Thermal Interface Materials: Historical Perspective, Status, and Future Directions
Prasher, R.·2006·Proceedings of the IEEE
Cited by (926)
Items 901–926 of 926
- Selection and application strategy of thermal interface materials for in-orbit thermal management of space camerasCaixia Liu, Junjun Qin, Yonglin Bai, Yifan Zhang, Chunyan Liao, Jiatao Wang, Yinlin Li · 2026 · Case Studies in Thermal Engineering
- Investigating thermal properties of nanocomposite interphase region using SiC nanoparticles modified by oleic acidErfan Hamedian, Maral Ghahramani, Mojtaba Haghighi‐Yazdi, Majid Safarabadi · 2026 · Journal of Materials Research and Technology
- Infrared temperature gradient microstructure mapping for optimizing filler dispersion in oriented h-BN/Al2O3/PDMS thermal interface materialsXing Guo, Ruoyu Huang, Lishi Fu, Lingyu Chen, Sheng Chen, M. H. Lin, Rui Mu, Yufeng Zhang, Xueao Zhang · 2026 · Applied Physics Letters
- Real-Use thermal performance of polymer-based thermal interface materials with engineered filler architecturesRungsima Yeetsorn, Chalermpol Rudradawong, Aparporn Sakulkalavek, Rachsak Sakdanuphab, Kasimanat Vibulyaseak, Yaowaret Maiket · 2026 · Proceedings of the Institution of Mechanical Engineers Part L Journal of Materials Design and Applications
- Mobile‐Chain‐Assisted Flow Alignment and Interfacial Adaptation Enable Elastomeric Thermal Interface Materials with High through‐Plane Thermal Conductivity and Low Contact Thermal ResistanceZhaoyu Lu, Xiangyu Nie, Xin Zhang, Junyan Wang, Letian Zhou, Changshuai Chen, Zhenxu Nie, Junzhe Yang, Haoxiang Li, Junfeng Chu et al. · 2026 · Advanced Functional Materials
- Passive thermal management of a hard-disk-drive-based storage system for edge appliancesShabeeh Kattakkadan, Nahoosh Mandlik, Niranjan Pol, Umesh Madanan · 2026 · Advances in heat transfer
- Thermal and electrical conductivity of nanocarbon/ferrite/epoxy hybrid compositesO. S. Yakovenko, Lyudmila Yu. Matzui, Л. Л. Вовченко, Yulia S. Perets, Dmytro O. Zaiats, Pavlo Lishchuk, Kateryna Dubyk, Larysa S. Kaykan, Julia Mazurenko, Bogdan I. Rachiy · 2026 · Molecular Crystals and Liquid Crystals
- One-step shear-induced through-plane alignment in hybrid boron nitride/bottlebrush PDMS composites for compliant thermal interface materialsXin Dai, Yan Zhang, Yihang Cao, Huixiang Liang, Yilin Wang, 唐国伟, Jian‐Cheng Lai, Yucan Peng · 2026 · Polymer
- Iterative Prediction of Si MOSFET Junction Temperature Using Fixed-Point Method with Temperature-Dependent ResistanceShivam Patil, Yogendra Sapkale, Durvankur Raut, Ashish Deshpande · 2026 · IEEE International Conference on Sustainable Energy and Future Electric Transportation (SEFET)
- Construction and Application Validation of the Performance Index System for Chip-Level Thermal Interface MaterialsYueyue Huang, 梁貫成, Fangzhou Chen, Jiahao Liu, Zihan Wang, Bingjie Zheng · 2026 · International Conference on Electronic Packaging Technology (ICEPT)
- Thermal conductivity of carbon nanotube-filled diblock copolymer compositesAlexander I. Chervanyov · 2026 · The Journal of Chemical Physics
- Nonlinear thermal resistance of highly anisotropic graphite thin films under microscopic point-contact conditions睦明 村上 · 2026 · Heat and Mass Transfer
- Thermal pathway engineering for advanced integrated-circuit packaging: from intrinsic properties to lifetime qualificationPeisheng Liu, Feiyu Qiang, Jinlan Wang · 2026 · Applied Thermal Engineering
- Thermal Interface Materials and Two-Dimensional Nanomaterials for High-Density Data Center Thermal ManagementYurucheng Zhang · 2026 · Applied and Computational Engineering
- Metal additive manufacturing enables monolithic copper cold plate development with sinusoidal microchannels for direct-to-chip coolingSaptarshi Joshi, Behnood Bazmi, Woo Young Park, Daniel Farhat, Evgeny Shatskiy, Omar M. Zaki, Scott Green, Dakota Black, William P. King, Nenad Miljkovic · 2026 · Advances in heat transfer
- Effect of Ag Content on Wetting, Void Formation, and Interfacial Reaction Behavior of Indium-Based Thermal Interface Materials for FCBGA Packaging under Multiple Reflow CyclesYiou Qiu, Minxuan Liu, Zimeng Guo, Hexin Wang, Xinda Cai, Caijin Liao, Wenhui Zhu · 2026 · SSRN Electronic Journal
- Cu Nanosheet Surface Bridging of Hierarchical MgO Fillers for High-Thermal-Conductivity Epoxy CompositesSunhyun Nam, Artavazd Gh. Kirakosyan, Jihoon Choi · 2026 · Korean Journal of Materials Research
- EGaIn-based thermal management for high heat flux electronicsJin Young Joung, Hyeonjong Na, So Hee Yoon, Yong-hee Jeong, Moohyun Lee, Carmel Majidi, Han Kim · 2026 · iScience
- Effective straight-segment length governs CNT/Cu thermal coupling in composites containing meandering CNTs結城昭正, Kanau Sakoguchi, Keiki Fukuda, Hiroaki Koga, Takeshi Hashishin · 2026 · Materials & Design
- Sustainable Thermoplastic Thermal Interface Adhesive Derived from Poly(lipoic acid) and Boron Nitride for Efficient Electronic Thermal ManagementShuichang Chen, Yuchen Zhang, Yue Lin, Peng Ni, Yan Fang, Yunxiang Weng, Qinhui Chen, Haiqing Liu · 2026 · ACS Applied Materials & Interfaces
- Stochastic finite-element analysis of effective thermal conductivity in ceramic-filled thermal interface materials: a continuous heat transfer length descriptor for particle connectivityDong-Gi Lee, HyeonWoo Jo, HeeJin Jo, SangWook Ui, Boram Gu · 2026 · Applied Thermal Engineering
- Machine learning based prediction of thermal conductivity in graphene-reinforced aluminum metal matrix compositesAnshu Kumar, Abhishek De, Sunil Kumar Pradhan, Deepashri Prakash Ahirrao, U. P. Gawai, Padmakar G. Chavan · 2026 · Materials Today Communications
- Impact of Thermo-Mechanical Stress on Electrical Isolation and Thermal Performance of Top-Side Cooled Power PackagesIsmail Recepi, Thomas Langbauer, Franz Vollmaier, Patrick Nagelmaier, Stefan V. Mollov · 2026 · Energy Conversion Congress and Expo Europe (ECCE Europe)
- Contact Resistance Improvement Using Liquid-Metal (LIME) for High-Current SiC MOSFET BusbarsTauhidul Haque, Nick Baker, Jenson Taylor · 2026 · IEEE Workshop on Wide Bandgap Power Devices and Applications in Europe (WiPDA Europe)
- РОЗРОБКА ПРЕЦИЗІЙНОЇ ТЕРМОЕЛЕКТРИЧНОЇ СИСТЕМИ ОХОЛОДЖЕННЯ ДЛЯ ТЕРМОСТАТУВАННЯ ПРОМИСЛОВИХ МАСТИЛЬНИХ СИСТЕМК. О. Кондрат’єв, В. В. Старіков · 2026 · Collection of Scientific Publications NUS
- Finite Deformation Thermomechanical Contact Homogenization Frameworkİlker Temizer, Peter Wriggers · 2011 · Lecture notes in applied and computational mechanics