Cited by 13Advancements in Photolithography TechniquesNanofabrication and Lithography TechniquesSurface Chemistry and Catalysis

The DOI matches its Crossref record; 44 of the 44 references it cites were found in a registry or an index.

Bottom-Up Nanofabrication with Extreme-Ultraviolet Light: Metal–Organic Frameworks on Patterned Monolayers

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Lugier, O., Thakur, N., Wu, L., Vockenhuber, M., Ekinci, Y., Castellanos, S.·2021·ACS Applied Materials & Interfaces

Abstract

The fabrication of integrated circuits with ever smaller (sub-10 nm) features poses fundamental challenges in chemistry and materials science. As smaller nanostructures are fabricated, thinner layers of materials are required, and surfaces and interfaces gain a more important role in the formation of nanopatterns. We present a new bottom-up approach in which we use the high optical resolution offered by extreme ultraviolet (EUV) lithography to print patterns on self-assembled monolayers (SAMs). Upon radiation, low-energy electrons induce chemical changes in the SAM so that the projected image is transferred to the substrate surface. We use the chemical differences between exposed and unexposed regions to promote a selective growth of hybrid structures that can act as an etch-resistant layer for further pattern transfer or can be used as functional nanostructures. The EUV doses required to promote selective growth on exposed areas are close to industrial requirements. Furthermore, this method allows for the independent tuning of different steps in the EUV lithography process (photo-induced chemistry, spatially resolved chemical contrast, and formation of nanopatterns), an advantage over current resists, in which the same material plays all roles.

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Crossref · 10.1021/acsami.1c13667

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  • MOF thickness can be controlled and scaled down.

    “MOFs, whose thickness can be controlled and scaled down, have shown promising results 74 .”

    From Extreme ultraviolet lithography (2024) · cites this paper as [74]

    In Step 3: SURMOF Growth (page unavailable), the paper reports that film thickness varies with EUV dose and discusses growth parameters that may affect it. This supports the possibility of influencing thickness, but the paper demonstrates nanoscale pattern widths, not that MOF thickness itself was deliberately scaled down. (LLM, conf=0.80)

    Experimental — accuracy not yet measured

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Research works printed but not linked: 2

  1. Moore, G. Cramming More Components onto Integrated Circuits, Reprinted from Electronics; IEEE, 1965; Vol. 38.
  2. IEEE International Roadmap for Devices and SystemsTM. https://irds.ieee.org, (accessed Jan 2, 2020).

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Metadata

Authors
Lugier, O., Thakur, N., Wu, L., Vockenhuber, M., Ekinci, Y., & Castellanos, S.
Affiliations
  • Advanced Research Center for Nanolithography (Netherlands) (NL)
  • Paul Scherrer Institute (CH)
Corresponding author
  • Lugier, O.
  • Castellanos, S.
Venue
ACS Applied Materials & Interfaces
Published
2021-08-31
Volume
13
Issue
36
Pages
43777-43786
ISSN
  • 1944-8244 (ISSN-L)
  • 1944-8252
OpenAlex
W3198531915
Cited by
13
References
44
Citations by year
2026: 3 · 2025: 3 · 2024: 2 · 2023: 3 · 2022: 2
FWCI
0.51
Type
journal article
Language
en
Open access
Locations
  • ACS Applied Materials & Interfaces (publishedVersion, cc-by-nc-nd)
  • PubMed (publishedVersion)
  • DORA PSI (Paul Scherrer Institute) (submittedVersion, cc-by-nc-nd)
  • ARCNL Institutional Repository (ARCNL) (submittedVersion)
Funders
H2020 Research Infrastructures (730872)
Topics
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Advancements in Photolithography Techniques
  • Physical Sciences › Materials Science › Surfaces, Coatings and Films › Nanofabrication and Lithography Techniques
  • Physical Sciences › Chemistry › Physical and Theoretical Chemistry › Surface Chemistry and Catalysis
Keywords
bottom-up nanofabrication, EUV lithography, metal-organic frameworks, self-assembled monolayers, low-energy electron irradiation, selective growth, nanopatterning, hybrid nanostructures, pattern transfer

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