A low-profile three-dimensional neural probe array using a silicon lead transfer structure
Open accessAbstract
This paper presents a microassembly method for low-profile three-dimensional probe arrays for neural prosthesis and neuroscience applications. A silicon (Si) lead transfer structure, Si interposer, is employed to form electrical connections between two orthogonal planes—the two dimensional probes and the dummy application-specific integrated circuit (ASIC) chip. In order to hold the probe array and facilitate the alignment of probes during assembly, a Si platform is designed to have through-substrate slots for the insertion of probes and cavities for holding the Si interposers. The electrical interconnections between the probes and the dummy ASIC chip are formed by solder reflow, resulting in greatly improved throughput in the proposed assembly method. Moreover, since the backbone of the probe can be embedded inside the cavity of the Si platform, the profile of the probe array above the cortical surface can be controlled within 750 µm. This low-profile allows the probe array not to touch the skull after it is implanted on the brain. The impedance of the assembled probe is also measured and discussed.
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Fabrication of 3D microneedle electrodes by assembling 2D probe combs or etching bulk materials is expensive and time consuming.
“Because these approaches require special equipment or platforms, microneedle structures that are fabricated either by assembling 2D probe combs or etching bulk materials are expensive and time consuming.”
From A flexible three-dimensional electrode mesh: An enabling technology for wireless brain–computer interface prostheses (2016) · cites this paper as [9]
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Self-citation
- Authors
- Cheng, M.-Y., Je, M., Tan, K. L., Tan, E. L., Lim, R., Yao, L., Li, P., Park, W.-T., Phua, E. J. R., Gan, C. L., & Yu, A.
- Affiliations
- Agency for Science, Technology and Research (SG)
- Seoul National University of Science and Technology (KR)
- Nanyang Technological University (SG)
- Corresponding author
- Cheng, Ming-Yuan
- ORCID
- Venue
- Journal of Micromechanics and Microengineering
- Publisher
- IOP Publishing
- Published
- 2013-08-06
- Volume
- 23
- Issue
- 9
- Pages
- 095013
- ISSN
- 0960-1317 (ISSN-L)
- 1361-6439
- OpenAlex
- W2143885441
- Cited by
- 18
- References
- 25
- Citations by year
- 2025: 1 · 2024: 1 · 2023: 1 · 2021: 1 · 2020: 1 · 2019: 2 · 2018: 1 · 2017: 3 · 2016: 3 · 2015: 2 · 2014: 2
- FWCI
- 1.14
- Type
- journal article
- Language
- en
- Open access
- bronze
- doi.org
- Licence
- Locations
- Journal of Micromechanics and Microengineering (publishedVersion)
- DR-NTU (Nanyang Technological University) (submittedVersion)
- Funders
- Agency for Science, Technology and Research
- Topics
- Life Sciences › Neuroscience › Cellular and Molecular Neuroscience › Neuroscience and Neural Engineering
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Advanced MEMS and NEMS Technologies
- Physical Sciences › Engineering › Electrical and Electronic Engineering › 3D IC and TSV technologies
- Keywords
- silicon interposer, microassembly, neural prosthesis, probe impedance, application-specific integrated circuits, neural implants
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