A scalable bonding technique for the development of next-generation brain-machine interfaces
Abstract
Brain-machine interfaces (BMIs) have demonstrated potential both for neuroscience studies and for neural-prosthetic or therapeutic devices. Given the high density of brain neurons, engineering a dense array of neural recording sites across a large brain region is important for BMIs with significantly improved capabilities such as high-dexterity motor control. In our development of a high-channel-count and high-density BMI system using complementary metal-oxide semiconductor (CMOS) arrays mated with massively parallel microelectrodes, we determined that the connection between the microelectrode and chip interface (MCI) is a crucial process for device performance and scalability. Here we report our results extending flip chip bonding technique to establish the electrical connections en masse at the MCI. Key parameters affecting bonding quality were identified and optimized, and the quality of bonding was evaluated by electrochemical impedance spectroscopy (EIS) in phosphate buffered saline (PBS). With proper packaging, the bonding technique can be directly transferred to the fabrication of high-channel-count BMIs and standardized for broader applications where interconnection between massively parallel interfaces is required.
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Techniques such as micro-rivet bonding and flip-chip bonding have been under development to enable scalable interface solutions with increased electrode density and improved electrical performance.
“With the increase of active interface systems that aim to increase electrode density and improve electrical performance, techniques such as micro-rivet bonding and flip-chip bonding have been under development to enable scalable interface solutions [210], [211].”
From Active Neural Interface Circuits and Systems for Selective Control of Peripheral Nerves: A Review (2024) · cites this paper as [211]
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Active Neural Interface Circuits and Systems for Selective Control of Peripheral Nerves: A Review
Habibollahi, M., Jiang, D., Lancashire, H. T., & Demosthenous, A. (2024) · IEEE Transactions on Biomedical Circuits and Systems · doi:10.1109/tbcas.2024.3430038 · Cited by 11 · see citing works
“With the increase of active interface systems that aim to increase electrode density and improve electrical performance, techniques such as micro-rivet bonding and flip-chip bonding have been under development to enable scalable interface solutions [210], [211].”
(2019) · International IEEE/EMBS Conference on Neural Engineering · doi:10.1109/ner.2019.8717015
- Authors
- Wang, P., Goh, T., Hemed, N., & Melosh, N.
- Affiliations
- Stanford University (US)
- Venue
- 2019 9th International IEEE/EMBS Conference on Neural Engineering (NER)
- Publisher
- IEEE
- Published
- 2019-03
- Volume
- 1701269
- Pages
- 863-866
- ISSN
- 1948-3554 (ISSN-L)
- OpenAlex
- W2946313478
- Cited by
- 2
- References
- 21
- Citations by year
- 2024: 1 · 2019: 1
- FWCI
- 1.01
- Type
- conference paper
- Language
- en
- Open access
- closed
- Licence
- Locations
- International IEEE/EMBS Conference on Neural Engineering (publishedVersion)
- Funders
- National Science Foundation
- Schweizerischer Nationalfonds zur Förderung der Wissenschaftlichen Forschung
- Division of Electrical, Communications and Cyber Systems
- Topics
- Life Sciences › Neuroscience › Cellular and Molecular Neuroscience › Neuroscience and Neural Engineering
- Physical Sciences › Engineering › Biomedical Engineering › Analog and Mixed-Signal Circuit Design
- Physical Sciences › Engineering › Electrical and Electronic Engineering › 3D IC and TSV technologies
- Keywords
- brain-computer interface, flip-chip bonding, high-density neural recording, neuroprosthetics, electrochemical impedance spectroscopy, device packaging, scalability
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