Condition Monitoring for Device Reliability in Power Electronic Converters: A Review
Open accessAbstract
Condition monitoring (CM) has already been proven to be a cost effective means of enhancing reliability and improving customer service in power equipment, such as transformers and rotating electrical machinery. CM for power semiconductor devices in power electronic converters is at a more embryonic stage; however, as progress is made in understanding semiconductor device failure modes, appropriate sensor technologies, and signal processing techniques, this situation will rapidly improve. This technical review is carried out with the aim of describing the current state of the art in CM research for power electronics. Reliability models for power electronics, including dominant failure mechanisms of devices are described first. This is followed by a description of recently proposed CM techniques. The benefits and limitations of these techniques are then discussed. It is intended that this review will provide the basis for future developments in power electronics CM.
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Power semiconductor device damages account for approximately 35% of all ASD faults.
“According to [238], [239], power semiconductor device damages account for approximately 35% of all ASD faults.”
From Fault Diagnosis and Fault-Tolerant Control of PMSM Drives–State of the Art and Future Challenges (2022) · cites this paper as [238]
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An Industry-Based Survey of Reliability in Power Electronic Converters
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Self-citationPower Electronics Converters for Wind Turbine Systems
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Transitioning to Physics-of-Failure as a Reliability Driver in Power Electronics
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Self-citationA Digital Twin Approach for Fault Diagnosis in Distributed Photovoltaic Systems
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Design for reliability of power electronic systems
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A Digital Twin Based Estimation Method for Health Indicators of DC–DC Converters
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A New Approach for Real-Time Multiple Open-Circuit Fault Diagnosis in Voltage-Source Inverters
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Fault Diagnosis and Fault-Tolerant Control of PMSM Drives–State of the Art and Future Challenges
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“According to [238], [239], power semiconductor device damages account for approximately 35% of all ASD faults.”
BackgroundA Review of the Condition Monitoring of Capacitors in Power Electronic Converters
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Open-Circuit Fault Diagnosis in PMSG Drives for Wind Turbine Applications
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Recent advances in prognostics and health management for advanced manufacturing paradigms
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Reliability Improvement of a T-Type Three-Level Inverter With Fault-Tolerant Control Strategy
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Overview of Real-Time Lifetime Prediction and Extension for SiC Power Converters
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An Overview of Condition Monitoring Techniques for Capacitors in DC-Link Applications
Zhao, Z., Davari, P., Lu, W., Wang, H., & Blaabjerg, F. (2020) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2020.3023469 · Cited by 253 · see citing works
Open-Circuit Fault Diagnosis and Fault-Tolerant Control for a Grid-Connected NPC Inverter
Choi, U., Lee, J.-S., Blaabjerg, F., & Lee, K. (2015) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2015.2510224 · Cited by 252 · see citing works
Choi, U., Blaabjerg, F., & Jorgensen, S. (2017) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2017.2690500 · Cited by 249 · see citing works
A Review on IGBT Module Failure Modes and Lifetime Testing
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Investigation Into IGBT dV/dt During Turn-Off and Its Temperature Dependence
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Self-citationSmet, V., Forest, F., Huselstein, J.-J., Rashed, A., & Richardeau, F. (2013) · IEEE Transactions on Industrial Electronics · doi:10.1109/tie.2012.2196894 · Cited by 232 · see citing works
Catastrophic failure and fault-tolerant design of IGBT power electronic converters - an overview
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Improved Reliability of Power Modules: A Review of Online Junction Temperature Measurement Methods
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Design Optimization of Transformerless Grid-Connected PV Inverters Including Reliability
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Catalán, P., Wang, Y., Arza, J., & Chen, Z. (2023) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2023.3234221 · Cited by 201 · see citing works
Advanced Accelerated Power Cycling Test for Reliability Investigation of Power Device Modules
Choi, U.-M., Joergensen, S., & Blaabjerg, F. (2016) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2016.2521899 · Cited by 200 · see citing works
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Monitoring Solder Fatigue in a Power Module Using Case-Above-Ambient Temperature Rise
Xiang, D., Ran, L., Tavner, P., Bryant, A. T., Yang, S., & Mawby, P. (2011) · IEEE Transactions on Industry Applications · doi:10.1109/tia.2011.2168556 · Cited by 193 · see citing works
Self-citationAn avalanche-and-surge robust ultrawide-bandgap heterojunction for power electronics
Zhou, F., Gong, H., Xiao, M., Ma, Y., Wang, Z., Yu, X., Li, L., Fu, L., Tan, H. H., Yang, Y. T., et al. (2023) · Nature Communications · doi:10.1038/s41467-023-40194-0 · Cited by 195 · see citing works
Gou, B., Ge, X., Wang, S., Feng, X., Kuo, J. B., & Habetler, T. G. (2015) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2015.2465299 · Cited by 191 · see citing works
State Detection of Bond Wires in IGBT Modules Using Eddy Current Pulsed Thermography
Li, K., Tian, G. Y., Cheng, L., Yin, A., Cao, W., & Crichton, S. O. J. (2014) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2013.2288334 · Cited by 189 · see citing works
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Wu, F., & Zhao, J. (2015) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2015.2422131 · Cited by 182 · see citing works
Application of Kalman Filter to Estimate Junction Temperature in IGBT Power Modules
Eleffendi, M. A., & Johnson, C. M. (2015) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2015.2418711 · Cited by 176 · see citing works
Condition Monitoring Power Module Solder Fatigue Using Inverter Harmonic Identification
Xiang, D., Ran, L., Tavner, P., Yang, S., Bryant, A. T., & Mawby, P. (2011) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2011.2160988 · Cited by 174 · see citing works
Self-citationReal-Time Measurement of Temperature Sensitive Electrical Parameters in SiC Power MOSFETs
Griffo, A., Wang, J., Colombage, K., & Kamel, T. (2018) · IEEE Transactions on Industrial Electronics · doi:10.1109/tie.2017.2739687 · Cited by 175 · see citing works
Caseiro, L. M. A., & Mendes, A. M. S. (2014) · IEEE Transactions on Industrial Electronics · doi:10.1109/tie.2014.2341558 · Cited by 171 · see citing works
Musallam, M., Yin, C., Bailey, C., & Johnson, M. (2015) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2014.2358555 · Cited by 168 · see citing works
Freire, N. M. A., Estima, J. O., & Cardoso, A. J. M. (2013) · IEEE Transactions on Industrial Electronics · doi:10.1109/tie.2013.2279383 · Cited by 167 · see citing works
Düşmez, S., Duran, H., & Akin, B. (2016) · IEEE Transactions on Industry Applications · doi:10.1109/tia.2016.2518127 · Cited by 167 · see citing works
An industry-based survey of reliability in power electronic converters
Yang, S., Bryant, A. T., Mawby, P., Xiang, D., Ran, L., & Tavner, P. J. (2009) · IEEE Energy Conversion Congress and Exposition (ECCE) · doi:10.1109/ecce.2009.5316356 · Cited by 161 · see citing works
Self-citationOptimal Control of Traction Motor Drives Under Electrothermal Constraints
Lemmens, J., Vanassche, P., & Driesen, J. (2014) · IEEE Journal of Emerging and Selected Topics in Power Electronics · doi:10.1109/jestpe.2014.2299765 · Cited by 158 · see citing works
Ji, B., Song, X., Sciberras, E. A., Cao, W., Hu, Y., & Pickert, V. (2014) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2014.2365531 · Cited by 149 · see citing works
Power electronics - the key technology for renewable energy system integration
Blaabjerg, F., Yang, Y., Ma, K., & Wang, X. (2015) · 2015 International Conference on Renewable Energy Research and Applications (ICRERA) · doi:10.1109/icrera.2015.7418680 · Cited by 148 · see citing works
An Investigation of Temperature-Sensitive Electrical Parameters for SiC Power MOSFETs
Gonzalez, J. A. O., Alatise, O. M., Ji, H., Ran, L., & Mawby, P. (2016) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2016.2631447 · Cited by 148 · see citing works
Self-citationReal-Time Aging Monitoring for IGBT Modules Using Case Temperature
Wang, Z., Tian, B., Qiao, W., & Qu, L. (2015) · IEEE Transactions on Industrial Electronics · doi:10.1109/tie.2015.2497665 · Cited by 145 · see citing works
Toward Physics-Informed Machine-Learning-Based Predictive Maintenance for Power Converters—A Review
Fassi, Y., Heiries, V., Boutet, J., & Boisseau, S. (2023) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2023.3328438 · Cited by 150 · see citing works
Xu, Z., Xu, F., & Wang, F. (2014) · IEEE Transactions on Industrial Electronics · doi:10.1109/tie.2014.2374575 · Cited by 142 · see citing works
Design for Reliability of Power Electronics for Grid-Connected Photovoltaic Systems
Yang, Y., Sangwongwanich, A., & Blaabjerg, F. (2016) · CPSS Transactions on Power Electronics and Applications · doi:10.24295/cpsstpea.2016.00009 · Cited by 140 · see citing works
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Low Stress Cycle Effect in IGBT Power Module Die-Attach Lifetime Modeling
Lai, W., Chen, M., Ran, L., Alatise, O. M., Xu, S., & Mawby, P. (2015) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2015.2501540 · Cited by 134 · see citing works
Self-citationOnline Condition Monitoring of Power MOSFET Gate Oxide Degradation Based on Miller Platform Voltage
Ye, X., Chen, C., Wang, Y., Zhai, G., & Vachtsevanos, G. (2016) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2016.2602323 · Cited by 129 · see citing works
Aging Mechanisms and Accelerated Lifetime Tests for SiC MOSFETs: An Overview
Pu, S., Yang, F., Vankayalapati, B. T., & Akin, B. (2021) · IEEE Journal of Emerging and Selected Topics in Power Electronics · doi:10.1109/jestpe.2021.3110476 · Cited by 129 · see citing works
Gong, W., Chen, H., Zhang, Z., Zhang, M., & Gao, H. (2020) · IEEE Access · doi:10.1109/access.2020.2988323 · Cited by 126 · see citing works
Time-Series Classification Methods: Review and Applications to Power Systems Data
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Rainflow Algorithm-Based Lifetime Estimation of Power Semiconductors in Utility Applications
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A New Complete Condition Monitoring Method for SiC Power MOSFETs
Ugur, E., Xu, C., Yang, F., Pu, S., & Akin, B. (2021) · IEEE Transactions on Industrial Electronics · doi:10.1109/tie.2020.2970668 · Cited by 126 · see citing works
Improving Power Converter Reliability: Online Monitoring of High-Power IGBT Modules
Ghimire, P., de Vega, A. R., Bęczkowski, S., Rannestad, B., Munk‐Nielsen, S., & Thøgersen, P. (2014) · IEEE Industrial Electronics Magazine · doi:10.1109/mie.2014.2311829 · Cited by 123 · see citing works
Xu, S., Huang, W., Wang, H., Zheng, W. X., Wang, J., Chai, Y., & Ma, M. (2022) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2022.3200721 · Cited by 121 · see citing works
Power electronics and reliability in renewable energy systems
Blaabjerg, F., Ma, K., & Zhou, D. (2012) · IEEE International Symposium on Industrial Electronics (ISIE) · doi:10.1109/isie.2012.6237053 · Cited by 120 · see citing works
Recent advances in fault diagnosis by Park's vector approach
Estima, J. O., Freire, N. M. A., & Cardoso, A. J. M. (2013) · IEEE Workshop on Electrical Machines Design, Control and Diagnosis · doi:10.1109/wemdcd.2013.6525187 · Cited by 120 · see citing works
Smart Inverters for Microgrid Applications: A Review
Arbab-Zavar, B., García, E. J., Vásquez, J. C., & Guerrero, J. M. (2019) · Energies · doi:10.3390/en12050840 · Cited by 120 · see citing works
Yang, C., Gui, W., Chen, Z., Zhang, J., Peng, T., Yang, C., Karimi, H. R., & Ding, S. X. (2019) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2019.2924487 · Cited by 118 · see citing works
Recent Advances in Fault Diagnosis Techniques for Photovoltaic Systems: A Critical Review
Yang, B. F., Zheng, R., Han, Y., Huang, J., Li, M., Shu, H., Shi, S., & Guo, Z. (2024) · Protection and Control of Modern Power Systems · doi:10.23919/pcmp.2023.000583 · Cited by 118 · see citing works
Integrated Multiple-Output Synchronous Buck Converter for Electric Vehicle Power Supply
Chen, G., Deng, Y., Dong, J., Hu, Y., Jiang, L., & He, X. (2016) · IEEE Transactions on Vehicular Technology · doi:10.1109/tvt.2016.2633068 · Cited by 117 · see citing works
A Fault-Tolerant Direct Controlled PMSG Drive for Wind Energy Conversion Systems
Freire, N. M. A., & Cardoso, A. J. M. (2013) · IEEE Transactions on Industrial Electronics · doi:10.1109/tie.2013.2251734 · Cited by 116 · see citing works
Düşmez, S., Ali, S. H., Heydarzadeh, M., Kamath, A. S., Duran, H., & Akin, B. (2016) · IEEE Transactions on Industry Applications · doi:10.1109/tia.2016.2603144 · Cited by 113 · see citing works
Lai, W., Chen, M., Ran, L., Xu, S., Jiang, N., Wang, X., Alatise, O. M., & Mawby, P. (2016) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2016.2546944 · Cited by 112 · see citing works
Self-citationStudy of Bonding Wire Failure Effects on External Measurable Signals of IGBT Module
Kexin, W., Du, M., Linlin, X., & Li, J. (2012) · IEEE Transactions on Device and Materials Reliability · doi:10.1109/tdmr.2012.2200485 · Cited by 110 · see citing works
Power Routing for Cascaded H-Bridge Converters
Ko, Y., Andresen, M., Buticchi, G., & Liserre, M. (2017) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2017.2658182 · Cited by 110 · see citing works
A Current-Sensorless Online ESR and C Identification Method for Output Capacitor of Buck Converter
Yao, K., Tang, W., Hu, W., & Lyu, J. (2014) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2014.2383436 · Cited by 109 · see citing works
Aldaco, S. E. D. L., Calleja, H., Chan, F., & Jiménez-Grajales, H. R. (2012) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2012.2222673 · Cited by 109 · see citing works
In-Service Diagnostics for Wire-Bond Lift-off and Solder Fatigue of Power Semiconductor Packages
Eleffendi, M. A., & Johnson, C. M. (2017) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2016.2628705 · Cited by 108 · see citing works
Hang, J., Shu, X., Ding, S., & Huang, Y. (2023) · IEEE Transactions on Industrial Electronics · doi:10.1109/tie.2022.3231304 · Cited by 108 · see citing works
Condition Monitoring: A Decade of Proposed Techniques
Avenas, Y., Dupont, L., Baker, N., Zara, H., & Barruel, F. (2015) · IEEE Industrial Electronics Magazine · doi:10.1109/mie.2015.2481564 · Cited by 107 · see citing works
Reliability assessment of wind turbine bearing based on the degradation-Hidden-Markov model
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Power Electronic Devices in the Future
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Fault Prognosis for Power Electronics Systems Using Adaptive Parameter Identification
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A VEN Condition Monitoring Method of DC-Link Capacitors for Power Converters
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Design for Reliability of Power Electronic Systems
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- Authors
- Yang, S., Xiang, D., Bryant, A., Mawby, P., Ran, L., & Tavner, P.
- Affiliations
- University of Warwick (GB)
- Durham University (GB)
- Venue
- IEEE Transactions on Power Electronics
- Published
- 2010-11
- Volume
- 25
- Issue
- 11
- Pages
- 2734-2752
- ISSN
- 0885-8993 (ISSN-L)
- 1941-0107
- OpenAlex
- W2167320299
- Cited by
- 1,278
- References
- 135
- Citations by year
- 2026: 65 · 2025: 104 · 2024: 105 · 2023: 137 · 2022: 93 · 2021: 104 · 2020: 93 · 2019: 109 · 2018: 94 · 2017: 79 · 2016: 80 · 2015: 63 · 2014: 60 · 2013: 49 · 2012: 22
- FWCI
- 22.95
- Type
- journal article
- Language
- en
- Open access
- Licence
- Locations
- IEEE Transactions on Power Electronics (publishedVersion)
- Durham Research Online (Durham University) (acceptedVersion)
- Durham Research Online (Durham University) (submittedVersion, cc-by)
- Funders
- Engineering and Physical Sciences Research Council (EP/E02744X/1, EP/E026923/1)
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Silicon Carbide Semiconductor Technologies
- Physical Sciences › Engineering › Safety, Risk, Reliability and Quality › Reliability and Maintenance Optimization
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Multilevel Inverters and Converters
- Keywords
- condition monitoring, power semiconductor devices, power converters, device reliability, failure mechanisms, reliability modeling, sensor technology, signal processing, power electronics reliability
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Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
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