The DOI matches its Crossref record; 1 of the 1 references it cites were found in a registry or an index.
Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow
Abstract
Pressure-assisted low-temperature sintering of silver paste is shown to be a viable alternative to solder reflow as a die-attachment solution. A quasihydrostatic pressure is used to lower the sintering temperature. The effect of parameters such as temperature and pressure are investigated. Characterization of the silver-attached samples shows a significant improvement in electrical conductivity, thermal conductivity and mechanical strength of the joint. Given that silver deforms with little accumulation of inelastic strains, and given the absence of large voids in the attachment layer, it is also expected that the joint to be more resistant to fatigue failure than a solder attached junction. Due to the high melting temperature of silver, this alternative process is also suitable for high temperature packages.
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Citations
Cites
Flash Method of Determining Thermal Diffusivity, Heat Capacity, and Thermal Conductivity
Parker, W. J., Jenkins, R. J., Butler, C. P., & Abbott, G. L. (1961) · Journal of Applied Physics · doi:10.1063/1.1728417 · Cited by 3,978 · cited 1×
“The thermal diffusivity was obtained by Parker’s flash-light method [6].”
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Cited by
Bai, J. G., Zhang, Z. Z., Calata, J. N., & Lu, G.-Q. (2006) · IEEE Transactions on Components and Packaging Technologies · doi:10.1109/tcapt.2005.853167 · Cited by 375
Self-citationJoining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications
Peng, P., Hu, A., Gerlich, A. P., Zou, G., Liu, L., & Zhou, Y. N. (2015) · ACS Applied Materials & Interfaces · doi:10.1021/acsami.5b02134 · Cited by 364
Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?
Siow, K. S. (2014) · Journal of Electronic Materials · doi:10.1007/s11664-013-2967-3 · Cited by 317
Kim, D., Nagao, S., Chen, C., Wakasugi, N., Yamamoto, Y., Suetake, A., Takemasa, T., Sugahara, T., & Suganuma, K. (2021) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2020.3031670 · Cited by 87
Review of Die-Attach Materials for SiC High-Temperature Packaging
Hou, F., Sun, Z., Su, M., Fan, J., You, X., Li, J., Wang, Q., Cao, L., & Zhang, G. (2024) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2024.3417529 · Cited by 52
Metadata
- Authors
- Zhang, Z., & Lu, G.-Q.
- Venue
- IEEE Transactions on Electronics Packaging Manufacturing
- Published
- 2002-10
- Volume
- 25
- Issue
- 4
- Pages
- 279-283
- ISSN
- 1521-334X (ISSN-L)
- OpenAlex
- W2133314170
- Cited by
- 221
- References
- 1
- FWCI
- 1.05
- Type
- journal article
- Language
- en
- Open access
- closed
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- Zhang, Z., & Lu, G.-Q. (2002). Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow. IEEE Transactions on Electronics Packaging Manufacturing. https://doi.org/10.1109/tepm.2002.807719
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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
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