Cited by 72Silicon Carbide Semiconductor TechnologiesSemiconductor materials and devicesRadiation Effects in Electronics

High temperature gate-bias and reverse-bias tests on SiC MOSFETs

Yang, L., Castellazzi, A.·2013·Microelectronics Reliability

Integrity signals

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Crossref · 10.1016/j.microrel.2013.07.065

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11 of 11 references verified0 citation errors · 0 not checkable

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Authors
Yang, L., & Castellazzi, A.
Affiliations
University of Nottingham (GB)
Corresponding author
Yang, L.
Venue
Microelectronics Reliability
Publisher
Elsevier BV
Published
2013-09
Volume
53
Issue
9-11
Pages
1771-1773
ISSN
0026-2714 (ISSN-L)
OpenAlex
W1979062847
Cited by
72
References
11
Citations by year
2026: 5 · 2025: 8 · 2024: 8 · 2023: 6 · 2022: 5 · 2021: 7 · 2020: 3 · 2019: 4 · 2018: 9 · 2017: 10 · 2016: 4 · 2015: 2 · 2013: 1
FWCI
1.40
Type
journal article
Language
en
Open access
closed
Locations
Microelectronics Reliability (publishedVersion)
Topics
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Silicon Carbide Semiconductor Technologies
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Semiconductor materials and devices
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Radiation Effects in Electronics
Keywords
SiC MOSFET, high temperature reverse bias, gate oxide integrity, threshold voltage shift, leakage current degradation, device reliability, stress testing

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