The DOI matches its Crossref record; 22 of the 22 references it cites were found in a registry or an index.
Bulk micromachining of silicon
Abstract
Bulk silicon etching techniques, used to selectively remove silicon from substrates, have been broadly applied in the fabrication of micromachined sensors, actuators, and structures. Despite the more recent emergence of higher resolution, surface-micromachining approaches, the majority of currently shipping silicon sensors are made using bulk etching. Particularly in light of newly introduced dry etching methods compatible with complementary metal-oxide-semiconductors, it is unlikely that bulk micromachining will decrease in popularity in the near future. The available etching methods fall into three categories in terms of the state of the etchant: wet, vapor, and plasma. For each category, the available processes are reviewed and compared in terms of etch results, cost, complexity, process compatibility, and a number of other factors. In addition, several example micromachined structures are presented.
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Cites
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Gupta, S., Navaraj, W. T., Lorenzelli, L., & Dahiya, R. (2018) · npj Flexible Electronics · doi:10.1038/s41528-018-0021-5 · Cited by 363
Microsensor Integration Into Systems-on-Chip
Brand, O. (2006) · Proceedings of the IEEE · doi:10.1109/jproc.2006.873618 · Cited by 106
Whole-cell biochips for bio-sensing: integration of live cells and inanimate surfaces
Ben-Yoav, H., Melamed, S., Freeman, A., Shacham-Diamand, Y., & Belkin, S. (2011) · Critical Reviews in Biotechnology · doi:10.3109/07388551.2010.532767 · Cited by 52
Metadata
- Authors
- Kovacs, G. T. A., Maluf, N. I., & Petersen, K. E.
- Venue
- Proceedings of the IEEE
- Published
- 1998
- Volume
- 86
- Issue
- 8
- Pages
- 1536-1551
- ISSN
- 0018-9219 (ISSN-L)
- OpenAlex
- W2147142329
- Cited by
- 733
- References
- 22
- FWCI
- 16.53
- Type
- journal article
- Language
- en
- Open access
- closed
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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
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