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Measurement Techniques and Considerations for Determining Thermal Conductivity of Bulk Materials

Tritt, Terry M., Weston, David·2006·Physics of Solids and Liquids

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Crossref · 10.1007/0-387-26017-x_8

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Research works printed but not linked: 31

  1. See, for example, Thermal Conductivity of Solids, J. E. Parrott and A. D. Stuckes (Pion Limited Press, 1975), T. C. Harman and J. M. Honig, Thermoelectric and Thermomagnetic Effcts and Applications (McGraw-Hill, New York, 1967).
  2. See, for example, S. E. Gustafsson and E. Karawacki, Transient hot-strip probe for measuring thermal properties of insulating solids and liquids Rev. Sci. Instrum. 54, 744 (1983) and references therein. · DOI
  3. O. MaldonadoPulse Method for Simultaneous Measurement of Electric Thermopower and Heat Conductivity at Low Temperatures Cryogenics 32, 908 (1992). · DOI · Paper page
  4. B. M. Zawilski, R. T. Littleton IV, and Terry M. TrittDescription of the Parallel Thermal Conductance Technique for the Measurement of the Thermal Conductivity of Small Diameter Samples Rev. Sci. Instrum. 72, 1770 (2001). · DOI · Paper page
  5. G. A. Slack, Solid State Physics (Academic Press, New York, 1979).
  6. R. P. Tye, ed. Thermal Conductivity Vol. I and Vol. II Academic Press, New York, 1969.
  7. R. Berman, Thermal Conduction in Solids Clarendon Press, Oxford, 1976.
  8. Methods of Experimental Physics: Solid State Physics, Vol. 6, editor: L. Marton, Academic Press, New York, 1959.
  9. Amy L. Pope, B. M. Zawilski, and Terry M. TrittThermal Conductivity Measurements on Removable Sample Mounts Cryogenics 41, 725 (2001) · DOI · Paper page
  10. J. Kopp and G. A. SlackThermal Contact Problems in Low Temperature Thermocouple Thermometry Cryogenics, p 22, Feb. 1971. · DOI
  11. See for example (a.) Thermoelectric Materials: Structure, Properties and Applications. Terry M. Tritt Encyclopedia of Materials: Science and Technology, Volume 10, pp 1–11, K. H. J. Buschow, R. W. Cahn, M. C. Flemings, B. Ilschner, E. J. Kramer, S. Mahajan, (eds) Elsevier Press LTD, Oxford, Major Reference Works, London, UK (b) Thermoelectrics: Basic Principles and New Materials Developments, G. S. Nolas, J. Sharp and H. J. Goldsmid, Springer Series in Materials Science Volume 45, 2002.
  12. Terry M. TrittMeasurement and Characterization of Thermoelectric MaterialsT. M. Tritt, M. Kanatzidis, G. Mahan and H. B. Lyons Jr. (Editors), 1997 Materials Research Society Symposium Proceedings Volume 478: Thermoelectric Materials, New Directions and Approaches p 25, 1997. · DOI
  13. C. UherThermoelectric Property Measurements Naval Research Reviews, Thermoelectric Materials, Vol. XLVIII, p 44, 1996.
  14. M. J. Laubitz in Thermal Conductivity edited by R. P. Tye, vol. 1, Chap. 3 (Academic Press, London; 1969), p. 111.
  15. The crossover temperature of the low temperature phonon peak is the peak or “hump” in the thermal conductivity where there is a gradual change in the dominant scattering effct, such as from phononsphonon interactions at high temperatures to boundary scattering at low temperatures. See for example: Figure 3.1, R. Berman, Thermal Conduction in Solids, Oxford University Press, (1976) New York
  16. P. G. Klemens Chapter 1, p.1 Thermal Conductivity Vol.1, edited by R. P. Tye, Academic Press, New York, 1969.
  17. Chapter 4 (1969) Thermal Conductivity Vol. I and Vol. II, edited by R. P. Tye Academic Press, New York, 1969.
  18. Chapter 1, pg. 186, Fig. 1, 1969 Thermal Conductivity Vol. I and Vol. II edited by R. P. Tye, Academic Press, New York, 1969.
  19. Glen A. Slack, and C. GlassbrennerThermal Conductivity of Germanium from 3K to 1020K, Physical Review, Volume 120, No 3, Nov 1, 1960. · DOI
  20. H. S. Carslaw and J. C. JaegerConduction of Heat in Solids Oxford University Press, Oxford, 1959.
  21. C. J. Glassbrenner and Glen A. SlackThermal Conductivity of Silicon and Germanium from 3°K to the Melting Point Physical Review, V 134, N 4A, 18 May 1964. · DOI · Paper page
  22. J. Khedari, P. Benigni, J. Rogez, and J. C. MathieuNew Apparatus for Thermal Diffsivity Measurements of Refractory Solid Materials by the Periodic Stationary Method Rev. Sci. Instrum. 66(1), January, 1995. · DOI
  23. P. Benigni and J. RogezHigh Temperature Thermal Diffsivity Measurement by the Periodic Cylindrical Method: The problem of Contact Thermocouple Thermometry, Rev. Sci. Instrum. 68(3), July, 1997. · DOI
  24. David Cahill, Henry E. Fischer, Tom Klitsner, E. T. Swartz, and R. O. PohlThermal Conductivity of Thin Films: Measurements and Understanding J. Vac. Sci. Technol. A, 7, 1260, 1989. · DOI · Paper page
  25. F. I. Chu, R. E. Taylor and A. B. Donaldson, Thermal diffsivity measurements at high temperatures by a flash method Jour. of Appl. Phys. 51, 336, 1980. · DOI
  26. See for example: (a) A. B. Donaldson and R. E. Taylor Thermal diffsivity measurement by a radial heat flow method J. Appl. Phys. 46, 4584, 1975. J. W. Vandersande and R. O. Pohl Simple Apparatus for the Measurement of Thermal Diffsivity between 80–500 K using the Modified Angstrom Method, Rev. Sci. Instrum. 51, 1694, 1980. J. Gembarovic and R. E. Taylor A New Data Reduction Procedure in the Flash Method of Measuring Thermal Diffsivity Rev. Sci. Instrum 65, 3535, 1994. · DOI
  27. B. M. Zawilski, R. T. Littleton IV, and Terry T. TrittInvestigation of the Thermal Conductivity of the Mixed Pentatellurides Hf1−X ZrXTe5, Appl. Phys. Lett. 77, 2319 (2000). · DOI
  28. T. C. HarmanSpecial Techniques for Measurement of Thermoelectric Properties. J. Appl. Phys. 30, 1373, 1959. · DOI
  29. T. C. Harman, J. H. Cahn and M. J. LoganMeasurement of Thermal Conductivity by Utilization of the Peltier Effct J. Appl. Phys. 30, 1351, 1959. · DOI
  30. A. W. PennThe Corrections Used in the Adiabatic Measurement of Thermal Conductivity using the Peltier Effct. J. Sci. Instrum. 41, 626, 1964. · DOI
  31. A. E. Bowley, L. E. J. Cowles, G. J. Williams, and H. J. GoldsmidMeasurementof the Figure of Merit of a Thermoelectric Material J. Sci. Instrum. 38, 433, 1961. · DOI

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Metadata

Authors
Tritt, T. M., & Weston, D.
Venue
Physics of Solids and Liquids
Publisher
Springer US
Published
2006
Pages
187-203
Cited by
22
References
3
Language
en

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