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Hybrid Integrated Platforms for Silicon Photonics
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A review of recent progress in hybrid integrated platforms for silicon photonics is presented. Integration of III-V semiconductors onto silicon-on-insulator substrates based on two different bonding techniques is compared, one comprising only inorganic materials, the other technique using an organic bonding agent. Issues such as bonding process and mechanism, bonding strength, uniformity, wafer surface requirement, and stress distribution are studied in detail. The application in silicon photonics to realize high-performance active and passive photonic devices on low-cost silicon wafers is discussed. Hybrid integration is believed to be a promising technology in a variety of applications of silicon photonics.
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“Integration proximity of the (dissimilar) materials in direct bonding facilitates superior optical coupling and heat transportation between them56.”
From Roadmapping the next generation of silicon photonics (2024) · cites this paper as [56]
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Moss, D. (2020) · OSF Preprints (OSF Preprints) · doi:10.31219/osf.io/pcuja
s photonic digital signal processing on real time video imagesPreprint
Moss, D. (2022) · doi:10.36227/techrxiv.20696023.v1
Metadata
- Authors
- Liang, D., Roelkens, G., Baets, R., & Bowers, J.
- Affiliations
- University of California, Santa Barbara (US)
- Photonics Research Group, IMEC - Ghent University, Sint-Pietersnieuwstraat 41, B-9000 Ghent, Belgium
- Ghent University (BE)
- Corresponding author
- Liang, Di
- Venue
- Materials
- Publisher
- MDPI AG
- Published
- 2010-03-12
- Volume
- 3
- Issue
- 3
- Pages
- 1782-1802
- ISSN
- 1996-1944 (ISSN-L)
- PMC
- PMC5445873
- OpenAlex
- W2112113449
- Cited by
- 316
- References
- 60
- Citations by year
- 2026: 6 · 2025: 19 · 2024: 17 · 2023: 20 · 2022: 27 · 2021: 21 · 2020: 18 · 2019: 15 · 2018: 27 · 2017: 23 · 2016: 26 · 2015: 28 · 2014: 25 · 2013: 19 · 2012: 14
- FWCI
- 11.10
- Type
- journal article
- Language
- en
- Open access
- gold
- doi.org
- Licence
- Locations
- Materials (publishedVersion, cc-by)
- Europe PMC (PubMed Central) (publishedVersion, cc-by)
- PubMed Central (publishedVersion, cc-by)
- Ghent University Academic Bibliography (Ghent University) (submittedVersion, other-oa)
- DOAJ (DOAJ: Directory of Open Access Journals) (submittedVersion)
- Funders
- Vlaamse regering
- Defense Advanced Research Projects Agency
- University of California, Santa Barbara
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Photonic and Optical Devices
- Physical Sciences › Engineering › Electrical and Electronic Engineering › 3D IC and TSV technologies
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Semiconductor Lasers and Optical Devices
- Keywords
- hybrid integration, silicon photonics, III-V on silicon, silicon-on-insulator, wafer bonding, bond strength, stress distribution, active photonic devices, passive optical components
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