Asheghi, Mehdi

Thermal conduction in doped single-crystal silicon films

Asheghi, M., Kurabayashi, K., Kasnavi, R., & Goodson, K. E. (2002) · Journal of Applied Physics

Thermal properties of materialsSemiconductor materials and interfaces

Cited by 469

Phonon-boundary scattering in thin silicon layers

Asheghi, M., Leung, Y. K., Wong, S. S., & Goodson, K. E. (1997) · Applied Physics Letters

Thermal properties of materialsAdvancements in Semiconductor Devices and Circuit Design

Cited by 337

Thermal conduction in ultrathin pure and doped single-crystal silicon layers at high temperatures

Liu, W., & Asheghi, M. (2005) · Journal of Applied Physics

Thermal properties of materialsAdvancements in Semiconductor Devices and Circuit Design

Cited by 166

Low Thermal Resistances at GaN–SiC Interfaces for HEMT Technology

Cho, J., Bozorg-Grayeli, E., Altman, D. H., Asheghi, M., & Goodson, K. E. (2012) · IEEE Electron Device Letters

GaN-based semiconductor devices and materialsThermal properties of materials

Cited by 109

Cooling Limits for GaN HEMT Technology

Won, Y., Cho, J., Agonafer, D., Asheghi, M., & Goodson, K. E. (2013) · 2013 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)

GaN-based semiconductor devices and materialsSilicon Carbide Semiconductor Technologies

Cited by 57

Thermal conduction in lattice–matched superlattices of InGaAs/InAlAs

Sood, A., Rowlette, J. A., Caneau, C. G., Bozorg-Grayeli, E., Asheghi, M., & Goodson, K. E. (2014) · Applied Physics Letters

Thermal properties of materialsThermal Radiation and Cooling Technologies

Cited by 44

Microchannel cooling strategies for high heat flux (1 kW/cm2) power electronic applications

Jung, K. W., Kharangate, C. R., Lee, H., Palko, J., Zhou, F., Asheghi, M., Dede, E. M., & Goodson, K. E. (2017) · 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Heat Transfer and Boiling StudiesHeat Transfer and Optimization

Cited by 39

Temperature Dependent Thermal Resistances at GaN-Substrate Interfaces in GaN Composite Substrates

Cho, J., Li, Y., Altman, D. H., Hoke, W. E., Asheghi, M., & Goodson, K. E. (2012) · 2012 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)

Thermal properties of materialsGaN-based semiconductor devices and materials

Cited by 22

Thermal characterization of thin film Cu interconnects for the next generation of microelectronic devices

Shojaei-Zadeh, S., Zhang, S., Liu, W., Yang, Y., Sadeghipour, S. M., Asheghi, M., & Sverdrup, P. (2004) · The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543)

Copper Interconnects and ReliabilityThermal properties of materials

Cited by 12

Thermal Conductivity Measurements of Thin Aluminum Layers Using Steady State Joule Heating and Electrical Resistance Thermometry in Suspended Bridges

Reifenberg, J., England Voss, R., Rao, P., Schmitt, W., Yang, Y., Shojaei-Zadeh, S., Liu, W., Sadeghipour, S. M., & Asheghi, M. (2003) · Heat Transfer, Volume 1

Thermal properties of materialsAdvanced MEMS and NEMS Technologies

Cited by 6

A novel technique for in-plane thermal conductivity measurements of electrically conductive interconnects and nanostructures

Yang, Y., & Asheghi, M. (2004) · The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543)

Thermal properties of materialsCopper Interconnects and Reliability

Cited by 3