Cited by 39Silicon Carbide Semiconductor TechnologiesSemiconductor materials and devicesAdvanced DC-DC Converters

Investigation on Degradation of SiC MOSFET Under Accelerated Stress in a PFC Converter

Jiang, Xi, Wang, Jun, Chen, Jianjun, Yu, Hengyu, Li, Zongjian, John Shen, Z.·2021·IEEE Journal of Emerging and Selected Topics in Power Electronics

Abstract

The reliability concern of SiC MOSFETs has been extensively investigated with various accelerated stress tests. However, these conventional tests are predominantly performed in a simplified and controlled testing environment, which might or might not realistically simulate the actual device operation profiles in power converters. In this article, we report the long-term degradation phenomenon of several types of SiC MOSFETs in an actual 2-kW power factor correction (PFC) converter and provide an analysis of the degradation mechanisms. Compared to conventional dc power cycling tests, a large decrease in threshold voltage was observed due to gate oxide degradation of SiC MOSFET in a PFC converter. Online monitoring results show that the ON-state voltage drop of SiC MOSFET continuously rises with the increase of stress times. The increase in ON-state voltage is caused by the change of package resistance and channel resistance. Gate oxide degradation resulting in a large increase in drain-source leakage current and gate leakage current. Meanwhile, the variation of miller plateau voltage and threshold voltage results in a significant change of turn-on losses in SiC MOSFET. TCAD simulation, and C- V measurement indicate that the main degradation mechanism is hot holes accumulation within the gate oxide above the JFET region and channel region due to high electric field stress.

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Crossref · 10.1109/jestpe.2020.2988447

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Authors
Jiang, X., Wang, J., Chen, J., Yu, H., Li, Z., & John Shen, Z.
Affiliations
Hunan University (CN)
Venue
IEEE Journal of Emerging and Selected Topics in Power Electronics
Published
2021-08
Volume
9
Issue
4
Pages
4299-4310
ISSN
  • 2168-6777 (ISSN-L)
  • 2168-6785
OpenAlex
W3016375642
Cited by
39
References
27
Citations by year
2026: 3 · 2025: 9 · 2024: 6 · 2023: 7 · 2022: 7 · 2021: 6 · 2020: 1
FWCI
1.80
Type
journal article
Language
en
Open access
closed
Locations
IEEE Journal of Emerging and Selected Topics in Power Electronics (publishedVersion)
Funders
  • High-level Talent Gathering Project of Hunan Province (201833401202)
  • Science and Technology Major Project of Hunan Province (2017GK1020)
Topics
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Silicon Carbide Semiconductor Technologies
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Semiconductor materials and devices
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Advanced DC-DC Converters
Keywords
SiC MOSFET, device degradation, power factor correction converter, gate oxide degradation, threshold voltage shift, on-state voltage drop, channel resistance, gate leakage current, turn-on loss, degradation mechanism, reliability, TCAD simulation, capacitance-voltage measurements

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