The DOI matches its Crossref record; 8 of the 8 references it cites were found in a registry or an index.
Effects of surface roughness and oxide layer on the thermal boundary conductance at aluminum/silicon interfaces
Abstract
In nanosystems, the primary scattering mechanisms occur at the interfaces between the material layers. As such, the structure and composition around these interfaces can affect scattering rates and, therefore, thermal resistances. In this work, we measure the room-temperature thermal boundary conductance of aluminum films grown on silicon substrates subjected to various pre-Al-deposition surface treatments with a pump-probe thermoreflectance technique. The Si surfaces are characterized with atomic force microscopy to determine mean surface roughness. The measured thermal boundary conductances decrease as Si surface roughness increases. In addition, stripping of the native oxide layer from the surface of the Si substrate immediately prior to Al film deposition causes the thermal boundary conductance to increase. The measured data are compared to an extension of the diffuse mismatch model that accounts for interfacial mixing and structure around the interface in order to better elucidate the thermal scattering processes affecting thermal boundary conductance at rough interfaces.
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Cites
Analysis of heat flow in layered structures for time-domain thermoreflectance
Cahill, D. G. (2004) · Review of Scientific Instruments · doi:10.1063/1.1819431 · Cited by 1,543
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Thermometry and Thermal Transport in Micro/Nanoscale Solid-State Devices and Structures
Cahill, D. G., Goodson, K., & Majumdar, A. (2002) · Journal of Heat Transfer · doi:10.1115/1.1454111 · Cited by 611
Coherent Phonon Generation and Detection by Picosecond Light Pulses
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Thermal conductance of interfaces between highly dissimilar materials
Lyeo, H.-K., & Cahill, D. G. (2006) · Physical Review B · doi:10.1103/physrevb.73.144301 · Cited by 576
Thermal resistance at interfaces
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Thermal conductivity of epitaxial layers of dilute SiGe alloys
Cahill, D. G., Watanabe, F., Rockett, A., & Vining, C. B. (2005) · Physical Review B · doi:10.1103/physrevb.71.235202 · Cited by 67
Cited by
Effects of chemical bonding on heat transport across interfaces
Losego, M. D., Grady, M. E., Sottos, N. R., Cahill, D. G., & Braun, P. V. (2012) · Nature Materials · doi:10.1038/nmat3303 · Cited by 701
Hopkins, P. E. (2013) · ISRN Mechanical Engineering · doi:10.1155/2013/682586 · Cited by 302
Self-citationThermal Boundary Conductance: A Materials Science Perspective
Monachon, C., Weber, L., & Dames, C. (2016) · Annual Review of Materials Research · doi:10.1146/annurev-matsci-070115-031719 · Cited by 284
Nanoscale heat transfer – from computation to experiment
Luo, T., & Chen, G. (2013) · Physical Chemistry Chemical Physics · doi:10.1039/c2cp43771f · Cited by 273
Manipulating Thermal Conductance at Metal–Graphene Contacts via Chemical Functionalization
Hopkins, P. E., Baraket, M., Barnat, E. V., Beechem, T. E., Kearney, S. P., Duda, J. C., Robinson, J. T., & Walton, S. G. (2012) · Nano Letters · doi:10.1021/nl203060j · Cited by 265
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Metadata
- Authors
- Hopkins, P. E., Phinney, L. M., Serrano, J. R., & Beechem, T. E.
- Venue
- Physical Review B
- Publisher
- American Physical Society (APS)
- Published
- 2010-08-05
- Volume
- 82
- Issue
- 8
- ISSN
- 1098-0121 (ISSN-L)
- 1550-235X
- OpenAlex
- W2068798373
- Cited by
- 201
- References
- 8
- FWCI
- 5.41
- Type
- journal article
- Language
- en
- Open access
- closed
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