The DOI matches its Crossref record; 20 of the 20 references it cites were found in a registry or an index.
Die Attach Materials for High Temperature Applications: A Review
Abstract
The need for high power density and high temperature capabilities in today's electronic devices continues to grow. More robust devices with reliable and stable functioning capabilities are needed, for example in aerospace and automotive industries as well as sensor technology. These devices need to perform under extreme temperature conditions, and not show any deterioration in terms of switching speeds, junction temperatures, and power density, and so on. While the bulk of research is performed to source and manufacture these high temperature devices, the device interconnect technology remains under high focus for packaging. The die attach material has to withstand high temperatures generated during device functioning and also cope with external conditions which will directly determine how well the device performs in the field. This literature work seeks to review the numerous research attempts thus far for high temperature die attach materials on wide band gap materials of silicon carbide, gallium nitride and diamond, document their successes, concerns and application possibilities, all of which are essential for high temperature reliability.
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Cites
Lead-free Solders in Microelectronics
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Comparison of 6H-SiC, 3C-SiC, and Si for power devices
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An assessment of wide bandgap semiconductors for power devices
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Wide bandgap compound semiconductors for superior high-voltage unipolar power devices
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Comparison of Wide-Bandgap Semiconductors for Power Electronics Applications
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Cited by
Wide Bandgap Devices in AC Electric Drives: Opportunities and Challenges
Morya, A. K., Gardner, M. C., Anvari, B., Liu, L., Yepes, A. G., Doval-Gandoy, J., & Toliyat, H. A. (2019) · IEEE Transactions on Transportation Electrification · doi:10.1109/tte.2019.2892807 · Cited by 444
A Review of High-Speed GaN Power Modules: State of the Art, Challenges, and Solutions
Emon, A. I., Mustafeez-ul-Hassan, Mirza, A. B., Kaplun, J., Vala, S. S., & Luo, F. (2023) · IEEE Journal of Emerging and Selected Topics in Power Electronics · doi:10.1109/jestpe.2022.3232265 · Cited by 151
Review of Die-Attach Materials for SiC High-Temperature Packaging
Hou, F., Sun, Z., Su, M., Fan, J., You, X., Li, J., Wang, Q., Cao, L., & Zhang, G. (2024) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2024.3417529 · Cited by 52
Metadata
- Authors
- Manikam, V. R., & Cheong, K. Y.
- Venue
- IEEE Transactions on Components, Packaging and Manufacturing Technology
- Published
- 2011-04
- Volume
- 1
- Issue
- 4
- Pages
- 457-478
- ISSN
- 2156-3950 (ISSN-L)
- 2156-3985
- OpenAlex
- W2156505933
- Cited by
- 478
- References
- 20
- FWCI
- 13.15
- Type
- journal article
- Language
- en
- Open access
- closed
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- Manikam, V. R., & Cheong, K. Y. (2011). Die Attach Materials for High Temperature Applications: A Review. IEEE Transactions on Components, Packaging and Manufacturing Technology. https://doi.org/10.1109/tcpmt.2010.2100432
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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
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