The DOI matches its Crossref record; 23 of the 23 references it cites were found in a registry or an index.
A frequency-domain thermoreflectance method for the characterization of thermal properties
Abstract
A frequency-domain thermoreflectance method for measuring the thermal properties of homogenous materials and submicron thin films is described. The method can simultaneously determine the thermal conductivity and heat capacity of a sample, provided the thermal diffusivity is ≳3×10−6 m2/s, and can also simultaneously measure in-plane and cross-plane thermal conductivities, as well the thermal boundary conductance between material layers. Two implementations are discussed, one based on an ultrafast pulsed laser system and one based on continuous-wave lasers. The theory of the method and an analysis of its sensitivity to various thermal properties are given, along with results from measurements of several standard materials over a wide range of thermal diffusivities. We obtain specific heats and thermal conductivities in good agreement with literature values, and also obtain the in-plane and cross-plane thermal conductivities for crystalline quartz.
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In the citing paper
“The transient thermoreflectance technique can be implemented as both the TDTR method 22, 24, 25 and the frequency-domain thermoreflectance (FDTR) method 93, 94 (see Section III(A) for more details of FDTR).”
From Tutorial: Time-domain thermoreflectance (TDTR) for thermal property characterization of bulk and thin film materials (2018) · cites this paper as [93]
In the citing paper
“By holding the delay stage at a fixed location, an ultrafast-laser-based TDTR can also be implemented as FDTR. 93”
From Tutorial: Time-domain thermoreflectance (TDTR) for thermal property characterization of bulk and thin film materials (2018) · cites this paper as [93]
In the citing paper
“With the advancement of pico-and femtosecond pulsed laser after 1980, this technique has been widely used for studying non-equilibrium electron-phonon interaction [89,90], detecting coherent phonon transport [91][92][93] and thermal transport across interfaces [94][95][96] .”
From Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials (2016) · cites this paper as [96]
Citations
Cites
Thermophysical Properties of Matter
Touloukian, Y. S. (1995) · CERN Document Server (European Organization for Nuclear Research) · Cited by 3,282
Lienhard, J. H. (1981) · Cited by 2,748
Surface generation and detection of phonons by picosecond light pulses
Thomsen, C., Grahn, H. T., Maris, H. J., & Tauc, J. (1986) · Physical review. B, Condensed matter · doi:10.1103/physrevb.34.4129 · Cited by 1,636
Analysis of heat flow in layered structures for time-domain thermoreflectance
Cahill, D. G. (2004) · Review of Scientific Instruments · doi:10.1063/1.1819431 · Cited by 1,543
Schmidt, A. J., Chen, X., & Chen, G. (2008) · Review of Scientific Instruments · doi:10.1063/1.3006335 · Cited by 655
Self-citationTransient thermoreflectance from thin metal films
Paddock, C. A., & Eesley, G. L. (1986) · Journal of Applied Physics · doi:10.1063/1.337642 · Cited by 530
Thermal conductance of epitaxial interfaces
Costescu, R. M., Wall, M. A., & Cahill, D. G. (2003) · Physical Review B · doi:10.1103/physrevb.67.054302 · Cited by 486
Capinski, W. S., Maris, H. J., Ruf, T., Cardona, M., Ploog, K., & Katzer, D. S. (1999) · Physical Review B · doi:10.1103/physrevb.59.8105 · Cited by 471
Thermal conductance of metal-metal interfaces
Gundrum, B. C., Cahill, D. G., & Averback, R. S. (2005) · Physical Review B · doi:10.1103/physrevb.72.245426 · Cited by 417
Detection of thermal waves through optical reflectance
Rosencwaig, A., Opsal, J., Smith, W. L., & Willenborg, D. L. (1985) · Applied Physics Letters · doi:10.1063/1.95794 · Cited by 386
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Liu, T., Chen, F., Li, J., & Tong, C. (2026) · Advanced Scientific Instruments · doi:10.1016/j.asi.2026.100037
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Metadata
- Authors
- Schmidt, A. J., Cheaito, R., & Chiesa, M.
- Affiliations
- Masdar Institute of Science and Technology (AE)
- Venue
- Review of Scientific Instruments
- Publisher
- AIP Publishing
- Published
- 2009-09-01
- Volume
- 80
- Issue
- 9
- Pages
- 094901-094901
- ISSN
- 0034-6748 (ISSN-L)
- 1089-7623
- OpenAlex
- W2036784309
- Cited by
- 543
- References
- 23
- Citations by year
- 2026: 67 · 2025: 73 · 2024: 67 · 2023: 50 · 2022: 48 · 2021: 35 · 2020: 43 · 2019: 33 · 2018: 25 · 2017: 26 · 2016: 14 · 2015: 12 · 2014: 12 · 2013: 17 · 2012: 9
- FWCI
- 3.39
- Type
- journal article
- Language
- en
- Open access
- closed
- Locations
- Review of Scientific Instruments (publishedVersion)
- PubMed (publishedVersion)
- Topics
- Physical Sciences › Materials Science › Materials Chemistry › Thermal properties of materials
- Physical Sciences › Engineering › Mechanics of Materials › Thermography and Photoacoustic Techniques
- Physical Sciences › Engineering › Mechanical Engineering › Mechanical and Thermal Properties Analysis
- Keywords
- frequency-domain thermoreflectance, thermal conductivity, heat capacity, thermal diffusivity, through-plane thermal conductivity, in-plane thermal conductivity, thermal boundary conductance, crystalline quartz, thermal properties measurement
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