Cited by 40Silicon Carbide Semiconductor TechnologiesSemiconductor materials and devicesRadiation Effects in Electronics

High temperature pulsed-gate robustness testing of SiC power MOSFETs

Open access
Fayyaz, A., Castellazzi, A.·2015·Microelectronics Reliability

Integrity signals

Registry

Crossref · 10.1016/j.microrel.2015.06.141

Cites

11 of 11 references verified0 citation errors · 0 not checkable

Statistics

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Claims the paper makes

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Claims other papers make about this one

Each is checked against this paper’s own text: does it say what the citing paper says it does?

  • The HTGS test is more realistic and the DUT experiences gate-source voltage transient, but the test time is relatively long and the channel is not conducted.

    “This test is more realistic and device under test (DUT) experiences gate-source voltage transient. However, the test time is relatively long, and the channel is not conducted.”
  • The HTGS test uses high-frequency pulses to the gate source for close to real conditions.

    “The high temperature gate switching (HTGS) test uses high-frequency pulses to the gate source for close to the real conditions [59].”

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Authors
Fayyaz, A., & Castellazzi, A.
Affiliations
University of Nottingham (GB)
Corresponding author
Fayyaz, A.
Venue
Microelectronics Reliability
Publisher
Elsevier BV
Published
2015-08
Volume
55
Issue
9-10
Pages
1724-1728
ISSN
0026-2714 (ISSN-L)
OpenAlex
W1053145349
Cited by
40
References
11
Citations by year
2026: 2 · 2025: 3 · 2024: 7 · 2023: 1 · 2022: 4 · 2021: 3 · 2020: 3 · 2019: 3 · 2018: 11 · 2017: 1 · 2016: 2
FWCI
2.25
Type
journal article
Language
en
Locations
  • Microelectronics Reliability (publishedVersion)
  • Repository@Nottingham (University of Nottingham) (acceptedVersion, other-oa)
  • Repository@Nottingham (University of Nottingham) (submittedVersion, cc-by-nc-nd)
  • Nottingham ePrints (University of Nottingham) (submittedVersion, cc-by-nc-nd)
Funders
Engineering and Physical Sciences Research Council (EP/K031082/1)
Topics
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Silicon Carbide Semiconductor Technologies
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Semiconductor materials and devices
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Radiation Effects in Electronics
Keywords
SiC MOSFET, gate oxide reliability, high-temperature testing, threshold voltage degradation, gate leakage current, SiO2/SiC interface, electric field distribution, power semiconductor devices

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Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.

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