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Cited by 662

The DOI matches its Crossref record; 52 of the 52 references it cites were found in a registry or an index.

Materials and Structures toward Soft Electronics

Wang, Chunfeng, Wang, Chonghe, Huang, Zhenlong, Xu, Sheng·2018·Advanced Materials

Abstract

Soft electronics are intensively studied as the integration of electronics with dynamic nonplanar surfaces has become necessary. Here, a discussion of the strategies in materials innovation and structural design to build soft electronic devices and systems is provided. For each strategy, the presentation focuses on the fundamental materials science and mechanics, and example device applications are highlighted where possible. Finally, perspectives on the key challenges and future directions of this field are presented.

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Crossref · 10.1002/adma.201801368

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Metadata

Authors
Wang, C., Wang, C., Huang, Z., & Xu, S.
Venue
Advanced Materials
Publisher
Wiley
Published
2018-08-02
Volume
30
Issue
50
Pages
e1801368-e1801368
ISSN
  • 0935-9648 (ISSN-L)
  • 1521-4095
OpenAlex
W2887886759
Cited by
662
References
52
FWCI
27.65
Type
journal article
Language
en
Open access
closed

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CoChat. (2026). Citation check: Materials and Structures toward Soft Electronics. https://app.cochat.ai/papers/10.1002/adma.201801368
The paper
Wang, C., Wang, C., Huang, Z., & Xu, S. (2018). Materials and Structures toward Soft Electronics. Advanced Materials. https://doi.org/10.1002/adma.201801368

Data sources

Bibliographic data: Semantic Scholar, OpenAlex, Crossref.

Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).

Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.