Goodson, Kenneth E.

Nanoscale thermal transport. II. 2003–2012

Cahill, D. G., Braun, P. V., Chen, G., Clarke, D. R., Fan, S., Goodson, K. E., Keblinski, P., King, W. P., Mahan, G. D., Majumdar, A., et al. (2014) · Applied Physics Reviews

Thermal properties of materialsThermal Radiation and Cooling Technologies

Cited by 1,763

Phonon scattering in silicon films with thickness of order 100 nm

Ju, Y. S., & Goodson, K. E. (1999) · Applied Physics Letters

Thermal properties of materialsAdvancements in Semiconductor Devices and Circuit Design

Cited by 653

Thermometry and Thermal Transport in Micro/Nanoscale Solid-State Devices and Structures

Cahill, D. G., Goodson, K., & Majumdar, A. (2002) · Journal of Heat Transfer

Thermal properties of materialsThermography and Photoacoustic Techniques

Cited by 611

Thermal conduction in doped single-crystal silicon films

Asheghi, M., Kurabayashi, K., Kasnavi, R., & Goodson, K. E. (2002) · Journal of Applied Physics

Thermal properties of materialsSemiconductor materials and interfaces

Cited by 469

Phonon-boundary scattering in thin silicon layers

Asheghi, M., Leung, Y. K., Wong, S. S., & Goodson, K. E. (1997) · Applied Physics Letters

Thermal properties of materialsAdvancements in Semiconductor Devices and Circuit Design

Cited by 337

Thermal characterization of Bi2Te3/Sb2Te3 superlattices

Touzelbaev, M. N., Zhou, P., Venkatasubramanian, R., & Goodson, K. E. (2001) · Journal of Applied Physics

Advanced Thermoelectric Materials and DevicesThermal properties of materials

Cited by 151

Thermal Conduction in Silicon Micro- and Nanostructures

McConnell, A. D., & Goodson, K. E. (2005) · Annual Review of Heat Transfer

Thermal properties of materialsHeat Transfer and Numerical Methods

Cited by 138

Low Thermal Resistances at GaN–SiC Interfaces for HEMT Technology

Cho, J., Bozorg-Grayeli, E., Altman, D. H., Asheghi, M., & Goodson, K. E. (2012) · IEEE Electron Device Letters

GaN-based semiconductor devices and materialsThermal properties of materials

Cited by 109

Ordering Up the Minimum Thermal Conductivity of Solids

Goodson, K. E. (2007) · Science

Thermal properties of materialsThermal Radiation and Cooling Technologies

Cited by 79

Solid Layer Thermal-Conductivity Measurement Techniques

Goodson, K. E., & Flik, M. I. (1994) · Applied Mechanics Reviews

Thermal properties of materialsHeat Transfer and Numerical Methods

Cited by 75

Cooling Limits for GaN HEMT Technology

Won, Y., Cho, J., Agonafer, D., Asheghi, M., & Goodson, K. E. (2013) · 2013 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)

GaN-based semiconductor devices and materialsSilicon Carbide Semiconductor Technologies

Cited by 57

Thermal conduction in lattice–matched superlattices of InGaAs/InAlAs

Sood, A., Rowlette, J. A., Caneau, C. G., Bozorg-Grayeli, E., Asheghi, M., & Goodson, K. E. (2014) · Applied Physics Letters

Thermal properties of materialsThermal Radiation and Cooling Technologies

Cited by 44

Microchannel cooling strategies for high heat flux (1 kW/cm2) power electronic applications

Jung, K. W., Kharangate, C. R., Lee, H., Palko, J., Zhou, F., Asheghi, M., Dede, E. M., & Goodson, K. E. (2017) · 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Heat Transfer and Boiling StudiesHeat Transfer and Optimization

Cited by 39

Temperature Dependent Thermal Resistances at GaN-Substrate Interfaces in GaN Composite Substrates

Cho, J., Li, Y., Altman, D. H., Hoke, W. E., Asheghi, M., & Goodson, K. E. (2012) · 2012 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)

Thermal properties of materialsGaN-based semiconductor devices and materials

Cited by 22