Long-Term Reliability Evaluation of Power Modules With Low Amplitude Thermomechanical Stresses and Initial Defects
Abstract
In renewable energy and grid applications, solder-attached power modules are subject to fatigue stress cycles of low amplitudes, but the devices will be in service for decades. This article aims to understand the slow aging process by focusing on the initial defects and their growth under the stress cycles of concern. A finite-element analysis (FEA) is performed to obtain the thermomechanical stress distribution around the defects, which is combined with the solder material’s property to give a lifetime model. Effort is made to validate the model by power cycling plus microscale computed tomography (CT) scanning. It is found that a void in the solder layer may first transform into a crack on the material boundary, which then grows progressively more rapidly until device failure. A numerical example is shown for evaluating the lifetime of an IGBT power module in a “soft-open-point” (SOP) converter designed for an 11-kV power network.
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CTE mismatch at die attachment solder can increase the junction-to-case thermal resistance and change transient thermal response.
“CTE mismatch at die attachment solder can increase the junction-to-case thermal resistance and change transient thermal response [45], [46].”
From AC Power Cycling Test Setup and Condition Monitoring Tools for SiC-Based Traction Inverters (2023) · cites this paper as [45]
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AC Power Cycling Test Setup and Condition Monitoring Tools for SiC-Based Traction Inverters
Farhadi, M., Vankayalapati, B. T., Sajadi, R., & Akin, B. (2023) · IEEE Transactions on Vehicular Technology · doi:10.1109/tvt.2023.3271251 · Cited by 24 · see citing works
“CTE mismatch at die attachment solder can increase the junction-to-case thermal resistance and change transient thermal response [45], [46].”
Background
- Authors
- Hu, B., Konaklieva, S., Kourra, N., Williams, M. A., Ran, L., & Lai, W.
- Affiliations
- Chongqing University (CN)
- University of Warwick (GB)
- Venue
- IEEE Journal of Emerging and Selected Topics in Power Electronics
- Published
- 2021-02
- Volume
- 9
- Issue
- 1
- Pages
- 602-615
- ISSN
- 2168-6777 (ISSN-L)
- 2168-6785
- OpenAlex
- W2996287315
- Cited by
- 46
- References
- 30
- Citations by year
- 2026: 3 · 2025: 8 · 2024: 9 · 2023: 12 · 2022: 8 · 2021: 4 · 2020: 2
- FWCI
- 1.26
- Type
- journal article
- Language
- en
- Open access
- closed
- Licence
- Locations
- IEEE Journal of Emerging and Selected Topics in Power Electronics (publishedVersion)
- Cambridge University Engineering Department Publications Database (submittedVersion)
- Funders
- National Key Research and Development Project of China (2018YFB0905800)
- National Natural Science Foundation of China (51761135014, 51707024)
- Graduate Scientific Research and Innovation Foundation of Chongqing (CYB17008)
- UK EPSRC (EP/P009743/1)
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Silicon Carbide Semiconductor Technologies
- Physical Sciences › Engineering › Mechanics of Materials › Fatigue and fracture mechanics
- Keywords
- power module reliability, thermomechanical fatigue, soldering defects, void growth, crack propagation, lifetime modeling, IGBT modules
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