane sapphire substrate by molecular beam epitaxy for superconducting circuit

Jia, H., Zhou, B., Wang, T., Wu, Y., Yang, L., Ding, Z., Li, S., Cai, X., Xiong, K., & Feng, J. (2023) · Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena · doi:10.1116/6.0002886 · Cited by 13

Inter-Relationship of Stress and Microstructure in BCC and 'Beta' Tungsten Films

Johnson, J. A., Su, T., Chason, E., & Thompson, G. B. (2022) · Surface and Coatings Technology · doi:10.1016/j.surfcoat.2023.129336 · Cited by 13

Stress and Refractive Index Control of SiO2 Thin Films for Suspended Waveguides

Wostbrock, N., & Busani, T. (2020) · Nanomaterials · doi:10.3390/nano10112105 · Cited by 12

Effect of pH treatment on the structural and optical properties of Sn6Sb10S21 thin films facilely synthesized using a spin coating method

Warunee, K., Sawanthai, K., Tubtimtae, A., & Ponhan, W. (2020) · Optical Materials · doi:10.1016/j.optmat.2020.109917 · Cited by 12

Stress control in thick AlN/ c- Al 2 O 3 templates grown by plasma-assisted molecular beam epitaxy

Koshelev, O. A., Nechaev, D. V., Brunkov, P. N., Ivanov, S. V., & Jmerik, V. N. (2020) · Semiconductor Science and Technology · doi:10.1088/1361-6641/abd63d · Cited by 12

Effects of deposition temperature on the wear behavior and material properties of plasma enhanced atomic layer deposition (PEALD) titanium vanadium nitride thin films

Meter, K. E. V., Chowdhury, M. I., Sowa, M. J., Kozen, A. C., Grejtak, T., Babuska, T. F., Strandwitz, N. C., & Krick, B. A. (2023) · Wear · doi:10.1016/j.wear.2023.204731 · Cited by 11

A case study of thin film stress evolution at a dissimilar material interface via molecular dynamics simulations

Al, M., & Webb, E. B. (2018) · Nanomaterials and Nanotechnology · doi:10.1177/1847980418778427 · Cited by 11

Role of solute in stress development of nanocrystalline films during heating: An in situ synchrotron X-ray diffraction study

Wang, J., Li, X., Maawad, E., Han, L., Huang, Y., Liu, Y., & Wang, Z. (2022) · Journal of Material Science and Technology · doi:10.1016/j.jmst.2022.10.025 · Cited by 9

Microstructure evolution and reactive diffusion behavior of highly dense TiNi alloy prepared from Ti2Ni and TiNi3 intermetallic compound powders

Li, X., Ying, L., Liu, C., Lu, W., & Ruoshan, L. (2023) · Materials Today Communications · doi:10.1016/j.mtcomm.2023.106526 · Cited by 9

Thermally conductive bidirectional carbon structure enhanced heat-dissipative aluminum framework composites

Yan, Y., Wang, B., Li, P., Qin, B., Ye, Z., Xia, Y. M., Zhang, Z., Wang, Z., Li, Y., Zheng, X., et al. (2025) · Transactions of Materials Research · doi:10.1016/j.tramat.2025.100038 · Cited by 9

Effect of Ar ion-plasma treatment on residual stress in thin Cr films

Babushkin, A. S., Selyukov, R. V., & Amirov, I. I. (2019) · International Conference on Micro- and Nano-Electronics (ICMNE) · doi:10.1117/12.2521617 · Cited by 9

Tuning Stress in Cu Thin Films by Developing Highly (111)-Oriented Nanotwinned Structure

Wang, I.-J., Ku, C., Lam, T., Huang, E., Tu, K. N., & Chen, C. (2019) · Journal of Electronic Materials · doi:10.1007/s11664-019-07742-1 · Cited by 8

Investigation for the Structural Stress of SiO2 Thin Films and Its Distribution on the Large-Wafer Created by Plasma Enhanced Chemical Vapor Deposition

Sun, D., Sun, Q., Xing, W., Sun, Z., Shang, H., Chang, L., Wang, X., Liu, P., & Hall, T. (2018) · AIP Advances · doi:10.1063/1.5045516 · Cited by 7

Substrate and thickness influence on YBa$$_2$$Cu$$_3$$O$$_{7-\delta }$$ thin films grown by PLD deposition

Mazini, M., Favre, S., Ariosa, D., & Faccio, R. (2022) · Applied Physics A · doi:10.1007/s00339-022-06202-8 · Cited by 7

In-situ monitoring of stress evolution in high power impulse magnetron sputtering-deposited Ti-Al-N films: Effect of substrate bias and temperature

Ávila, P. R. T., Zabeida, O., Varela, L. B., Klemberg-Sapieha, J. E., & Martinu, L. (2023) · Thin Solid Films · doi:10.1016/j.tsf.2023.140069 · Cited by 7

Thickness effect on the structural and electrical properties of poly-SiGe films

Asafa, T. B., Witvrouw, A., Schneider, D., Moussa, A., Tabet, N., & Said, S. A. M. (2013) · Materials Research Bulletin · doi:10.1016/j.materresbull.2013.08.054 · Cited by 7

The critical role of substrate bias for the sputter deposition of molybdenum thin films

Choi, D. (2019) · Microelectronic Engineering · doi:10.1016/j.mee.2019.111084 · Cited by 6

Experimental identification of thermal induced warpage in polymer–metal composite films

Li, H., Zhu, C., Xu, G., & Luo, L. (2016) · Microelectronics Reliability · doi:10.1016/j.microrel.2016.03.023 · Cited by 6

Stress Measurement in Thin Films Using Wafer Curvature: Principles and Applications

Chason, E. (2018) · Springer eBooks · doi:10.1007/978-981-10-6855-3_49-1 · Cited by 6

Effect of electroplating current density and post-annealing on the warpage and reliability of redistribution layer for advanced semiconductor package

Kim, T.-H., Baek, J.-H., Kim, S.-I., Kim, T., Shim, J.-H., & Kim, H. (2025) · Materials & Design · doi:10.1016/j.matdes.2025.114732 · Cited by 5

Dynamic Stress Analysis Applied to the Electrodeposition of Copper

Lafouresse, M. C., Bertocci, U., & Stafford, G. R. (2014) · Journal of The Electrochemical Society · doi:10.1149/2.0261501jes · Cited by 5

Effect of grain size on thin film stress and morphology using kinetic Monte Carlo simulations

Chason, E., & Jagtap, P. (2020) · Journal of Applied Physics · doi:10.1063/5.0023081 · Cited by 5

Strain depth profiles in thin films extracted from in-plane X-ray diffraction

Cancellieri, C., Ariosa, D., Druzhinin, A. V., Unutulmazsoy, Y., Neels, A., & Jeurgens, L. P. H. (2020) · Journal of Applied Crystallography · doi:10.1107/s1600576720014843 · Cited by 5

Model for stress evolution during the early stages of non-energetic thin film growth

Su, T., & Chason, E. (2025) · Acta Materialia · doi:10.1016/j.actamat.2025.121534 · Cited by 4

Mutual control of critical temperature, residual resistance ratio, stress, and roughness for sputtered Nb films

Zikiy, E. V., Stepanov, I. A., Bukatin, S. V., Baklykov, D. A., Teleganov, M., Krivko, E. A., Smirnov, N. S., Ryzhikov, I. A., Бычков, С. П., Kotenkov, S. A., et al. (2025) · Surfaces and Interfaces · doi:10.1016/j.surfin.2025.107266 · Cited by 4

Vertical strain tuning and perpendicular magnetic anisotropy in La0.5Ca0.5MnO3 vertically aligned nanostructured thin films by the application of high magnetic fields

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