Lithography gets extreme

Controlled fabrication of low-dimensional materials

Cheng, H., Tang, D., Zou, X., & Zhang, L. (2024) · Elsevier eBooks · doi:10.1016/b978-0-443-29046-6.00009-2

Selective surface patterning of Si3N4 ceramic by ultrasonic waves

Yi, S., Li, Z., Song, X., et al. (2024) · Surfaces and Interfaces · doi:10.1016/j.surfin.2024.105423

Dynamic deep-ultraviolet beam pattern structuring in nonlinear third harmonic generation by spatial wavefront modulation of near-infrared driving laser

Won, S., Kim, J., Kim, T., et al. (2025) · doi:10.1117/12.3041670

Iodinated underlayer for enhanced chemically amplified resist performance

Ku, Y., Choi, H., Kim, G., Lee, J., Kim, J., & Lee, S. (2025) · Advances in Patterning Materials and Processes · doi:10.1117/12.3051229 · Cited by 1

X-ray parametric down-conversion reveals EUV-polariton

Krebs, D., Kerker, F., Brockmüller, X., Sahle, C. J., Detlefs, B., Huotari, S., Rohringer, N., & Boemer, C. (2025) · Nature Communications · doi:10.1038/s41467-025-60845-8

Sub-wavelength interference lithography by multi-beam TM 0 /TE 0 modes excited by an MIM waveguide structure

Wu, X., Di, X., Wang, X., et al. (2025) · Journal of the Optical Society of America B · doi:10.1364/josab.564093

A Polarization-Independent Two-Dimensional Grating with Strong Process Robustness and High Diffraction EfficiencyPreprint

Wang, R.-W., Chi, Z., Yang, G., et al. (2025) · SSRN Electronic Journal · doi:10.2139/ssrn.5384666

Contamination on Extreme Ultraviolet Optics Induced by Xenon‐Based Electrodeless Z‐Pinch Plasma

Choe, E., Hwang, D., Yeom, H. J., et al. (2025) · Advanced Engineering Materials · doi:10.1002/adem.202500981

Device for Determining the Contour of the Visible Area of Optical Elements (Contourograph)

Artuhov, A. I., Glushkov, E. I., Mikhailenko, M. S., et al. (2025) · Journal of Surface Investigation X-ray Synchrotron and Neutron Techniques · doi:10.1134/s1027451025700612

A polarization-independent two-dimensional grating with strong process robustness and high diffraction efficiency

Wang, R.-W., Chi, Z., Yang, G., et al. (2025) · Optics & Laser Technology · doi:10.1016/j.optlastec.2025.113966

Numerical study of DP-LPP: Effects of laser wavelength and external magnetic fields on absorption of the main laser pulse

Ren, C., Yuan, Y. N., Sun, W., et al. (2025) · Physics of Plasmas · doi:10.1063/5.0288229

Free-standing hybrid Zr/NGF filter for high-power EUV purification in EUV lithographyPreprint

Shin, D., Jeong, M. J., Nam, K.-B., et al. (2025) · SSRN Electronic Journal · doi:10.2139/ssrn.5600040

基于共线三倍频与近场干涉技术的飞秒紫外脉冲产生与相位同步系统设计与研制（特邀）

Baicheng, 王. W., Hongyang, 李. L., Kai, 杨. Y., et al. (2025) · Chinese Journal of Lasers · doi:10.3788/cjl251376

Output feedback stabilization of a class of hyperbolic–parabolic coupled system

Guo, Q., & Jin, F. (2026) · Control Theory and Technology · doi:10.1007/s11768-025-00305-2

Deep learning across optical system workflow: a comprehensive review from design to assembly

Nie, Y., Su, R., Thibault, S., Menke, C., Erps, J. V., Hugo Thienpont, A., & Ottevaere, H. (2026) · Journal of Physics Photonics · doi:10.1088/2515-7647/ae3f6b · Cited by 1

Graphene-Based Multilayer Composites as a Promising Solution for Next-Generation EUV Pellicles

Kim, D. J., Yoon, J., Jeon, H., et al. (2026) · doi:10.23919/panpacific70217.2026.11413896

Multilayer monochromators for EUV and X-ray optics and the interface characterization

Tu, Y. (2015) · doi:10.70675/00d1a896zff2az4f2czbc7ez0c8b09b1d291

Nanolithographie par sonde locale catalytique : une approche bottom-up pour la nanostructuration de surfaces organominérales

Botton, J. (2015) · doi:10.70675/6dc0b6b4z675ez4d15z9f2czdd8342921be5

Comparison of ND:YAG and CO2 laser produced platinum plasmas

Mohammed, Z. A., & Mahdi, W. H. (2026) · AIP conference proceedings · doi:10.1063/5.0319352

3D high density memory based on emering resistive technologies : circuit and architecture design

Levisse, A. (2017) · theses.fr (ABES) · doi:10.70675/8f85946ez1b96z4275z8648z3d63e5e267fc

Mise en phase active de fibres laser en régime femtoseconde par méthode interférométrique

Dortz, J. L. (2018) · doi:10.70675/324f9234zddb9z449cz9b05z5043caae3671

Approche haut niveau pour l’accélération d’algorithmes sur des architectures hétérogènes CPU/GPU/FPGA. Application à la qualification des radars et des systèmes d’écoute électromagnétique

Martelli, M. (2019) · doi:10.70675/81d6ca31z24b9z4390za1d0z2e035dc7ad16

VO2 nanostructures for dynamically tunable nanophotonic devices

John, J. (2020) · theses.fr (ABES) · doi:10.70675/a45f1460z7842z4de7z88cezb147c1aa4dca

Adaptive observer and control design of different classes ofcoupled partial differential equations

Ghousein, M. (2020) · doi:10.70675/5d30a84dzdaf5z43d3z962az463b11989817

Twisted High-order Harmonics : Generation, Characterization, and Amplification in XRL-plasma

Pandey, A. K. (2022) · theses.fr (ABES) · doi:10.70675/f9869e99z94fez4732zbf4fz14659a151885

Digital phase-shift mask projection lithography enabling sub-diffraction-limit resolution for dense nanoscale patterning

Zhao, Y.-Y., Liang, Z.-X., Chen, J.-T., Li, W. H., Wu, Z., & Duan, X. (2026) · Light Advanced Manufacturing · doi:10.37188/lam.2026.080

Hydrophilicity-Tuned Iodine-Containing Quasi-Alternating Copolymers for Extreme Ultraviolet Lithography

Wy, G., Ku, Y., Choi, H.-E., Lee, G., Kim, M., Kim, G., Lee, J., Lee, J.-K., Kim, J., Lee, S., et al. (2026) · ACS Applied Polymer Materials · doi:10.1021/acsapm.6c00652

High-sensitivity extreme ultraviolet photoresists based on heteroleptic Sn complexes

Baek, J. H., Kim, J., Choi, Y., Koh, C., Park, C., Yi, S., & You, Y. (2026) · Chemical Engineering Journal · doi:10.1016/j.cej.2026.177523 · Cited by 1

A theoretical study of terbium plasma tb for extreme ultraviolet emission (BEUV)

Jassim, S. A., & Mahdi, W. H. (2026) · AIP conference proceedings · doi:10.1063/5.0331011

Multi-Step Flow Synthesis of Photoresist Polymers Involving Copolymerization and Postpolymerization Modifications

Kwon, K.-Y., Choi, S., Woo, J.-H., et al. (2026) · Organic Process Research & Development · doi:10.1021/acs.oprd.6c00101

Defect annihilation in block copolymer nanopatterning through solvent immersion annealing

Kim, M. S., Bae, S., Choi, S. H., & Kim, S. Y. (2026) · Nanoscale · doi:10.1039/d6nr01356b

Synergistic Tripartite Molecular Design of Halogen‐Engineered Organotin Clusters Enabling 10 mJ cm−2 EUV Lithography

Huang, X., Zheng, L.-F., Chen, H., Gong, X.-F., Guo, H., Wang, W., Tang, Y.-T., Huang, Z., Zhao, J., Zhu, H., et al. (2026) · Advanced Functional Materials · doi:10.1002/adfm.77153

Wafer Support Systems (WSSs) as Beam–Matter Interaction Platforms: Electrostatic Chucking, Thermal Transport, Metrology Coupling, Industrial Architectures, and Emerging Semiconductor Platforms

Alshehabi, A., AlMutawa, J., & Hammad, M. A. (2026) · Quantum Beam Science · doi:10.3390/qubs10030017

Resolving the blueshift in calculations of the EUV spectrum of multiply charged tin ions

Reitsma, M. L., Sheil, J., Versolato, O. O., et al. (2026) · Physical Review A · doi:10.1103/v557-qqql

From Lithography to Nanoimprint: Physics-Based, Data-Driven, and Hybrid Frameworks for Defect Prediction in Advanced Patterning Technologies

Chien, J.-W., & Lee, E. (2026) · Electronics · doi:10.3390/electronics15153355

Closed-form analytical method for tolerance effects in off-axis reflective multi-mirror systems based on Fermat’s principle

Xu, T., Xu Yang, L. I., Wen, D., et al. (2026) · Optics Express · doi:10.1364/oe.607964

Physics-informed deep learning inversion of EUV multilayer defects using TSOM

Gong, W., Li, X., Zhou, M., et al. (2026) · Optics Express · doi:10.1364/oe.604432

Advances in Semiconductor Materials and Devices: Beyond the Silicon Horizon

Ramesh, R., & Nagarajan, S. (2026) · IntechOpen eBooks · doi:10.5772/intechopen.1014039

Research status of discharge-produced plasma EUV light sources

Jia, H., Zhang, J., & Zou, X. (2026) · Pulsed Power · doi:10.1016/j.pup.2026.100024

3D-printed copper water cooling system assisted fabrication of 10.6-μm high-power CO2 laser resistance reflectors

Jiao, H., Jiang, B., Niu, X., et al. (2026) · Opto-Electronic Advances · doi:10.29026/oea.2026.250297

P‐4.16: Broadband EUV Focusing Metalens Based on Nanohole Arrays in Aluminum Film

Chen, K., Wanghui, Wang, G., et al. (2026) · SID Symposium Digest of Technical Papers · doi:10.1002/sdtp.70003_331

Laboratory-scale dual-pulse laser-produced plasma extreme ultraviolet source with continuous target replenishment using a tin-coated rotating disk

Hwang, D., Kim, W., Han, S., Choe, E., Kim, Y.-G., Yun, H., Jo, S.-P., Chegal, W., Kang, S.-W., Park, S., et al. (2026) · Vacuum · doi:10.1016/j.vacuum.2026.115811

Thermodynamic scaling laws and ionization kinetics of laser-produced tin plasmas at various pressures and irradiating laser energies

Song, Z., Xu, Q., Sun, C., et al. (2026) · Science China Physics Mechanics and Astronomy · doi:10.1007/s11433-026-3073-9

Wafer alignment measurement using vortex beam interferometry and double diffraction by the same grating

Zhou, L., Chen, L., Li, Z., et al. (2026) · Optics Express · doi:10.1364/oe.612726

Irradiation-Source-Dependent Tone Conversion in Dry-Deposited Halogenated Amorphous Zeolitic Imidazolate Framework Resistsfor Electron-Beam and Extreme Ultraviolet Lithography

Byeon, J., Gys, N., Smets, J., Azimi, A., Nulens, L., Fernandes, J., Boullart, L., Kim, D., Dorney, K. M., Gándara-Loe, J., et al. (2026) · ACS Applied Materials & Interfaces · doi:10.1021/acsami.6c16414

Form Measurement of a 300 mm Ellipsoidal Binary Grating Using a Spatio-Temporal Fourier Method

Xun, H., Ordoñes, S., & Su, R. (2026) · Nanomanufacturing and Metrology · doi:10.1007/s41871-026-00319-7

Financial Resources and Technology to Transition to 450mm Semiconductor Wafer Foundries

Pastore, T. E. (2014) · ScholarWorks (Walden University)

The potential of EUV lithography

Levinson, H. (2019) · European Mask and Lithography Conference (EMLC) · doi:10.1117/12.2528446 · Cited by 16

Towards manufacturing a 10nm node device with complementary EUV lithography

Hermans, J. V., Dai, H., Niroomand, A., et al. (2013) · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · doi:10.1117/12.2012136 · Cited by 6

Comparative study of DRAM cell patterning between ArF immersion and EUV lithography

Eom, T.-S., Park, S., Park, J.-T., et al. (2009) · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · doi:10.1117/12.814378 · Cited by 11

EUV lithography at the 22nm technology node

Wood, O. R., Koay, C.-S., Petrillo, K. E., et al. (2010) · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · doi:10.1117/12.847049 · Cited by 22

Patterning challenges in setting up a 16nm node 6T-SRAM device using EUV lithography

Vandeweyer, T., Backer, J. D., Versluijs, J., et al. (2011) · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · doi:10.1117/12.881690 · Cited by 13