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Influence of Ni interlayer on microstructure and mechanical properties of laser welded joint of Al/Cu bimetal
Abstract
Abstract The dissimilar joint consists of 6061 aluminum and 110 copper with a Ni foil interlayer. The influence of Ni element on the interfacial microstructure composition and bonding properties of the Al/Cu bimetal was systematically investigated. The study results demonstrate that the Ni element can inhibit the diffusion of Al, and fine the microstructure of deleterious phase IMC at the interface zone. The tensile strength of joints with Ni foil increases firstly and then decreases with the increase of laser power, and the maximum is about 126.9 MPa which improves about 27.1 % than that of Al/Cu joints without Ni foil. The fracture surface mainly passes through the (Cu) solid solution and the Al2Cu + AlNi IMCs zone due to the presence of hard and brittle IMCs severely deleterious the joining strength of joints.
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Cited by
A Review on Laser-Assisted Joining of Aluminium Alloys to Other Metals
Bunaziv, I., Akselsen, O. M., Ren, X., Nyhus, B., Eriksson, M., & Gulbrandsen-Dahl, S. (2021) · Metals · doi:10.3390/met11111680 · Cited by 48
Effect of spiral scan distance on the nanosecond-pulsed-laser lap joint of Al/Cu
Li, Q., Zhu, B., Li, H., Niu, S., Wu, L., Zeng, Z., Xia, H., Chen, B., & Tan, C. (2023) · Optics & Laser Technology · doi:10.1016/j.optlastec.2022.108896 · Cited by 26
Kim, Y., Jeong, S. J., Yun, S. M., & Lee, J. I. (2022) · Journal of Welding and Joining · doi:10.5781/jwj.2022.40.5.7 · Cited by 11
Singh, R., Arora, N., & Choudhary, A. (2026) · Welding in the World · doi:10.1007/s40194-026-02375-5 · Cited by 6
“To avoid direct contact and lessen the production of IMCs, research has also looked into the insertion of an intermediate layer of a third element between Al and Cu, such as graphene [26], zinc (Zn) [27] or nickel (Ni) [28, 29].”
Zheng, H., Liu, C.-L., Gao, Q., Wu, M.-W., & Qin, X.-P. (2026) · Journal of Materials Research · doi:10.1557/s43578-025-01765-7 · Cited by 2
Metadata
- Authors
- Yan, S., & Shi, Y.
- Venue
- Journal of Manufacturing Processes
- Publisher
- Elsevier BV
- Published
- 2020-11
- Volume
- 59
- Pages
- 343-354
- ISSN
- 1526-6125
- Cited by
- 57
- References
- 1
- Language
- en
- Licence
- www.elsevier.com/tdm/userlicense/1.0/ (tdm)
- www.elsevier.com/legal/tdmrep-license (tdm)
- Funders
- National Defense Pre-Research Foundation of China
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