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Thermal conductance of interfaces between highly dissimilar materials
Abstract
The thermal conductance of interfaces between materials with low Debye temperatures (Pb or Bi) and dielectrics or semiconductors with high Debye temperatures (hydrogen-terminated Si, $\mathrm{Si}{\mathrm{O}}_{2}$, the native oxide of Be, sapphire, or hydrogen-terminated diamond) is measured using time-domain thermoreflectance. The interface thermal conductance $G$ for these combinations of materials falls within a relatively narrow range, $8<G<30\phantom{\rule{0.3em}{0ex}}\mathrm{MW}\phantom{\rule{0.2em}{0ex}}{\mathrm{m}}^{\ensuremath{-}2}\phantom{\rule{0.2em}{0ex}}{\mathrm{K}}^{\ensuremath{-}1}$, at room temperature. Because the thermal conductance of interfaces with Bi, a semimetal, and interfaces with Pb, a metal, are similar, we conclude that the coupling of electrons in a metal to phonons in a dielectric substrate does not contribute significantly to the thermal transport at interfaces. For Pb or Bi on hydrogen-terminated diamond, the measured conductance greatly exceeds the radiation limit and decreases approximately linearly with decreasing temperature, suggesting that anharmonic processes dominate the transfer of thermal energy across interfaces between materials with highly dissimilar spectra of lattice vibrations.
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“The heat capacity of new materials 38, 39 and thermal conductance of various solid/solid interfaces 40-47 have also been frequently measured using TDTR.”
From Tutorial: Time-domain thermoreflectance (TDTR) for thermal property characterization of bulk and thin film materials (2018) · cites this paper as [41]
In the citing paper
“The lowest thermal conductance was reported for the interface between Bi and hydrogen-terminated diamond, with a value of ~8 MW m -2 K -1 at room temperature, 41”
From Tutorial: Time-domain thermoreflectance (TDTR) for thermal property characterization of bulk and thin film materials (2018) · cites this paper as [41]
In the citing paper
“TDTR technique is therefore implemented extensively to study the thermal transport mechanisms across interfaces, including the effect of surface chemistry on interfacial thermal conductance across functionalized liquid-solid boundary[95,117,118] and solid-solid interfaces[119], interfacial thermal conductance between metals and dielectrics,[120][121][122][123][124] and interface between low dim”
From Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials (2016) · cites this paper as [119]
Citations
Cites
Swartz, E. T., & Pohl, R. O. (1989) · Reviews of Modern Physics · doi:10.1103/revmodphys.61.605 · Cited by 2,992
Cahill, D. G., Ford, W. K., Goodson, K. E., Mahan, G. D., Majumdar, A., Maris, H. J., Merlin, R., & Phillpot, S. R. (2003) · Journal of Applied Physics · doi:10.1063/1.1524305 · Cited by 2,825
Self-citationAnalysis of heat flow in layered structures for time-domain thermoreflectance
Cahill, D. G. (2004) · Review of Scientific Instruments · doi:10.1063/1.1819431 · Cited by 1,543
Self-citationAnharmonic Decay of Optical Phonons
Klemens, P. G. (1966) · Physical Review · doi:10.1103/physrev.148.845 · Cited by 1,051
2002 ASME International Mechanical Engineering Congress and Exposition
Wu, S. F. (2003) · The Journal of the Acoustical Society of America · doi:10.1121/1.1586287 · Cited by 651
Kapitza conductance and heat flow between solids at temperatures from 50 to 300 K
Stoner, R. J., & Maris, H. J. (1993) · Physical Review B · doi:10.1103/physrevb.48.16373 · Cited by 646
Thermal conductance of epitaxial interfaces
Costescu, R. M., Wall, M. A., & Cahill, D. G. (2003) · Physical Review B · doi:10.1103/physrevb.67.054302 · Cited by 486
Self-citationAnharmonic Phonon Lifetimes in Semiconductors from Density-Functional Perturbation Theory
Debernardi, A., Stefano Baroni, A., & Molinari, E. (1995) · Physical Review Letters · doi:10.1103/physrevlett.75.1819 · Cited by 379
Electron Diffusion in Metals Studied by Picosecond Ultrasonics
Tas, G., & Maris, H. J. (1994) · Physical Review B · doi:10.1103/physrevb.49.15046 · Cited by 344
Crystal Dynamics of Lead. I. Dispersion Curves at 100°K
Brockhouse, B. N., Arase, T., Caglioti, G., Rao, K. R., & Woods, A. D. B. (1962) · Physical Review · doi:10.1103/physrev.128.1099 · Cited by 307
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Komine, T., Kuraishi, M., Teramoto, T., Sugita, R., Hasegawa, Y., Murata, M., & Nakamura, D. (2010) · Journal of Electronic Materials · doi:10.1007/s11664-010-1266-5 · Cited by 7
Shin, E.-C., Mun, J.-H., Baek, S., Jung, J., & Kim, Y. (2023) · Chemical Physics Reviews · doi:10.1063/5.0147372 · Cited by 7
Witte, T., Frigge, T., Hafke, B., Krenzer, B., & Hoegen, M. H. (2017) · Applied Physics Letters · doi:10.1063/1.4986509 · Cited by 7
Phonon optimized interatomic potential for aluminum
Muraleedharan, M. G., Rohskopf, A., Yang, V., & Henry, A. S. (2017) · AIP Advances · doi:10.1063/1.5003158 · Cited by 7
High-throughput transient thermal interface testing method using time-domain thermal response
Hao, M., & Fisher, T. S. (2018) · International Journal of Heat and Mass Transfer · doi:10.1016/j.ijheatmasstransfer.2018.07.081 · Cited by 7
Myers, K., Gaddam, P. R., Ding, X., Kochergin, V., Huxtable, S. T., & Robinson, H. D. (2018) · International Journal of Thermophysics · doi:10.1007/s10765-018-2458-0 · Cited by 7
Design Considerations for Miniaturized Steady-State Thermal Characterization Instruments
Warzoha, R. J., Smith, A. N., Boteler, L. M., & Bajwa, A. (2018) · IEEE Transactions on Components Packaging and Manufacturing Technology · doi:10.1109/tcpmt.2017.2786542 · Cited by 7
Diroll, B. T., Mannodi‐Kanakkithodi, A., Chan, M. K. Y., & Schaller, R. D. (2019) · Nano Letters · doi:10.1021/acs.nanolett.9b03502 · Cited by 7
Monitoring anharmonic phonon transport across interfaces in one-dimensional lattice chains
Fang, J., Qian, X., Zhao, C., Li, B., & Gu, X. (2020) · Physical review. E · doi:10.1103/physreve.101.022133 · Cited by 7
Zhou, Y., Li, C., Broido, D., & Shi, L. (2021) · Review of Scientific Instruments · doi:10.1063/5.0061049 · Cited by 7
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Seshadri, I. P., Gardner, A., Mehta, R. J., Swartwout, R., Keblinski, P., Borca-Tasciuc, T., & Ramanath, G. (2013) · Applied Physics Letters · doi:10.1063/1.4805070 · Cited by 7
Xu, J., Du, S., & Zhang, Y. (2025) · Scientific Reports · doi:10.1038/s41598-025-90386-5 · Cited by 6
Predicting Interfacial Thermal Resistance by Ensemble Learning
Chen, M., Li, J., Tian, B., Al‐Hadeethi, Y., Arkook, B., Tian, X., & Zhang, X. (2021) · Computation · doi:10.3390/computation9080087 · Cited by 6
Luo, X., & Wang, H. (2022) · Materials · doi:10.3390/ma15155385 · Cited by 6
Molecular evolution mechanism of flow-induced crystallization in polyphenylene sulfide
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Thermal Engineering at the Limits of the CMOS Era
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Meilakhs, A., & Semak, B. V. (2021) · physica status solidi (b) · doi:10.1002/pssb.202100018 · Cited by 6
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Landry, E. S. (2009) · Cited by 6
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Thermal wave propagation in thin films on substrate: the time‐harmonic thermal transfer function
Straube, H., Breitenstein, O., & Wagner, J. ‐. (2011) · physica status solidi (b) · doi:10.1002/pssb.201147014 · Cited by 6
Thermal transport in AB superlattices
Mahan, G. D. (2011) · Physical Review B · doi:10.1103/physrevb.83.125313 · Cited by 6
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Belkacemi, G., & Bourahla, B. (2017) · International Journal of Modern Physics B · doi:10.1142/s0217979217501557 · Cited by 6
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Yang, Y., Watanabe, H., Ueda, M., Hayashi, M., Susa, M., & Endo, R. (2018) · ISIJ International · doi:10.2355/isijinternational.isijint-2018-380 · Cited by 6
Ferrer-Argemi, L., Yu, Z., & Lee, J. (2019) · Journal of Applied Physics · doi:10.1063/1.5099507 · Cited by 6
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Zhang, P., Zhang, X., Ding, X., Wang, Y., Shu, M., Zeng, X., Gong, Y. H., Zheng, K., & Tian, X. (2020) · Nanotechnology · doi:10.1088/1361-6528/abaf82 · Cited by 6
Gamba, I. M., Li, Q., & Nair, A. (2022) · SIAM Journal on Applied Mathematics · doi:10.1137/20m1381666 · Cited by 6
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Song, J., Li, Y., Du, F., Xie, X., Huang, Y. Y., & Rogers, J. A. (2015) · Journal of Applied Physics · doi:10.1063/1.4919591 · Cited by 6
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Igamberdiev, K. T., Yuldashev, S. U., Cho, H. D., Kang, T.-W., Rakhimova, S. M., & Akhmedov, T. K. (2012) · Journal of the Korean Physical Society · doi:10.3938/jkps.60.1513 · Cited by 6
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Koh, Y. K. (2012) · Springer eBooks · doi:10.1007/978-90-481-9751-4_277 · Cited by 8
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Zhuldassov, N., Bairamkulov, R., & Friedman, E. G. (2024) · Cryogenics · doi:10.1016/j.cryogenics.2024.104013 · Cited by 5
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Chen, L., Wang, W., Zhan, X., Zhou, K., Gao, Z., Liang, L., Zhou, T., Du, Y., & Liu, R. (2022) · Physical review. B./Physical review. B · doi:10.1103/physrevb.105.104413 · Cited by 5
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Kodama, T., Park, W., Marconnet, A. M., Lee, J., Asheghi, M., & Goodson, K. E. (2012) · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · doi:10.1109/itherm.2012.6231437 · Cited by 5
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Cheng, Z., Yates, L., Shi, J., Tadjer, M. J., Hobart, K. D., & Graham, S. L. (2019) · arXiv (Cornell University) · doi:10.48550/arxiv.1901.02961 · Cited by 5
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Wang, W., Wu, X. Q., Wu, Y., Volz, S. G., Takagi, T., & Nomura, M. (2026) · Materials Today Physics · doi:10.1016/j.mtphys.2026.102057 · Cited by 4
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Kang, S. D., Yoo, J., Lyeo, H.-K., Song, J. Y., Lee, S., & Yu, J. W. (2011) · Journal of Applied Physics · doi:10.1063/1.3606559 · Cited by 4
Self-citationZhao, H., Guo, S., Zhong, W., Zhang, S., Tao, L., & Zeng, H. (2022) · Elsevier eBooks · doi:10.1016/b978-0-12-823824-0.00013-7 · Cited by 4
Castellano, A., Alhada–Lahbabi, K., Arregi, J. A., Uhlíř, V., Perrin, B., Gourdon, C., Fournier, D., Verstraete, M. J., & Thevenard, L. (2024) · Physical Review Materials · doi:10.1103/physrevmaterials.8.084411 · Cited by 4
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Kato, R., Xu, Y., & Goto, M. (2011) · Japanese Journal of Applied Physics · doi:10.1143/jjap.50.046602 · Cited by 4
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Ge, Z. (2006) · Cited by 4
Tan, C. M., Chen, S. J., & Kong, J. (2013) · IEEE Transactions on Nanotechnology · doi:10.1109/tnano.2013.2280137 · Cited by 4
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Norris, P. M., Smoyer, J. L., Duda, J. C., & Hopkins, P. E. (2010) · ASME 2012 10th International Conference on Nanochannels, Microchannels, and Minichannels collocated with the ASME 2012 Heat Transfer Summer Conference and the ASME 2012 Fluids Engineering Division Summer Meeting · doi:10.1115/fedsm-icnmm2010-30171 · Cited by 3
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Ozatay, O., Gokce, A., Hauet, T., Folks, L., Giordano, A., & Finocchio, G. (2019) · Physical Review Applied · doi:10.1103/physrevapplied.11.014002 · Cited by 3
Methods Used to Determine Heat Transport and Related Properties, With Comparisons
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Féliciano, M. D. S., Adessi, C., Hajj, J. E., Horny, N., Detcheverry, F., Cobián, M., & Mérabia, S. (2025) · Physical review. B./Physical review. B · doi:10.1103/94kx-5l8h · Cited by 2
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Donovan, B., Jensen, W. A., Chen, L., Giri, A., Poon, S. J., Floro, J. A., & Hopkins, P. E. (2018) · Applied Physics Letters · doi:10.1063/1.5019269 · Cited by 2
Lin, Z., & Dang, H. (2022) · Journal of Applied Physics · doi:10.1063/5.0076280 · Cited by 2
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Xiong, Y., Li, S., Wang, R., Cheng, Z., Yang, J., Li, D., Liu, X., & Xu, D. (2024) · ACS Applied Materials & Interfaces · doi:10.1021/acsami.4c10789 · Cited by 2
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Vega-Flick, A., Pech-May, N. W., Cervantes-Alvarez, F., Estevez, J. O., & Alvarado-Gil, J. J. (2018) · Journal of Applied Physics · doi:10.1063/1.5037229 · Cited by 2
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English, T. S., Duda, J. C., Jordan, D. A., Norris, P. M., & Zhigilei, L. V. (2010) · International Heat Transfer Conference (IHTC) · doi:10.1115/ihtc14-22953 · Cited by 2
Edtmaier, C., Bauer, E., Tako, Z. S., & Segl, J. (2015) · Materials science forum · doi:10.4028/www.scientific.net/msf.825-826.197 · Cited by 2
Kapitza resistance for nanoscale crystalline and amorphous silicon carbide
Xiao, C., He, H., Li, J., & Zhu, W. (2018) · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · doi:10.1109/eurosime.2018.8369871 · Cited by 2
On the interfacial thermal conductance of a ferromagnetic metal junction
Juarez-Acosta, I., Olivares-Robles, M. Á., & Chanona‐Pérez, J. J. (2018) · Journal of Physics D Applied Physics · doi:10.1088/1361-6463/aaca20 · Cited by 2
Materials issues in thermal modeling of thin film electrocaloric solid-state refrigerators
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Metadata
- Authors
- Lyeo, H.-K., & Cahill, D. G.
- Affiliations
- University of Illinois Urbana-Champaign (US)
- Venue
- Physical Review B
- Publisher
- American Physical Society (APS)
- Published
- 2006-04-03
- Volume
- 73
- Issue
- 14
- ISSN
- 1098-0121 (ISSN-L)
- 1550-235X
- OpenAlex
- W2004164487
- Cited by
- 576
- References
- 28
- Citations by year
- 2026: 19 · 2025: 33 · 2024: 26 · 2023: 19 · 2022: 38 · 2021: 34 · 2020: 31 · 2019: 47 · 2018: 48 · 2017: 31 · 2016: 34 · 2015: 31 · 2014: 26 · 2013: 30 · 2012: 26
- FWCI
- 9.83
- Type
- journal article
- Language
- en
- Open access
- closed
- Locations
- Physical Review B (publishedVersion)
- Funders
- National Science Foundation
- U.S. Department of Energy
- Topics
- Physical Sciences › Materials Science › Materials Chemistry › Thermal properties of materials
- Physical Sciences › Engineering › Civil and Structural Engineering › Thermal Radiation and Cooling Technologies
- Physical Sciences › Engineering › Mechanics of Materials › Thermography and Photoacoustic Techniques
- Keywords
- interface thermal conductance, metal-dielectric interface, lead, bismuth, hydrogen-terminated diamond, hydrogen-terminated silicon, silica, beryllium oxide, sapphire, electron-phonon coupling, radiation dose limits, lattice vibrations, time-domain thermoreflectance
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