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Thermal conductance of interfaces between highly dissimilar materials

Lyeo, Ho-Ki, Cahill, David G.·2006·Physical Review B

DOI 10.1103/physrevb.73.144301

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Abstract

The thermal conductance of interfaces between materials with low Debye temperatures (Pb or Bi) and dielectrics or semiconductors with high Debye temperatures (hydrogen-terminated Si, $\mathrm{Si}{\mathrm{O}}_{2}$, the native oxide of Be, sapphire, or hydrogen-terminated diamond) is measured using time-domain thermoreflectance. The interface thermal conductance $G$ for these combinations of materials falls within a relatively narrow range, $8<G<30\phantom{\rule{0.3em}{0ex}}\mathrm{MW}\phantom{\rule{0.2em}{0ex}}{\mathrm{m}}^{\ensuremath{-}2}\phantom{\rule{0.2em}{0ex}}{\mathrm{K}}^{\ensuremath{-}1}$, at room temperature. Because the thermal conductance of interfaces with Bi, a semimetal, and interfaces with Pb, a metal, are similar, we conclude that the coupling of electrons in a metal to phonons in a dielectric substrate does not contribute significantly to the thermal transport at interfaces. For Pb or Bi on hydrogen-terminated diamond, the measured conductance greatly exceeds the radiation limit and decreases approximately linearly with decreasing temperature, suggesting that anharmonic processes dominate the transfer of thermal energy across interfaces between materials with highly dissimilar spectra of lattice vibrations.

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Swartz, E. T., & Pohl, R. O. (1989) · Reviews of Modern Physics · doi:10.1103/revmodphys.61.605 · Cited by 2,992
Nanoscale Thermal Transport
Cahill, D. G., Ford, W. K., Goodson, K. E., Mahan, G. D., Majumdar, A., Maris, H. J., Merlin, R., & Phillpot, S. R. (2003) · Journal of Applied Physics · doi:10.1063/1.1524305 · Cited by 2,825
Self-citation
Analysis of heat flow in layered structures for time-domain thermoreflectance
Cahill, D. G. (2004) · Review of Scientific Instruments · doi:10.1063/1.1819431 · Cited by 1,543
Self-citation
Anharmonic Decay of Optical Phonons
Klemens, P. G. (1966) · Physical Review · doi:10.1103/physrev.148.845 · Cited by 1,051
2002 ASME International Mechanical Engineering Congress and Exposition
Wu, S. F. (2003) · The Journal of the Acoustical Society of America · doi:10.1121/1.1586287 · Cited by 651
Kapitza conductance and heat flow between solids at temperatures from 50 to 300 K
Stoner, R. J., & Maris, H. J. (1993) · Physical Review B · doi:10.1103/physrevb.48.16373 · Cited by 646
Thermal conductance of epitaxial interfaces
Costescu, R. M., Wall, M. A., & Cahill, D. G. (2003) · Physical Review B · doi:10.1103/physrevb.67.054302 · Cited by 486
Self-citation
Anharmonic Phonon Lifetimes in Semiconductors from Density-Functional Perturbation Theory
Debernardi, A., Stefano Baroni, A., & Molinari, E. (1995) · Physical Review Letters · doi:10.1103/physrevlett.75.1819 · Cited by 379
Electron Diffusion in Metals Studied by Picosecond Ultrasonics
Tas, G., & Maris, H. J. (1994) · Physical Review B · doi:10.1103/physrevb.49.15046 · Cited by 344
Crystal Dynamics of Lead. I. Dispersion Curves at 100°K
Brockhouse, B. N., Arase, T., Caglioti, G., Rao, K. R., & Woods, A. D. B. (1962) · Physical Review · doi:10.1103/physrev.128.1099 · Cited by 307

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Cahill, D. G., Braun, P. V., Chen, G., Clarke, D. R., Fan, S., Goodson, K. E., Keblinski, P., King, W. P., Mahan, G. D., Majumdar, A., et al. (2014) · Applied Physics Reviews · doi:10.1063/1.4832615 · Cited by 1,763
Self-citation
Energy dissipation and transport in nanoscale devices
Pop, E. (2010) · Nano Research · doi:10.1007/s12274-010-1019-z · Cited by 1,308
Interfacial thermal resistance: Past, present, and future
Chen, J., Xu, X., Zhou, J., & Li, B. (2022) · Reviews of Modern Physics · doi:10.1103/revmodphys.94.025002 · Cited by 759
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Li, S., Zheng, Q., Lv, Y., Liu, X., Wang, X., Huang, P. Y., Cahill, D. G., & Lv, B. (2018) · Science · doi:10.1126/science.aat8982 · Cited by 600
Self-citation
Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials
Zhao, D., Qian, X., Gu, X., Jajja, S. A., & Yang, R. (2016) · Journal of Electronic Packaging · doi:10.1115/1.4034605 · Cited by 559
A review of recent advances in thermophysical properties at the nanoscale: From solid state to colloids
Qiu, L., Zhu, N., Feng, Y., Michaelides, E. E. S., Żyła, G., Jing, D., Zhang, X., Norris, P. M., Markides, C. N., & Mahian, O. (2019) · Physics Reports · doi:10.1016/j.physrep.2019.12.001 · Cited by 536
Thermal transport in polymeric materials and across composite interfaces
Mehra, N., Mu, L., Ji, T., Yang, X., Kong, J., Gu, J., & Zhu, J. (2018) · Applied Materials Today · doi:10.1016/j.apmt.2018.04.004 · Cited by 450
Ultrafast Flash Thermal Conductance of Molecular Chains
Wang, Z., Carter, J. A., Lagutchev, A., Koh, Y. K., Seong, N.-H., Cahill, D. G., & Dlott, D. D. (2007) · Science · doi:10.1126/science.1145220 · Cited by 446
Self-citation
Tutorial: Time-domain thermoreflectance (TDTR) for thermal property characterization of bulk and thin film materials
Jiang, P., Qian, X., & Yang, R. (2018) · Journal of Applied Physics · doi:10.1063/1.5046944 · Cited by 424
Construction of 3D Skeleton for Polymer Composites Achieving a High Thermal Conductivity
Yao, Y., Sun, J., Zeng, X., Sun, R., Xu, J., & Wong, C. (2018) · Small · doi:10.1002/smll.201704044 · Cited by 391
A Review of Experimental and Computational Advances in Thermal Boundary Conductance and Nanoscale Thermal Transport across Solid Interfaces
Giri, A., & Hopkins, P. E. (2019) · Advanced Functional Materials · doi:10.1002/adfm.201903857 · Cited by 384
Advances on Thermally Conductive Epoxy‐Based Composites as Electronic Packaging Underfill Materials—A Review
Wen, Y., Chen, C., Ye, Y., Xue, Z., Liu, H., Zhou, X., Zhang, Y., Li, D., Xie, X., & Mai, Y. (2022) · Advanced Materials · doi:10.1002/adma.202201023 · Cited by 377
Electrical and thermal transport in metallic single-wall carbon nanotubes on insulating substrates
Pop, E., Mann, D. A., Goodson, K. E., & Dai, H. (2007) · Journal of Applied Physics · doi:10.1063/1.2717855 · Cited by 372
Effects of temperature and disorder on thermal boundary conductance at solid–solid interfaces: Nonequilibrium molecular dynamics simulations
Stevens, R. J., Zhigilei, L. V., & Norris, P. M. (2007) · International Journal of Heat and Mass Transfer · doi:10.1016/j.ijheatmasstransfer.2007.01.040 · Cited by 359
Thermal contact resistance between graphene and silicon dioxide
Chen, Z., Jang, W., Bao, W., Lau, C. N., & Dames, C. (2009) · Applied Physics Letters · doi:10.1063/1.3245315 · Cited by 354
Thermal boundary resistance predictions from molecular dynamics simulations and theoretical calculations
Landry, E. S., & McGaughey, A. J. H. (2009) · Physical Review B · doi:10.1103/physrevb.80.165304 · Cited by 344
Electron-beam-assisted superplastic shaping of nanoscale amorphous silica
Zheng, K., Wang, C., Cheng, Y. Q., Yue, Y., Han, X., Zhang, Z., Shan, Z., Mao, S. X., Ye, M., Yin, Y., et al. (2010) · Nature Communications · doi:10.1038/ncomms1021 · Cited by 341
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Thermal Boundary Conductance: A Materials Science Perspective
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Luo, T., & Chen, G. (2013) · Physical Chemistry Chemical Physics · doi:10.1039/c2cp43771f · Cited by 276
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Effects of surface roughness and oxide layer on the thermal boundary conductance at aluminum/silicon interfaces
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Thermal conductance of metal–diamond interfaces at high pressure
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Criteria for Cross-Plane Dominated Thermal Transport in Multilayer Thin Film Systems During Modulated Laser Heating
Hopkins, P. E., Serrano, J. R., Phinney, L. M., Kearney, S. P., Grasser, T. W., & Harris, C. T. (2010) · ASME Journal of Heat and Mass Transfer · doi:10.1115/1.4000993 · Cited by 192
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Wang, R. Y., Segalman, R. A., & Majumdar, A. (2006) · Applied Physics Letters · doi:10.1063/1.2358856 · Cited by 185
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Experimental characterization methods for thermal contact resistance: A review
Xian, Y., Zhang, P., Zhai, S., Yuan, P., & Yang, D. (2017) · Applied Thermal Engineering · doi:10.1016/j.applthermaleng.2017.10.163 · Cited by 185
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Yang, J., Ziade, E., & Schmidt, A. J. (2016) · Review of Scientific Instruments · doi:10.1063/1.4939671 · Cited by 174
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Cheng, Z., Yates, L., Shi, J., Tadjer, M. J., Hobart, K. D., & Graham, S. L. (2019) · APL Materials · doi:10.1063/1.5089559 · Cited by 167
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Chen, J., Zhang, G., & Li, B. (2012) · Journal of Applied Physics · doi:10.1063/1.4754513 · Cited by 159
A Theoretical Review on Interfacial Thermal Transport at the Nanoscale
Zhang, P., Yuan, P., Jiang, X., Zhai, S., Zeng, J., Xian, Y., Qin, H., & Yang, D. (2017) · Small · doi:10.1002/smll.201702769 · Cited by 162
Nanostructuring expands thermal limits
Kim, W., Wang, R., & Majumdar, A. (2007) · Nano Today · doi:10.1016/s1748-0132(07)70018-x · Cited by 159
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Zhou, Y., Dong, Z., Hsieh, W., Goncharov, A. F., & Chen, X. (2022) · Nature Reviews Physics · doi:10.1038/s42254-022-00423-9 · Cited by 151
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Hopkins, P. E., Norris, P. M., Stevens, R. J., Beechem, T. E., & Graham, S. L. (2008) · ASME Journal of Heat and Mass Transfer · doi:10.1115/1.2897344 · Cited by 139
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Cheng, Z., Li, R., Yan, X., Jernigan, G. G., Shi, J., Liao, M. E., Hines, N. J., Gadre, C. A., Idrobo, J. C., Lee, E., et al. (2021) · Nature Communications · doi:10.1038/s41467-021-27250-3 · Cited by 137
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Yang, X. P., Wang, C., Lu, R., Shen, Y., Zhao, H., Li, J., Li, R., Zhang, L., Chen, H., Zhang, T., et al. (2022) · Nano Energy · doi:10.1016/j.nanoen.2022.107553 · Cited by 135
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Cho, J., Li, Y., Hoke, W. E., Altman, D. H., Asheghi, M., & Goodson, K. E. (2014) · Physical Review B · doi:10.1103/physrevb.89.115301 · Cited by 128
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The Impact of Thermal Boundary Resistance in Phase-Change Memory Devices
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Yue, Y., Zhang, J., & Wang, X. (2011) · Small · doi:10.1002/smll.201101598 · Cited by 123
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Wu, Y., Fang, L., & Xu, Y. (2019) · npj Computational Materials · doi:10.1038/s41524-019-0193-0 · Cited by 123
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Hopkins, P. E. (2009) · Journal of Applied Physics · doi:10.1063/1.3169515 · Cited by 123
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Zhang, X., Yang, G., & Cao, B. (2022) · Advanced Materials Interfaces · doi:10.1002/admi.202200078 · Cited by 119
A Review of Heat Transfer Physics
Carey, V. P., Chen, G., Grigoropoulos, C. P., Kaviany, M., & Majumdar, A. (2008) · Nanoscale and Microscale Thermophysical Engineering · doi:10.1080/15567260801917520 · Cited by 117
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Two-channel model for nonequilibrium thermal transport in pump-probe experiments
Wilson, R. B., Feser, J. P., Hohensee, G. T., & Cahill, D. G. (2013) · Physical Review B · doi:10.1103/physrevb.88.144305 · Cited by 112
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Pop, E. (2008) · Nanotechnology · doi:10.1088/0957-4484/19/29/295202 · Cited by 112
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Li, Q., Liu, F., Hu, S., Song, H., Yang, S., Jiang, H., Wang, T., Koh, Y. K., Zhao, C., Kang, F., et al. (2022) · Nature Communications · doi:10.1038/s41467-022-32600-w · Cited by 110
Tuning thermal contact conductance at graphene–copper interface via surface nanoengineering
Hong, Y., Li, L., Zeng, X. C., & Zhang, J. (2015) · Nanoscale · doi:10.1039/c5nr00564g · Cited by 109
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Jia, S. Q., & Yang, F. (2020) · Journal of Materials Science · doi:10.1007/s10853-020-05443-3 · Cited by 110
Prediction of thermal boundary resistance by the machine learning method
Zhan, T., Fang, L., & Xu, Y. (2017) · Scientific Reports · doi:10.1038/s41598-017-07150-7 · Cited by 105
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Cai, L., Chen, W., Du, G., Zhang, X., & Liu, X. (2018) · IEEE Transactions on Electron Devices · doi:10.1109/ted.2018.2825498 · Cited by 103
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Hua, C., Chen, X., Ravichandran, N. K., & Minnich, A. J. (2017) · Physical review. B./Physical review. B · doi:10.1103/physrevb.95.205423 · Cited by 102
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Tovee, P. D., Pumarol, M., Zeze, D. A., Kjoller, K., & Kolosov, O. (2012) · Journal of Applied Physics · doi:10.1063/1.4767923 · Cited by 101
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Dechaumphai, E., Lu, D., Kan, J. J., Moon, J., Fullerton, E. E., Liu, Z., & Chen, R. (2014) · Nano Letters · doi:10.1021/nl500127c · Cited by 99
Thermal conductance of strongly bonded metal-oxide interfaces
Wilson, R. B., Apgar, B. A., Hsieh, W.-P., Martin, L. W., & Cahill, D. G. (2015) · Physical Review B · doi:10.1103/physrevb.91.115414 · Cited by 97
Self-citation
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Cheaito, R., Gaskins, J. T., Caplan, M. E., Donovan, B., Foley, B. M., Giri, A., Duda, J. C., Szwejkowski, C. J., Constantin, C., Brown‐Shaklee, H. J., et al. (2015) · Physical Review B · doi:10.1103/physrevb.91.035432 · Cited by 97
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Chen, L., Chen, S., & Hou, Y. (2019) · Carbon · doi:10.1016/j.carbon.2019.03.051 · Cited by 96
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Tian, Z., Marconnet, A., & Chen, G. (2015) · Applied Physics Letters · doi:10.1063/1.4921758 · Cited by 95
Effects of surface chemistry on thermal conductance at aluminum–diamond interfaces
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Warzoha, R. J., Wilson, A. A., Donovan, B., Donmezer, F. N., Giri, A., Hopkins, P. E., Choi, S., Pahinkar, D. G., Shi, J., Graham, S. L., et al. (2020) · Journal of Electronic Packaging · doi:10.1115/1.4049293 · Cited by 92
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Li, Q., Liu, C., & Fan, S. (2009) · Nano Letters · doi:10.1021/nl901988t · Cited by 92
Spatially resolved thermoreflectance techniques for thermal conductivity measurements from the nanoscale to the mesoscale
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Self-citation
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Authors: Lyeo, H.-K., & Cahill, D. G.
Affiliations: University of Illinois Urbana-Champaign (US)
ORCID: Lyeo, Ho-Ki
Cahill, David G.
Venue: Physical Review B
Publisher: American Physical Society (APS)
Published: 2006-04-03
Volume: 73
Issue: 14
ISSN: 1098-0121 (ISSN-L)
1550-235X
DOI: 10.1103/physrevb.73.144301
OpenAlex: W2004164487
Cited by: 576
References: 28
Citations by year: 2026: 19 · 2025: 33 · 2024: 26 · 2023: 19 · 2022: 38 · 2021: 34 · 2020: 31 · 2019: 47 · 2018: 48 · 2017: 31 · 2016: 34 · 2015: 31 · 2014: 26 · 2013: 30 · 2012: 26
FWCI: 9.83
Type: journal article
Language: en
Open access: closed
Licence: link.aps.org/licenses/aps-default-license (vor)
Locations: Physical Review B (publishedVersion)
Funders: National Science Foundation
U.S. Department of Energy
Topics: Physical Sciences › Materials Science › Materials Chemistry › Thermal properties of materials
Physical Sciences › Engineering › Civil and Structural Engineering › Thermal Radiation and Cooling Technologies
Physical Sciences › Engineering › Mechanics of Materials › Thermography and Photoacoustic Techniques
Keywords: interface thermal conductance, metal-dielectric interface, lead, bismuth, hydrogen-terminated diamond, hydrogen-terminated silicon, silica, beryllium oxide, sapphire, electron-phonon coupling, radiation dose limits, lattice vibrations, time-domain thermoreflectance

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Thermal conductance of interfaces between highly dissimilar materials

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