Thermal Interface Materials: Historical Perspective, Status, and Future Directions
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Items 701–800 of 926
- Coupled thermally general imperfect and mechanically coherent energetic interfaces subject to in-plane degradationAli Esmaeili, Paul Steinmann, Ali Javili · 2017 · Journal of mechanics of materials and structures
- Zn thin film on Al metal as thermal substrates for LED application: thermal and optical performanceSUBRAMANI SHANMUGAN, Mutharasu Devarajan · 2020 · Optical and Quantum Electronics
- NanotechnologyYi Li, Daniel Lu, Ching Ping Wong · 2009 · Springer eBooks
- Graphene-based heat spreading materials for electronics packaging applicationsGuangjie Yuan, Bo Shan, Shujing Chen, Yiqun Yang, Jie Bao, Nan Wang, Peng Su, Shirong Huang, Yong Zhang, Lilei Ye et al. · 2017 · IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
- ‘trimoda’ Wafer-Level Package: Fully Compatible Electrical, Optical, and Fluidic Chip I/O InterconnectsMuhannad S. Bakir, Bing Dang, Oluwafemi O. Ogunsola, JAMES D. MEINDL · 2007 · IEEE Electronic Components and Technology Conference (ECTC)
- Demonstration of a Compliant Microspring Array as a Thermal Interface Material for Pluggable Optoelectronic Transceiver ModulesJin Cui, Liang Pan, Justin A. Weibel · 2020 · Journal of Electronic Packaging
- A Hybrid Pressure-less Silver Sintering Technology for High-power Density ElectronicsYuan Zhao, Bruno Tolla, Doug Katze, Glenda Castaneda, John Wood, Jo-Anne Wilson, David Brand · 2023 · IMAPSource Proceedings
- Nanobubble-induced significant reduction of the interfacial thermal conductance for few-layer grapheneZhao-Xia Qu, Jin-Wu Jiang · 2023 · Physical Chemistry Chemical Physics
- Thermal conformance parameters for assessment of heat transfer between similar and dissimilar metal contactsRamakrishna Devananda Pathumudy, Augustine Samuel, K. Narayan Prabhu · 2024 · Heat Transfer
- Non-Destructive Analysis of Voiding in Thermal Interface Material of High-Performance Computing Devices Using B-Mode Scanning Acoustic Microscopy (B-SAM)Mei-Hui Song, Wai-Kit Tang · 2024 · IEEE Electronics Packaging Technology Conference (EPTC)
- A Scalable Strategy for PCM-Based Thermal Buffering Sheets: Combining 2D BNNS with 0D Silica Microcapsules for Energy-Efficient Thermal Management ApplicationsYongseok Kim, Jaseung Koo · 2025 · ACS Applied Materials & Interfaces
- Pressure‐Regulated Direct‐Foaming Method for Fabricating 3D Porous Graphene Foam Thermal Interface Materials With High Compressibility and Fingerprint‐Level Interfacial ConformabilityHongchuan Zhang, Jiawei Xu, Haoran Wu, Zikang Yu, Xiaohuan Li, Jiaru Fan, Jiahang Fan, Yifan Tu, Hanyu Bai, Xiaoyun Song et al. · 2025 · Advanced Materials Technologies
- Neural networks accelerate discovery of ultralow thermal conductivity configurations in disordered graphene/h-BN multilayersQiao Chen, Dongyang Li, Bing Yang, Yunqing Tang, Lin Li · 2026 · Applied Thermal Engineering
- Experimental validation of high-performance commercial thermal interface materials in PV-TEG hybrid systemsSevgi Altınkök · 2026 · Next Energy
- LED thermal management: From fundamental mechanisms to deep learning-enabled multi-objective optimization for sustainable lightingZengguang Sui, Fuxiang Li, Haosheng Lin, Yunren Sui, Zhixiong Ding, Tiantian Liu, Wei Wu · 2026 · Renewable and Sustainable Energy Reviews
- Highly Vertically Oriented Graphene Microstrip Pads With Ultrahigh Through‐Plane Thermal Conductivity and Ultralow Compressive Modulus for Efficient Heat DissipationXu Ran, Yaru Wang, Sijia Wu, Hejun Wang, Junhao Shen, Litao Sun, Xing Yang Wu, Hengchang Bi · 2026 · Advanced Science
- Graphene oxide decorated Mg doped ZnO thin film nanostructure for LED thermal management applicationsNiamat Forazi Bappy, Shanmugan Subramani · 2026 · Applied Physics A
- Finite Element Modeling of the Thermal Conductivity of Polymer Composites Reinforced with Graphite SheetsAbdulrahman A. Alghamdi · 2026 · Polymers
- Dissipating heat from hot spot using a new nano thermal interface materialShuangxi Sun, Wei Mu, Yan Zhang, Björn Carlberg, Lilei Ye, Johan Liu · 2012 · International Conference on Electronic Packaging Technology (ICEPT)
- Thermal Characterization of Die-Attach Material Interface of High-Power Light-Emitting DiodesDae-Suk Kim, Bongtae Han · 2017 · Solid state lighting technology and application series
- Study on thermal resistance of brass with and without coating of metallic surfaceK. M. Mrityunjaya Swamy, Satyanarayan · 2020 · Materials Today Proceedings
- Nanoscale Barrier Layers to Enable the Use of Gallium-Based Thermal Interface Materials with AluminumStephen Stagon, Neil Blaser, Grant R. Bevill, John P. Nuszkowski · 2020 · Journal of Materials Engineering and Performance
- Experimental Study on Contact Thermal Resistance of Common Thermal Interface MaterialsMingjun Xie · 2022 · Lecture notes in electrical engineering
- Thermal Performance of Liquid Metal Pastes Containing low Content of Metal Particles for Thermal Interface Materials in IC Module ElectronicsGuangyu Fan, Jeffrey Kurish, Sofia Tagliaferri, Kyle Green, Christine LaBarbera · 2023 · IMAPSource Proceedings
- Evolution of TIM/Copper Interface under Wide Temperature ExcursionsPradeep Lall, Madhu Kasturi · 2023 · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
- Enhancement of Ga - 21.5 In - 10 Sn Eutectic Alloy Based Thermal Interface Material Incorporating Cu FlakeJang Baeg Kim, Dong Gil Kang, Taejoon Noh, Seahwan Kim, Seung‐Boo Jung · 2023 · IEEE Electronic Components and Technology Conference (ECTC)
- Obtaining and Thermophysical Properties of Thermal Liners Based on Silicone Elastomer Filled with Hexagonal Boron NitrideN. S. Romanov, E. A. Danilov, E. M. Gurova, E. A. Grishukhina · 2024 · Journal of Engineering Physics and Thermophysics
- Improving the interfacial thermal conductance between Cr–Ni alloy and dielectric by a metal interlayerYingqi Wang, Yu Yang, Zhuo Ju, Zehao Yu, Hui Guo, Meilin Li, Dengke Ma, Lifa Zhang, Yunshan Zhao · 2025 · Applied Physics Letters
- 3.23 Polymer Matrix Composite Thermal MaterialsCarl H. Zweben · 2017 · Elsevier eBooks
- A Study on the Thermal Properties of Thermal Grease with Copper NanopowdersHaneul Kang, Hyunji Kim, SangHyoek Park, Jin-Ho Yang, Sunchul Huh · 2020 · IOP Conference Series Materials Science and Engineering
- THERMOELECTRIC MONITORING OF THERMAL RESISTANCE IN ELECTRONIC SYSTEMSA. A. Abouellail, J. Chang, А.I. Soldatov, A.A. Soldatov, M.A. Kostina, I.M. Vasiliev · 2023 · Eurasian Physical Technical Journal
- Electro-Thermal Response of Industrial-Grade Graphene for Electronic Packages ApplicationsSarah Sibilia, Francesco Siconolfi, Antonio Maffucci, Gaspare Giovinco, Francesco Bertocchi, Sergio Chiodini, Isaac Appiah Otoo · 2024 · IEEE Workshop on Signal and Power Integrity
- Thermal Transport in Self-Assembled Conductive Networks for Thermal Interface MaterialsLin Hu, William Evans, Pawel Keblinski · 2011 · Journal of Electronic Packaging
- Mathematical Methods for the Rapid Development of New High Performance Thermal Interface MaterialsSara N. Paisner, Timothy D. Fornes, Nicolas D. Huffman, Kathleen A. Gilbert · 2008 · Annual IEEE Semiconductor Thermal Measurement and Management Symposium/Proceedings
- A Parametric Study of Heat Transfer for the Optimization of Fin SinksJ. Blanco, E. Armendáriz, Jesús Esarte · 2014 · Journal of Advanced Thermal Science Research
- Toward enhancing thermal conductivity of polymer-based thin films for microelectronics coolingHao Ma, Zhiting Tian · 2017 · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
- Metallized compliant 3D microstructures for dry contact thermal conductance enhancementJin Cui, Jicheng Wang, Yang Zhong, Liang Pan, Justin A. Weibel · 2018 · Journal of Micromechanics and Microengineering
- A new non-contact optical method for determining the thermal conductivity of metals and carbides at their melting/freezing temperaturesAnatoliy I. Fisenko, Vladimir F. Lemberg · 2018 · Journal of Materials Science
- Light-weight Compressible and Highly Thermal Conductive Graphene-based Thermal Interface MaterialNan Wang, Shujing Chen, Amos Nkansah, Lilei Ye, Johan Liu · 2018 · Electronic System-Integration Technology Conference (ESTC)
- Investigation on Thermal Contact Resistance Between Indium and Cap in PackagingJianxiong Hu, Zefang Fengchen, Ye Zhang, Yixin Xu, Fulong Zhu · 2019 · IEEE Electronics Packaging Technology Conference (EPTC)
- Heterogenous Integration of InP DHBT and Si CMOS by $30\mu\mathrm{m}$ Pitch Au-In MicrobumpsLishu Wu, Jiayun Dai, Wei Cheng, Yuechan Kong, TangShen Chen, Tong Zhang · 2021 · IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
- Thermal Performance and Reliability of Liquid Metal Alloys as Thermal Interface Materials for Computing Electronics DevicesGuangyu Fan, Jacob Wells, Micheal Beam · 2024 · IEEE Electronic Components and Technology Conference (ECTC)
- Graphene Attached on Microsphere Surface for Thermally Conductive Composite MaterialJae-Yong Choi, Joo Hyuk Lee, Mi Ri Kim, Ki Seok Lee, Kuk Young Cho · 2013 · Clean Technology
- Joint Healing Thermal Interface MaterialJingting Yang, Jason Strader, Sean M. Orzolek, Eugene A. Pruss, Phillip Fosnot, Jesse E. Galloway · 2016 · IMAPSource Proceedings
- Підвищення ефективності тепловідведення від потужних електронних пристроїв через термічні інтерфейси на основі плівок нітриду алюмініюÉ. M. Rudenko, В. М. Сорокін, I. V. Korotash, Д.Ю. Полоцький, А.О. Краковний, Olexandr Suvorov, М.О. Білоголовський, D.V. Pekur · 2018 · Reports of the National Academy of Sciences of Ukraine
- Aluminum Nitride Thermal Interface for Improving Heat Performance of High-Power Electronic DevicesÉ. M. Rudenko, I. V. Korotash, M. V. Dyakin, D. Yu. Polotskiy, Mikhail A. Belogolovskii, Yuri M. Strzhemechny · 2019 · IEEE International Conference on Electronics and Information Technologies (ELIT)
- Reduction of interface thermal resistance between TIM and metal surface by tuning wettabilityYusuke Ira, Takashi Kodama, Junichiro Shiomi · 2021 · Transactions of the JSME (in Japanese)
- Thermal Conductivity of Thermal Interface MaterialsTravis Z. Fullem, Eric J. Cotts · 2007 · MRS Proceedings
- Characterization and modeling of thermal diffusion and aggregation in nanofluids.Patricia E. Gharagozloo, Kenneth E. Goodson · 2010
- Adhesion Phenomena Pertaining to Thermal Interface Materials and Solder Interconnects in Microelectronic Packaging: A Critical ReviewDinesh P.R. Thanu, Aravindha R. Antoniswamy, Roozbeh Danaei, Manish Keswani · 2019 · Wiley eBooks
- 3D-C/shape memory polymer composite for space deployable applicationsRanjana Shivakumar · 2020 · DR-NTU (Nanyang Technological University)
- Surfactant molecular design on heat transfer enhancementYuting Guo, Haiyi Sun, Xuelan Zhang, Sirui Wang, Gaoyang Li · 2022 · Elsevier eBooks
- Simultaneous thermal/flow characterization of thermal interface materialsY. K. Singh, Nikhil Bajaj, Ganesh Subbarayan · 2016 · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
- Thermally Conductive NanocompositesJan Felba · 2021 · Springer eBooks
- Characterization and investigation of performance of Sn–Bi alloy used as a thermal interface materialM. C. Kumar Swamy, Satyanarayan, R. Pinto · 2023 · Journal of Materials Science Materials in Electronics
- High Thermal Conductive Composite Resin Filled with Spherical and Polyhedral Aluminum NitridesTakefumi Iida, Atsushi Sakamoto, Isao Masada, Saiko Fujii, Go Hamasaka, Teruhiko Nawata · 2023 · International Conference on Electronics Packaging (ICEP)
- Heat transfer performance of a novel graphene-based composite thermal interface materialJian Peng, Jiyu Qian, Tao Wei · 2025 · Journal of Physics Conference Series
- High-Precision Thermal Characterization of Ultra-Low Thermal Resistance Copper Nano-Wire-Polydimethylsiloxane Composite Thermal Interface Materials TapeKaiying Jiang, Heungdong Kwon, Hansen Qiao, Yini He, Mehdi Asheghi, Kenneth E. Goodson · 2025 · Journal of Electronic Packaging
- Physics-informed machine learning integrated with finite-element modeling for microstructure-driven thermal conductivity prediction in epoxy/AlN nanocompositesBehzad Hashemi Soudmand, Saad Alshammari, Jaber M. Asiri, Fawwaz Hazzazi, Hassan Zohair Hassan, Ghada Emam Atteia, Amirhossein Najafi · 2026 · Applied Thermal Engineering
- Phonon‐Bridge Engineering in Vertically Aligned Graphene Paper Composites Enables Efficient and Reliable Thermal Interface MaterialsQindong Zhang, Jie Cheng, Weijia Ren, Qiuyu Yi, Xu Zou, Jingze Li, Qian Zhao · 2026 · Advanced Functional Materials
- Finger-joint-assembled graphitic interface materials for enhanced thermal contact conductanceMenglin Li, Jingwen Zhang, Xinyue Zhang, Menglong Hao · 2026 · Applied Physics Letters
- Sandwich‐Like Silicone Rubber Composites With Oriented Thermal Conductive Pathways and Flexible Surface Layers for High‐Performance Thermal ManagementGuangxing Huang, Anjun Shi, Feng Wei, Dayong Chen, Yinsi Gan, Jianan Song · 2026 · Polymer Composites
- Thermal Impact of Heat Spreader Co-Planarity to Electronic PackagingPang Shi Shiang, Mohd Zulkifly Abdullah · 2020 · Journal of Advanced Research in Fluid Mechanics and Thermal Sciences
- Synergistic contributions towards the coefficient of performance (COP) improvements of a stacked modular thermoelectric system (SMTS) for hydronicsAmogh Wasti, Md Rashef Mahbub, Berardo Matalucci, Daniel Walczyk, Theodorian Borca‐Tasciuc · 2025 · Applied Thermal Engineering
- Synergistically reinforced phase change thermal interface materials for high-power electronics: Low resistance and long-term reliabilityTong Li, Guiping Lin, Kang Yuan, Yuandong Guo, Wenjun Li, Yang Zhang, Hui Gao, Jianyin Miao · 2026 · International Communications in Heat and Mass Transfer
- Dual-Functional Star-Shaped Polysiloxanes Enhance Thermal Interface Materials by Suppressing Oil Bleeding and Reducing Thermal ResistanceTingyu Liu, Jiafeng Lu, Jiaen Qian, Yunhui Yu, Jiaqi Wang, Yuhan Zhang, Xinliang Wang, Hong Dong, Yanjiang Song, Zhirong Qu et al. · 2026 · ACS Applied Polymer Materials
- Void suppression in indium thermal interface materials for high-power packaging based on bubble dynamics modeling and process optimizationYiou Qiu, Zhen Liu, Ping Wu, Linzheng Fu, Hexin Wang, Liu Li, Danni Cao, Qiaobo Dai, Liancheng Wang, Wenhui Zhu · 2026 · Applied Thermal Engineering
- Ultrafast thermal sintering controls thermal transport in high-entropy alloy nanoparticle junctionsGeraudys Mora-Barzaga, Patricio Inostroza, Felipe J. Valencia, Eduardo M. Bringa · 2026 · International Journal of Heat and Mass Transfer
- High-Density, Low-Enriched Uranium-Based Target for Radioisotope ProductionGary L. Solbrekken, Kyler K. Turner, S. Govindarajan · 2013 · Springer eBooks
- Thermal resistance of high power LED on surface modified heat sinkD. Mutharasu, SUBRAMANI SHANMUGAN · 2013 · Frontiers of Optoelectronics
- The Progress of Graphene in Thermal TransportationMing zhu Wang, Xing Xing, Wei Yu · 2014 · Advanced materials research
- Study on the adhesion strength of new nano-structured polymer-metal composite for thermal interface material (Nano-TIM) under different pressuresLei Zhang, Xiuzhen Lu, Xin Luo, Björn Carlberg, Masoud Zandira, Lilei Ye, Johan Liu · 2011 · International Conference on Electronic Packaging Technology (ICEPT)
- New Dynamic Air-Brush Technique for SWCNTs Deposition: Application to Fabrication of CNTFETs for Electronics and Gas SensingPaolo Bondavalli, Louis Gorintin, Pierre Legagneux, Jean‐Pierre Simonato, L. Cailler · 2011 · MRS Proceedings
- Thermal characteristics of TIMs with elliptical particlesReza Hajiaghaee Khiabani, Yogendra Kumar Joshi, Cyrus K. Aidun · 2010 · Annual IEEE Semiconductor Thermal Measurement and Management Symposium/Proceedings
- Thermoelectric Heat Recovery From a Tankless Water Heating SystemSaniya LeBlanc, Yuan Gao, Kenneth E. Goodson · 2008 · ASME International Mechanical Engineering Congress and Exposition (IMECE)
- Investigating the Effect of Carbon Nanotube Functionalization in a Polydimethylsiloxane Composite Through use of a Stepped Bar ApparatusMatthew Ralphs · 2021 · Digital Commons - USU (Utah State University)
- Screen-printed nanostructured composites as thermal interface materials for insulated gate bipolar transistors heat dissipation applicationsTien-Chan Chang, Yiin‐Kuen Fuh, Rui-Zhong Lee, Li-Yuan Liu, Yueh-Mu Lee · 2016 · Journal of Micro/Nanopatterning Materials and Metrology
- Thermal management and prototype testing of Compton scattering X-ray beam position monitor for the Advanced Photon Source UpgradeS. H. Lee, Bingxin X. Yang, J. Collins, M. Ramanathan · 2017 · Review of Scientific Instruments
- Characterizations of Thermal Compound Using CuO Particles Grown by Wet Oxidation MethodDong Woo Lee, Chang Hyun Um, Jae Uk Chu · 2017 · Korean Journal of Materials Research
- Nano-Scale Convective Heat Transfer of Vertically Aligned Carbon Nanotube ArraysAlexander Scott Larsen, Ryan L. Whetstone · 2010 · Digital WPI
- Impact of Squeezing on the Microstructure of Thermal Interface MaterialsRajath Kantharaj, Carl R. Wassgren, Aaron B. Morris, Amy Marie Marconnet · 2021 · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
- Synthesis and characteristic applications of silicon resins for the modifying agent in heat conductionChung‐Feng Jeffrey Kuo, Naveed Ahmad, Sheng-Yu Lin, Garuda Raka Satria Dewangga, Min‐Yan Dong · 2021 · Textile Research Journal
- Single- and Multiphase Flow for Electronic CoolingYogendra Kumar Joshi, Zhimin Wan · 2018 · Springer eBooks
- Thermal and Mechanical Optimization to Enable Reliable High Performance Liquid-Cooled Compute System for Level 4 Autonomous DrivingFen Chen, Gilberto Madrid, Brian Schlotterbeck, Jagdeep Singh, Adli Nureddin, Tyler Sawyer, Zoran Stefanoski, Spencer Klimpke, Hector Guajardo, Arul Ramalingam et al. · 2022 · IEEE Electronic Components and Technology Conference (ECTC)
- Bonding Process of Copper Foam-Silver Composite and Performance Characterization of the JointGuoping Lv, Haidong Yan, Siliang He, Daoguo Yang, Xinke Wu, Kuang Sheng, Chaohui Liu, Yakun Zhang, Guoqi Zhang · 2022 · International Conference on Electronic Packaging Technology (ICEPT)
- IR and Optical Imaging Technique for Stability Analysis of Thermal Interface Materials Under Accelerated Power CyclingPeter McClure, Ali Davoodabadi · 2024 · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
- High-Precision Thermal Characterization of Ultra-Low Thermal Resistance Copper Nano-Wire (CuNWs)-Polydimethylsiloxane (PDMS) Composite Thermal Interface Materials (TIMs) TapeKaiying Jiang, Heungdong Kwon, Hansen Qiao, Yini He, Mehdi Asheghi, Kenneth E. Goodson · 2024 · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)
- Hierarchical Bayesian inference for uncertainty quantification of thermal grease rheologyPranay P. Nagrani, Akshay Jacob Thomas, Amy Marie Marconnet, Ivan C. Christov · 2025 · Journal of Rheology
- Management of thermal interfacial resistance for a reparable thermal interfaceHitoshi Sakamoto, Kenichi Inaba, Minoru Yoshikawa · 2010 · International Microsystems, Packaging, Assembly and Circuits Technology Conference
- Squeeze flow characterization of particle-filled polymeric materials through image correlationNikhil Bajaj, Ganesh Subbarayan, Suresh V. Garimella · 2010 · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
- A facile method to transfer vertical aligned graphene film/polydimethylsiloxane composite to thermal interface materialsYafei Zhang, Dong Jun Han, Haoming Fang, Shu‐Lin Bai · 2016 · China Semiconductor Technology International Conference (CSTIC)
- Finite element analysis of bond line thickness and fiber distribution in solder based thermal interface materialsMaulik Satwara, Josef Hansson, Lilei Ye, Henric Rhedin, Johan Liu · 2017 · IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
- An empirical model for thermal interface materials based on experimental characterizations under realistic conditionsYi Zhang, Honghai Wang, Z. Wang, Frede Blaabjerg · 2018 · Microelectronics Reliability
- Pressure-Dependent Thermal Characterization of Bi-Porous Copper StructuresCheng‐Hui Lin, Yoonjin Won · 2019 · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
- Comparative Evaluation of Algorithms for Achieving Ultrapacked Thermal Greases: Microstructural Models and Effective BehaviorSukshitha Achar P. L., Huanyu Liao, Ganesh Subbarayan · 2020 · Journal of Electronic Packaging
- Properties of Thermo-Conductive Ceramic-Based Coatings Deposited Using Fore-Vacuum Plasma-Cathode Electron SourceYu. G. Yushkov, Ефим Михайлович Окс, Denis B. Zolotukhin, Тюньков Андрей Владимирович · 2020 · International Congress on Energy Fluxes and Radiation Effects (EFRE)
- Interfacial heat transfer and microstructural analyses of a Bi- 5% Sb lead-free alloy solidified against Cu, Ni and low-C steel substratesThiago Soares, Clarissa Cruz, Marcella G. C. Xavier, Rodrigo André Valenzuela Reyes, Felipe Bertelli, Amauri Garcia, José Eduardo Spinelli, Noé Cheung · 2020 · Journal of Alloys and Compounds
- Multiscale Modeling on the Enhanced Heat Transfer Behavior of Thermal Interface Materials Based on GrapheneYu Wang · 2021 · IEEE Electronic Components and Technology Conference (ECTC)
- Synthesis of Face to Face Partially Fused Carbon Nanotubes for the Improvement of Thermal Management in 3D Die StackingHua Xu, Jeffery C. C. Lo, S. W. Ricky Lee · 2021 · IEEE Nanotechnology Materials and Devices Conference (NMDC)
- Effect of interface morphology on thermal contact resistance in thermal management of electronic devicesYu-Zheng Chen, Shiwei Feng, Yamin Zhang, Xin He, Kun Bai, Xuan Li · 2022 · International Journal of Modern Physics B