The DOI matches its Crossref record; 125 of the 135 references it cites were found in a registry or an index.
Condition Monitoring for Device Reliability in Power Electronic Converters: A Review
Open accessAbstract
Condition monitoring (CM) has already been proven to be a cost effective means of enhancing reliability and improving customer service in power equipment, such as transformers and rotating electrical machinery. CM for power semiconductor devices in power electronic converters is at a more embryonic stage; however, as progress is made in understanding semiconductor device failure modes, appropriate sensor technologies, and signal processing techniques, this situation will rapidly improve. This technical review is carried out with the aim of describing the current state of the art in CM research for power electronics. Reliability models for power electronics, including dominant failure mechanisms of devices are described first. This is followed by a description of recently proposed CM techniques. The benefits and limitations of these techniques are then discussed. It is intended that this review will provide the basis for future developments in power electronics CM.
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“According to [238], [239], power semiconductor device damages account for approximately 35% of all ASD faults.”
From Fault Diagnosis and Fault-Tolerant Control of PMSM Drives–State of the Art and Future Challenges (2022) · cites this paper as [238]
Citations
Cites
Physics of Semiconductor Devices
Sze, S. M., & Ng, K. K. (2006) · doi:10.1002/0470068329 · Cited by 14,627
Physics of Semiconductor Devices
Colinge, J.-P., & Colinge, C. (2002) · Kluwer Academic Publishers eBooks · doi:10.1007/b117561 · Cited by 14,074
A Critical Analysis of Crack Propagation Laws
Paris, P. C., & Erdoğan, F. (1963) · Journal of Basic Engineering · doi:10.1115/1.3656900 · Cited by 7,168
Power electronics converters, applications and design
Robinson, F. V. P. (1997) · Microelectronics Journal · doi:10.1016/s0026-2692(97)87859-7 · Cited by 5,100
Power Electronics: Converters, Applications and Design
Mohan, N., Undeland, T. M., & Robbins, W. P. (1989) · Cited by 4,781
Fundamentals of Power Semiconductor Devices
Baliga, B. J. (2008) · Springer eBooks · doi:10.1007/978-0-387-47314-7 · Cited by 2,241
An Industry-Based Survey of Reliability in Power Electronic Converters
Yang, S., Bryant, A. T., Mawby, P., Xiang, D., Ran, L., & Tavner, P. J. (2011) · IEEE Transactions on Industry Applications · doi:10.1109/tia.2011.2124436 · Cited by 2,058
Self-citationSelected failure mechanisms of modern power modules
Ciappa, M. (2002) · Microelectronics Reliability · doi:10.1016/s0026-2714(02)00042-2 · Cited by 1,039
Power Electronics: Converters, Applications, and Design
Mohan (2007) · Cited by 1,022
(2002) · Elsevier eBooks · doi:10.1016/c2016-0-00847-1 · Cited by 940
Research works printed but not linked: 10
- grant, 1989, Power MOSFET-Theory and Applications
- scheuermann, 2002, power cycling lifetime of advanced power modules for different temperature swings, Proc Power Convers Intell Motion, 59
- mermet-guyennet, 2008, Reliability requirement for traction power converters, ECPE Workshop Built-in Rel Power Electron Syst
- wolfgang, 2007, Examples for failures in power electronics systems, ECPE Tutorial Rel Power Electron Syst
- fratelli, 1999, reliability test of power igbt's for railway traction, Proc Eur Conf Power Electron Appl
- ramminger, 2006, predicting the crack progression in pbsnag-solder under cyclic loading conditions, Int Conf Integr Power Syst
- agyakwa, 2008, anomalous reliability behaviour of 99.99% and 99.999% pure aluminium wire bonds under thermal cycling, Proc IMAPS 41st Int Symp Microelectron
- dunipace, 2008, test saturation voltage to achieve high efficiency, Power Electron Technol, 32
- coquery, 1999, reliability improvement of the soldering thermal fatigue with alsic technology on traction high-power igbt modules, Proc Eur Conf Power Electron Appl
- 10.1109/63.704154 · DOI
Cited by
Sorted by citations
An Industry-Based Survey of Reliability in Power Electronic Converters
Yang, S., Bryant, A. T., Mawby, P., Xiang, D., Ran, L., & Tavner, P. J. (2011) · IEEE Transactions on Industry Applications · doi:10.1109/tia.2011.2124436 · Cited by 2,058
Self-citationPower Electronics Converters for Wind Turbine Systems
Blaabjerg, F., Liserre, M., & Ma, K. (2011) · IEEE Transactions on Industry Applications · doi:10.1109/tia.2011.2181290 · Cited by 923
Toward Reliable Power Electronics: Challenges, Design Tools, and Opportunities
Wang, H., Liserre, M., & Blaabjerg, F. (2013) · IEEE Industrial Electronics Magazine · doi:10.1109/mie.2013.2252958 · Cited by 919
An Overview of Artificial Intelligence Applications for Power Electronics
Zhao, S., Blaabjerg, F., & Wang, H. (2021) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2020.3024914 · Cited by 947
Future on Power Electronics for Wind Turbine Systems
Blaabjerg, F., & Ma, K. (2013) · IEEE Journal of Emerging and Selected Topics in Power Electronics · doi:10.1109/jestpe.2013.2275978 · Cited by 860
Metadata
- Authors
- Yang, S., Xiang, D., Bryant, A., Mawby, P., Ran, L., & Tavner, P.
- Affiliations
- University of Warwick (GB)
- Durham University (GB)
- Venue
- IEEE Transactions on Power Electronics
- Published
- 2010-11
- Volume
- 25
- Issue
- 11
- Pages
- 2734-2752
- ISSN
- 0885-8993 (ISSN-L)
- 1941-0107
- OpenAlex
- W2167320299
- Cited by
- 1,278
- References
- 135
- Citations by year
- 2026: 65 · 2025: 104 · 2024: 105 · 2023: 137 · 2022: 93 · 2021: 104 · 2020: 93 · 2019: 109 · 2018: 94 · 2017: 79 · 2016: 80 · 2015: 63 · 2014: 60 · 2013: 49 · 2012: 22
- FWCI
- 22.95
- Type
- journal article
- Language
- en
- Open access
- Licence
- Locations
- IEEE Transactions on Power Electronics (publishedVersion)
- Durham Research Online (Durham University) (acceptedVersion)
- Durham Research Online (Durham University) (submittedVersion, cc-by)
- Funders
- Engineering and Physical Sciences Research Council (EP/E02744X/1, EP/E026923/1)
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Silicon Carbide Semiconductor Technologies
- Physical Sciences › Engineering › Safety, Risk, Reliability and Quality › Reliability and Maintenance Optimization
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Multilevel Inverters and Converters
- Keywords
- condition monitoring, power semiconductor devices, power converters, device reliability, failure mechanisms, reliability modeling, sensor technology, signal processing, power electronics reliability
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