The DOI matches its Crossref record; 29 of the 29 references it cites were found in a registry or an index.
Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?
Open accessOverview
The claims and statistics of this paper haven’t been checked yet.
Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.
Integrity signals
Registry
Cites
Statistics
Verification
Claims the paper makes
The claims and statistics of this paper haven’t been checked yet.
Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.
Self-check
Percentages, sums and reported differences re-computed from the paper’s own numbers.
The self-check needs the paper’s full text.
Citations
Cites
Deformation and Fracture Mechanics of Engineering Materials
Hertzberg, R. W., & Hauser, F. E. (1977) · Journal of Engineering Materials and Technology · doi:10.1115/1.3443416 · Cited by 3,668
Wijnhoven, S. W. P., Peijnenburg, W. J. G. M., Herberts, C. A., Hagens, W. I., Oomen, A. G., Heugens, E. H. W., Roszek, B., Bisschops, J., Gosens, I., Van De Meent, D., et al. (2009) · Nanotoxicology · doi:10.1080/17435390902725914 · Cited by 1,321
Nanocrystalline materials and coatings
Tjong, S. C., & Chen, H. (2004) · Materials Science and Engineering: R: Reports · doi:10.1016/j.mser.2004.07.001 · Cited by 928
de Lima, R., Seabra, A. B., & Durán, N. (2012) · Journal of Applied Toxicology · doi:10.1002/jat.2780 · Cited by 525
Die Attach Materials for High Temperature Applications: A Review
Manikam, V. R., & Cheong, K. Y. (2011) · IEEE Transactions on Components, Packaging and Manufacturing Technology · doi:10.1109/tcpmt.2010.2100432 · Cited by 478
State of the art of high temperature power electronics
Buttay, C., Planson, D., Allard, B., Bergogne, D., Bevilacqua, P., Joubert, C., Lazar, M., Martin, C., Morel, H., Tournier, D., et al. (2011) · Materials Science and Engineering: B · doi:10.1016/j.mseb.2010.10.003 · Cited by 432
Mechanical properties of nano-silver joints as die attach materials
Siow, K. S. (2012) · Journal of Alloys and Compounds · doi:10.1016/j.jallcom.2011.10.092 · Cited by 390
Self-citationBai, J. G., Zhang, Z. Z., Calata, J. N., & Lu, G.-Q. (2006) · IEEE Transactions on Components and Packaging Technologies · doi:10.1109/tcapt.2005.853167 · Cited by 375
Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection
Wang, T., Chen, X., Lu, G.-Q., & Lei, G.-Y. (2007) · Journal of Electronic Materials · doi:10.1007/s11664-007-0230-5 · Cited by 345
Low-temperature low-pressure die attach with hybrid silver particle paste
Suganuma, K., Sakamoto, S., Kagami, N., Wakuda, D., Kim, K.-S., & Nogi, M. (2012) · Microelectronics Reliability · doi:10.1016/j.microrel.2011.07.088 · Cited by 287
Cited by
Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications
Peng, P., Hu, A., Gerlich, A. P., Zou, G., Liu, L., & Zhou, Y. N. (2015) · ACS Applied Materials & Interfaces · doi:10.1021/acsami.5b02134 · Cited by 364
Review of Die-Attach Materials for SiC High-Temperature Packaging
Hou, F., Sun, Z., Su, M., Fan, J., You, X., Li, J., Wang, Q., Cao, L., & Zhang, G. (2024) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2024.3417529 · Cited by 52
Metadata
- Authors
- Siow, K. S.
- Venue
- Journal of Electronic Materials
- Published
- 2014-01-17
- Volume
- 43
- Issue
- 4
- Pages
- 947-961
- ISSN
- 0361-5235 (ISSN-L)
- 1543-186X
- OpenAlex
- W2061323567
- Cited by
- 317
- References
- 29
- FWCI
- 14.50
- Type
- journal article
- Language
- en
- Open access
- bronze
About these checks
Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
What counts as a claim ›How we measure confidence ›How we check this ›
Are you an author, or do you see a problem with this page? Request a review
How to cite
Cite CoChat for the checks on this page, and the paper for its own findings.
- This page
- CoChat. (2026). Citation check: Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging? https://app.cochat.ai/papers/10.1007/s11664-013-2967-3
- The paper
- Siow, K. S. (2014). Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging? Journal of Electronic Materials. https://doi.org/10.1007/s11664-013-2967-3
Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
