The DOI matches its Crossref record; 28 of the 28 references it cites were found in a registry or an index.
Thermal conductance of interfaces between highly dissimilar materials
Abstract
The thermal conductance of interfaces between materials with low Debye temperatures (Pb or Bi) and dielectrics or semiconductors with high Debye temperatures (hydrogen-terminated Si, $\mathrm{Si}{\mathrm{O}}_{2}$, the native oxide of Be, sapphire, or hydrogen-terminated diamond) is measured using time-domain thermoreflectance. The interface thermal conductance $G$ for these combinations of materials falls within a relatively narrow range, $8<G<30\phantom{\rule{0.3em}{0ex}}\mathrm{MW}\phantom{\rule{0.2em}{0ex}}{\mathrm{m}}^{\ensuremath{-}2}\phantom{\rule{0.2em}{0ex}}{\mathrm{K}}^{\ensuremath{-}1}$, at room temperature. Because the thermal conductance of interfaces with Bi, a semimetal, and interfaces with Pb, a metal, are similar, we conclude that the coupling of electrons in a metal to phonons in a dielectric substrate does not contribute significantly to the thermal transport at interfaces. For Pb or Bi on hydrogen-terminated diamond, the measured conductance greatly exceeds the radiation limit and decreases approximately linearly with decreasing temperature, suggesting that anharmonic processes dominate the transfer of thermal energy across interfaces between materials with highly dissimilar spectra of lattice vibrations.
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“The heat capacity of new materials 38, 39 and thermal conductance of various solid/solid interfaces 40-47 have also been frequently measured using TDTR.”
From Tutorial: Time-domain thermoreflectance (TDTR) for thermal property characterization of bulk and thin film materials (2018) · cites this paper as [41]
In the citing paper
“The lowest thermal conductance was reported for the interface between Bi and hydrogen-terminated diamond, with a value of ~8 MW m -2 K -1 at room temperature, 41”
From Tutorial: Time-domain thermoreflectance (TDTR) for thermal property characterization of bulk and thin film materials (2018) · cites this paper as [41]
In the citing paper
“TDTR technique is therefore implemented extensively to study the thermal transport mechanisms across interfaces, including the effect of surface chemistry on interfacial thermal conductance across functionalized liquid-solid boundary[95,117,118] and solid-solid interfaces[119], interfacial thermal conductance between metals and dielectrics,[120][121][122][123][124] and interface between low dim”
From Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials (2016) · cites this paper as [119]
Citations
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Cahill, D. G., Braun, P. V., Chen, G., Clarke, D. R., Fan, S., Goodson, K. E., Keblinski, P., King, W. P., Mahan, G. D., Majumdar, A., et al. (2014) · Applied Physics Reviews · doi:10.1063/1.4832615 · Cited by 1,763
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Pop, E. (2010) · Nano Research · doi:10.1007/s12274-010-1019-z · Cited by 1,308
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Chen, J., Xu, X., Zhou, J., & Li, B. (2022) · Reviews of Modern Physics · doi:10.1103/revmodphys.94.025002 · Cited by 759
High thermal conductivity in cubic boron arsenide crystals
Li, S., Zheng, Q., Lv, Y., Liu, X., Wang, X., Huang, P. Y., Cahill, D. G., & Lv, B. (2018) · Science · doi:10.1126/science.aat8982 · Cited by 600
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Metadata
- Authors
- Lyeo, H.-K., & Cahill, D. G.
- Affiliations
- University of Illinois Urbana-Champaign (US)
- Venue
- Physical Review B
- Publisher
- American Physical Society (APS)
- Published
- 2006-04-03
- Volume
- 73
- Issue
- 14
- ISSN
- 1098-0121 (ISSN-L)
- 1550-235X
- OpenAlex
- W2004164487
- Cited by
- 576
- References
- 28
- Citations by year
- 2026: 19 · 2025: 33 · 2024: 26 · 2023: 19 · 2022: 38 · 2021: 34 · 2020: 31 · 2019: 47 · 2018: 48 · 2017: 31 · 2016: 34 · 2015: 31 · 2014: 26 · 2013: 30 · 2012: 26
- FWCI
- 9.83
- Type
- journal article
- Language
- en
- Open access
- closed
- Locations
- Physical Review B (publishedVersion)
- Funders
- National Science Foundation
- U.S. Department of Energy
- Topics
- Physical Sciences › Materials Science › Materials Chemistry › Thermal properties of materials
- Physical Sciences › Engineering › Civil and Structural Engineering › Thermal Radiation and Cooling Technologies
- Physical Sciences › Engineering › Mechanics of Materials › Thermography and Photoacoustic Techniques
- Keywords
- interface thermal conductance, metal-dielectric interface, lead, bismuth, hydrogen-terminated diamond, hydrogen-terminated silicon, silica, beryllium oxide, sapphire, electron-phonon coupling, radiation dose limits, lattice vibrations, time-domain thermoreflectance
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