The DOI matches its Crossref record; 20 of the 24 references it cites were found in a registry or an index.
A silicon-based, three-dimensional neural interface: manufacturing processes for an intracortical electrode array
Abstract
A method has been developed for the manufacture of a "three-dimensional" electrode array geometry for chronic intracortical stimulation. This silicon based array consists of a 4.2 x 4.2 x 0.12 mm thick monocrystalline substrate, from which project 100 conductive, silicon needles sharpened to facilitate cortical penetration. Each needle is electrically isolated from the other needles, and is about 0.09 mm thick at its base and 1.5 mm long. The sharpened end of each needle is coated with platinum to facilitate charge transfer into neural tissue. The following manufacturing processes were used to create this array. 1) Thermomigration of 100 aluminum pads through an n-type silicon block. This creates trails of highly conductive p+ silicon isolated from each other by opposing pn junctions. 2) A combination of mechanical and chemical micromachining which creates individual penetrating needles of the p+ silicon trails. 3) Metal deposition to create active electrode areas and electrical contact pads. 4) Array encapsulation with polyimide. The geometrical, mechanical, and electrical properties of these arrays should make them well suited as interfaces to cortical tissue.
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“Current state-of-the-art silicon-based in vivo systems do not commonly feature more than hundreds of electrodes (Campbell et al. 1991), with recent improvements bringing this number closer to one thousand (Shobe et al. 2015; Scholvin et al. 2016; Buszáki et al. 2015), even on a single probe (Jun et al. 2017).”
From Realizing flexible bioelectronic medicines for accessing the peripheral nerves – technology considerations (2018) · cites this paper as Campbell et al. 1991
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Cites
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Metadata
- Authors
- Campbell, P. K., Jones, K. E., Huber, R. J., Horch, K. W., & Normann, R. A.
- Affiliations
- University of Utah (US)
- Venue
- IEEE Transactions on Biomedical Engineering
- Published
- 1991
- Volume
- 38
- Issue
- 8
- Pages
- 758-768
- ISSN
- 0018-9294 (ISSN-L)
- OpenAlex
- W2111937020
- Cited by
- 881
- References
- 24
- Citations by year
- 2026: 21 · 2025: 29 · 2024: 41 · 2023: 24 · 2022: 35 · 2021: 32 · 2020: 40 · 2019: 39 · 2018: 34 · 2017: 41 · 2016: 36 · 2015: 41 · 2014: 43 · 2013: 56 · 2012: 41
- FWCI
- 1.70
- Type
- journal article
- Language
- en
- Open access
- closed
- Locations
- IEEE Transactions on Biomedical Engineering (publishedVersion)
- PubMed (publishedVersion)
- Topics
- Life Sciences › Neuroscience › Cellular and Molecular Neuroscience › Neuroscience and Neural Engineering
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Analog and Mixed-Signal Circuit Design
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Advanced MEMS and NEMS Technologies
- Keywords
- neural interfaces, thermomigration, p+ silicon, micromachining, platinum coating, polyimide encapsulation, monocrystalline silicon substrate, galvanic isolation
- MeSH terms
- Animals, Biocompatible Materials, Cats, Electric Conductivity, Electric Stimulation, Electrodes, Implanted, Materials Testing, Microscopy, Electron, Scanning, Silicon, Somatosensory Cortex, Reproducibility of Results
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