High temperature gate-bias and reverse-bias tests on SiC MOSFETs
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In HTGB, TDDB and BTI are expected to contribute to oxide aging.
“Therefore, TDDB and BTI are expected to contribute to oxide aging [33], [58].”
From AC Power Cycling Test Setup and Condition Monitoring Tools for SiC-Based Traction Inverters (2023) · cites this paper as [33]
Cites
Leakage current mechanisms and leakage reduction techniques in deep-submicrometer CMOS circuits
Roy, K., Mukhopadhyay, S. C., & Mahmoodi, H. (2003) · Proceedings of the IEEE · doi:10.1109/jproc.2002.808156 · Cited by 2,378 · see citing works
The impact of gate-induced drain leakage current on MOSFET scaling
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Time Dependence of Bias-Stress-Induced SiC MOSFET Threshold-Voltage Instability Measurements
Lelis, A. J., Habersat, D. B., Green, R., Ogunniyi, A. A., Gurfinkel, M., Suehle, J. S., & Goldsman, N. (2008) · IEEE Transactions on Electron Devices · doi:10.1109/ted.2008.926672 · Cited by 327 · see citing works
Characterization of Transient Gate Oxide Trapping in SiC MOSFETs Using Fast $I$–$V$ Techniques
Gurfinkel, M., Xiong, H. D., Cheung, K. P., Suehle, J. S., Bernstein, J. B., Shapira, Y., Lelis, A. J., Habersat, D. B., & Goldsman, N. (2008) · IEEE Transactions on Electron Devices · doi:10.1109/ted.2008.926626 · Cited by 132 · see citing works
Application of reliability test standards to SiC Power MOSFETs
Green, R., Lelis, A. J., & Habersat, D. B. (2011) · IEEE International Reliability Physics Symposium proceedings · doi:10.1109/irps.2011.5784573 · Cited by 79 · see citing works
Treu, M., Rupp, R., & Sölkner, G. (2010) · IEEE International Reliability Physics Symposium proceedings · doi:10.1109/irps.2010.5488834 · Cited by 68 · see citing works
Temperature-Dependence of SiC MOSFET Threshold-Voltage Instability
Lelis, A. J., Habersat, D. B., Green, R., et al. (2008) · Materials science forum · doi:10.4028/www.scientific.net/msf.600-603.807 · Cited by 52 · see citing works
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Hao, J., Rioux, M., & Awadelkarim, O. O. (2011) · IEEE International Integrated Reliability Workshop final report · doi:10.1109/iirw.2011.6142607 · Cited by 9 · see citing works
Advances in silicon carbide MOS technology
Mawby, P., Kampouris, C., & Koh, A. (2003) · doi:10.1109/miel.2002.1003146 · Cited by 4 · see citing works
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Overview of Real-Time Lifetime Prediction and Extension for SiC Power Converters
Ni, Z., Lyu, X., Yadav, O. P., Singh, B. N., Zheng, S., & Cao, D. (2020) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2019.2962503 · Cited by 261 · see citing works
Evaluation of Aging's Effect on Temperature-Sensitive Electrical Parameters in SiC mosfets
Yang, F., Ugur, E., & Akin, B. (2020) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2019.2950311 · Cited by 121 · see citing works
High temperature pulsed-gate robustness testing of SiC power MOSFETs
Fayyaz, A., & Castellazzi, A. (2015) · Microelectronics Reliability · doi:10.1016/j.microrel.2015.06.141 · Cited by 40 · see citing works
Self-citationInvestigation on Degradation of SiC MOSFET Under Accelerated Stress in a PFC Converter
Jiang, X., Wang, J., Chen, J., Yu, H., Li, Z., & John Shen, Z. (2021) · IEEE Journal of Emerging and Selected Topics in Power Electronics · doi:10.1109/jestpe.2020.2988447 · Cited by 39 · see citing works
AC Power Cycling Test Setup and Condition Monitoring Tools for SiC-Based Traction Inverters
Farhadi, M., Vankayalapati, B. T., Sajadi, R., & Akin, B. (2023) · IEEE Transactions on Vehicular Technology · doi:10.1109/tvt.2023.3271251 · Cited by 24 · see citing works
“AmongdifferentALTs,High-TemperatureGateBias (HTGB) and DC power cycling tests have received considerable attention to accelerate gate oxide and package degradations, respectively [31], [32], [33].”
BackgroundSiC MOSFETs robustness for diode-less applications
Avino-Salvado, O., Cheng, C., Buttay, C., Morel, H., Labrousse, D., Lefebvre, S., & Ali, M. (2018) · EPE Journal · doi:10.1080/09398368.2018.1456836 · Cited by 17 · see citing works
A Critical Review on Reliability and Short Circuit Robustness of Silicon Carbide Power MOSFETs
Sreejith, S., Ajayan, J., Devasenapati, S. B., Sivasankari, B., & Tayal, S. (2023) · Silicon · doi:10.1007/s12633-022-02039-1 · Cited by 11 · see citing works
- Authors
- Yang, L., & Castellazzi, A.
- Affiliations
- University of Nottingham (GB)
- Corresponding author
- Yang, L.
- ORCID
- Castellazzi, A.
- Venue
- Microelectronics Reliability
- Publisher
- Elsevier BV
- Published
- 2013-09
- Volume
- 53
- Issue
- 9-11
- Pages
- 1771-1773
- ISSN
- 0026-2714 (ISSN-L)
- OpenAlex
- W1979062847
- Cited by
- 72
- References
- 11
- Citations by year
- 2026: 5 · 2025: 8 · 2024: 8 · 2023: 6 · 2022: 5 · 2021: 7 · 2020: 3 · 2019: 4 · 2018: 9 · 2017: 10 · 2016: 4 · 2015: 2 · 2013: 1
- FWCI
- 1.40
- Type
- journal article
- Language
- en
- Open access
- closed
- Locations
- Microelectronics Reliability (publishedVersion)
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Silicon Carbide Semiconductor Technologies
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Semiconductor materials and devices
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Radiation Effects in Electronics
- Keywords
- SiC MOSFET, high temperature reverse bias, gate oxide integrity, threshold voltage shift, leakage current degradation, device reliability, stress testing
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