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Hybrid Integrated Platforms for Silicon Photonics
Open accessAbstract
A review of recent progress in hybrid integrated platforms for silicon photonics is presented. Integration of III-V semiconductors onto silicon-on-insulator substrates based on two different bonding techniques is compared, one comprising only inorganic materials, the other technique using an organic bonding agent. Issues such as bonding process and mechanism, bonding strength, uniformity, wafer surface requirement, and stress distribution are studied in detail. The application in silicon photonics to realize high-performance active and passive photonic devices on low-cost silicon wafers is discussed. Hybrid integration is believed to be a promising technology in a variety of applications of silicon photonics.
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“Integration proximity of the (dissimilar) materials in direct bonding facilitates superior optical coupling and heat transportation between them56.”
From Roadmapping the next generation of silicon photonics (2024) · cites this paper as [56]
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Cites
Device Requirements for Optical Interconnects to Silicon Chips
Miller, D. A. B. (2009) · Proceedings of the IEEE · doi:10.1109/jproc.2009.2014298 · Cited by 2,000
Electrically pumped hybrid AlGaInAs-silicon evanescent laser
Fang, A. W., Park, H., Cohen, O., Jones, R., Paniccia, M. J., & Bowers, J. E. (2006) · Optics Express · doi:10.1364/oe.14.009203 · Cited by 1,244
Self-citationBonding of silicon wafers for silicon-on-insulator
Maszara, W., Goetz, G., Caviglia, A. L., & McKitterick, J. B. (1988) · Journal of Applied Physics · doi:10.1063/1.342443 · Cited by 878
Gösele, U., & Tong, Q.-Y. (1998) · Annual Review of Materials Science · doi:10.1146/annurev.matsci.28.1.215 · Cited by 600
SemiConductor Wafer Bonding: Science and Technology
Tong, Q., & Gösele, U. (1998) · Cited by 555
Campenhout, J. V., Romeo, P. R., Régreny, P., Seassal, C., Thourhout, D. V., Verstuyft, S., Cioccio, L. D., Fédéli, J.-M., Lagahe, C., & Baets, R. (2007) · Optics Express · doi:10.1364/oe.15.006744 · Cited by 513
Self-citationNiklaus, F., Stemme, G., Lu, J., & Gutmann, R. J. (2006) · Journal of Applied Physics · doi:10.1063/1.2168512 · Cited by 473
Magneto-optical isolator with silicon waveguides fabricated by direct bonding
Shoji, Y., Mizumoto, T., Yokoi, H., Hsieh, I.-W., & Osgood, R. M. (2008) · Applied Physics Letters · doi:10.1063/1.2884855 · Cited by 336
Miller, D. A. B., & Özaktaş, H. M. (1997) · Journal of Parallel and Distributed Computing · doi:10.1006/jpdc.1996.1285 · Cited by 290
Plasma-assisted InP-to-Si low temperature wafer bonding
Pasquariello, D. M., & Hjort, K. (2002) · IEEE Journal of Selected Topics in Quantum Electronics · doi:10.1109/2944.991407 · Cited by 250
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Metadata
- Authors
- Liang, D., Roelkens, G., Baets, R., & Bowers, J.
- Affiliations
- University of California, Santa Barbara (US)
- Photonics Research Group, IMEC - Ghent University, Sint-Pietersnieuwstraat 41, B-9000 Ghent, Belgium
- Ghent University (BE)
- Corresponding author
- Liang, Di
- Venue
- Materials
- Publisher
- MDPI AG
- Published
- 2010-03-12
- Volume
- 3
- Issue
- 3
- Pages
- 1782-1802
- ISSN
- 1996-1944 (ISSN-L)
- PMC
- PMC5445873
- OpenAlex
- W2112113449
- Cited by
- 316
- References
- 60
- Citations by year
- 2026: 6 · 2025: 19 · 2024: 17 · 2023: 20 · 2022: 27 · 2021: 21 · 2020: 18 · 2019: 15 · 2018: 27 · 2017: 23 · 2016: 26 · 2015: 28 · 2014: 25 · 2013: 19 · 2012: 14
- FWCI
- 11.10
- Type
- journal article
- Language
- en
- Open access
- gold
- doi.org
- Licence
- Locations
- Materials (publishedVersion, cc-by)
- Europe PMC (PubMed Central) (publishedVersion, cc-by)
- PubMed Central (publishedVersion, cc-by)
- Ghent University Academic Bibliography (Ghent University) (submittedVersion, other-oa)
- DOAJ (DOAJ: Directory of Open Access Journals) (submittedVersion)
- Funders
- Vlaamse regering
- Defense Advanced Research Projects Agency
- University of California, Santa Barbara
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Photonic and Optical Devices
- Physical Sciences › Engineering › Electrical and Electronic Engineering › 3D IC and TSV technologies
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Semiconductor Lasers and Optical Devices
- Keywords
- hybrid integration, silicon photonics, III-V on silicon, silicon-on-insulator, wafer bonding, bond strength, stress distribution, active photonic devices, passive optical components
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