Cited by 245Neuroscience and Neural EngineeringAdvanced MEMS and NEMS TechnologiesAnalog and Mixed-Signal Circuit Design

A high-yield microassembly structure for three-dimensional microelectrode arrays

Qing Bai, Wise, K.D., Anderson, D.J.·2000·IEEE Transactions on Biomedical Engineering

Abstract

This paper presents a practical microassembly process for three-dimensional (3-D) microelectrode arrays for recording and stimulation in the central nervous system (CNS). Orthogonal lead transfers between the micromachined two-dimensional probes and a cortical surface platform are formed by attaching gold beams on the probes to pads on the platform using wire-free ultrasonic bonding. The low-profile (150 microns) outrigger design of the probes allows the bonding of fully assembled high-density arrays. Micromachined assembly tools allow the formation of a full 3-D probe array within 30 min. Arrays having up to 8 x 16 shanks on 200-micron centers have been realized and used to record cortical single units successfully. Active 3-D probe arrays containing on-chip CMOS signal processing circuitry have also been created using the microassembly approach. In addition, a dynamic insertion technique has been explored to allow the implantation of high-density probe arrays into feline cortex at high-speed and with minimal traumatic injury.

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Crossref · 10.1109/10.827288

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Authors
Bai, Q., Wise, K. D., & Anderson, D. J.
Affiliations
University of Michigan (US)
Venue
IEEE Transactions on Biomedical Engineering
Published
2000-03
Volume
47
Issue
3
Pages
281-289
ISSN
0018-9294 (ISSN-L)
OpenAlex
W2161272185
Cited by
245
References
20
Citations by year
2025: 5 · 2023: 4 · 2022: 8 · 2021: 6 · 2020: 7 · 2019: 5 · 2018: 6 · 2017: 7 · 2016: 14 · 2015: 8 · 2014: 7 · 2013: 11 · 2012: 7
FWCI
2.84
Type
journal article
Language
en
Open access
closed
Locations
  • IEEE Transactions on Biomedical Engineering (publishedVersion)
  • PubMed (publishedVersion)
Topics
  • Life Sciences › Neuroscience › Cellular and Molecular Neuroscience › Neuroscience and Neural Engineering
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Advanced MEMS and NEMS Technologies
  • Physical Sciences › Engineering › Biomedical Engineering › Analog and Mixed-Signal Circuit Design
Keywords
microassembly, ultrasonic bonding, cortical recording, single-unit recording, neurostimulation
MeSH terms
Animals, Auditory Cortex, Brain, Cats, Electrodes, Implanted, Electroencephalography, Equipment Design, Gold, Guinea Pigs, Microelectrodes, Signal Processing, Computer-Assisted, Silicon, Microscopy, Confocal

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