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Hot-Electron Trapping and Hole-Induced Detrapping in GaN-Based GITs and HD-GITs
Abstract
This paper investigates the trapping mechanisms in gate-injection transistors (GITs) without and with a pdrain electrode, referred to as GITs and Hybrid-Drain-embedded GITs (HD-GITs), respectively, used to inject holes and reduce charge trapping effects. We compare the two sets of devices under both the OFF-state and semi-ON state, to investigate the role of hot electrons in favoring the charge trapping. The analysis is based on combined pulsed characterization, transient measurements, and electroluminescence (EL) characterization. We demonstrate the following relevant results: 1) GITs and HD-GITs have comparable and negligible dynamic RONwhen trapping is induced in the OFF-state; under semi-ON state conditions, GITs suffer from significant dynamic RON, while HD-GITs show no additional trapping with respect to OFF-state; 2) EL characterization carried out until VDS= 500 V in semi-ON conditions shows comparable features, suggesting that the electric field and hot-carrier density are similar in GITs and HD-GITs. This result indicates that the hot-electron trapping rate is identical for the two sets of samples, so the difference observed in dynamic RONmust be ascribed to a different detrapping rate; 3) transient RONmeasurements indicate that the traps filled in the OFF-state conditions are the same as those filled by hot electrons in semi-ON, with Ea= 0.8 eV (possibly CN); and 4) EL analysis under constant bias indicates that in GITs there is a time-dependent increase in the luminescence signal at the drain terminal, when the devices are biased with VDS = 300 V. Such effect, indicative of hot-electron trapping, is not observed in HD-GITs. Based on the experimental evidence collected within this paper, we conclude that-in the semi-ON state-the main difference between GITs and HD-GITs consists in a faster detrapping rate of hot electrons, achieved through hole injection from the pdrain terminal.
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Fabris et al. carried out experiments showing ON-resistance behavior for different drain quiescent biases in OFF-state and semi-on state operation, exploring the effectiveness of the hybrid-drain approach.
“The effectiveness of this approach has been explored by Fabris et al. [36], by carrying out a set of experiments that highlighted the ON-resistance behavior for different drain quiescent biases (QBs) in OFF-state and semi-on state operation.”
From Review and Outlook on GaN and SiC Power Devices: Industrial State-of-the-Art, Applications, and Perspectives (2024) · cites this paper as [36]
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Cited by
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Buffolo, M., Favero, D., Marcuzzi, A., De Santi, C., Meneghesso, G., Zanoni, E., & Meneghini, M. (2024) · IEEE Transactions on Electron Devices · doi:10.1109/ted.2023.3346369 · Cited by 476
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Metadata
- Authors
- Fabris, E., Meneghini, M., De Santi, C., Borga, M., Kinoshita, Y., Tanaka, K., Ishida, H., Ueda, T., Meneghesso, G., & Zanoni, E.
- Affiliations
- University of Padua (IT)
- Panasonic (Japan) (JP)
- ORCID
- Venue
- IEEE Transactions on Electron Devices
- Published
- 2019-01
- Volume
- 66
- Issue
- 1
- Pages
- 337-342
- ISSN
- 0018-9383 (ISSN-L)
- 1557-9646
- OpenAlex
- W2900564950
- Cited by
- 29
- References
- 0
- Citations by year
- 2026: 1 · 2025: 1 · 2024: 7 · 2023: 7 · 2022: 2 · 2021: 5 · 2020: 5 · 2019: 1
- FWCI
- 1.49
- Type
- journal article
- Language
- en
- Open access
- closed
- Licence
- Locations
- IEEE Transactions on Electron Devices (publishedVersion)
- Padua Research Archive (University of Padova) (submittedVersion)
- Funders
- Italian Ministry of Foreign Affairs and International Cooperation, “Direzione Generale per la Promozione del Sistema Paese,” through the Italy-Japan bilateral Project “MAGYGAN.”
- Topics
- Physical Sciences › Physics and Astronomy › Condensed Matter Physics › GaN-based semiconductor devices and materials
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Silicon Carbide Semiconductor Technologies
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Semiconductor materials and devices
- Keywords
- gate injection transistor, GaN, hot electron trapping, hole injection, charge trapping, detrapping, dynamic on-resistance, electroluminescence, high-voltage power devices
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