Thermal Interface Materials: Historical Perspective, Status, and Future Directions
Prasher, R.·2006·Proceedings of the IEEE
Cited by (926)
Items 801–900 of 926
- Applications of Carbon Nanomaterials as Electrical Interconnects and Thermal Interface MaterialsWei Jie Lin, Ching Ping Wong · 2021 · Springer eBooks
- Ag Nanoparticle-Based Aerogel-like Films for Interfacial Thermal ManagementSebun Munakata, Shunji Kobayashi, Hisashi Sugime A, Shota Konishi, Junichiro Shiomi, Suguru Noda · 2022 · ACS Applied Nano Materials
- CNTFET Gas Sensors Using SWCNT Mats: Method for Low-cost Fabrication, Solution to Improve Selectivity, Experimental Results using Interfering AgentsPaolo Bondavalli, Louis Gorintin, Pierre Legagneux, Didier Pribat, Laurent Caillier, Jean‐Pierre Simonato · 2009 · MRS Proceedings
- Thermal Transport in Nanostructured PolymersJùn Líu · 2013 · CU Scholar (University of Colorado Boulder)
- Nanostructure Dictating Thermal Transport in Heterogeneous Material SystemsMatthew R. Bauer · 2014
- Evaluating and modeling the energy impacts of data centers, in terms of hardware / software architecture and associated environmentYewan Wang · 2020
- Scaling—Its Effects on Heat Generation and Cooling of Devices. A “Thermal Moore’s” Law?Krishna Seshan · 2012 · Elsevier eBooks
- MULTIWALL CARBON NANOTUBE ARRAYS FOR THERMAL INTERFACE ENHANCEMENTDarrell Keith Etheredge · 2012 · UKnowledge (University of Kentucky)
- Power delivery, signaling and cooling for 2D and 3D integrated systemsMuhannad S. Bakir, Gang Huang, Bing Dang · 2010 · Integrated circuits and systems
- FEM Simulation of Bimodal and Trimodal Thermally Conductive AdhesivesNabi Nabiollahi, Johan Liu, Zhu Hilli, Yan Zhang, Yue Cong, Zhaonian Cheng, Masahiro Inoue · 2009 · Chalmers Publication Library (Chalmers University of Technology)
- Thermal Conductive Composite Prepared by Carbon Coated Aluminum Nanoparticles Filled Silicone RubberHaiyan Zhang, Lin Jin, Hao Qun Hong · 2010 · Advanced materials research
- Characterization of Gamma-irradiated Carbon Nanotube and Metallic Foil Thermal Interface Materials for Space SystemsRobert A. Sayer, Stephen Hodson, Timothy Koehler, Robert Joseph Cordova, Timothy Marinone, Justin R. Serrano, Timothy S. Fisher · 2014 · International Journal of Micro-Nano Scale Transport
- Highly selective CNTFET based sensors using metal diversification methodsPaolo Bondavalli, Louis Gorintin, Florian Longnos, Gilles A. Feugnet · 2011 · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
- Evaluation of Thermal Characteristics of Board-level High Performance Flip-chip Package Equipped with Vapor Chamber as Heat SpreaderTong Hong Wang, Chang-Chi Lee, Rong-Tai Liu, Yi‐Shao Lai, Chang-Lin Yeh · 2008 · IEEE Electronics Packaging Technology Conference (EPTC)
- Electrical, Optical and Thermofluidic Chip I/O InterconnectionsMuhannad S. Bakir, Bing Dang, JAMES D. MEINDL · 2007 · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)
- Mechanical properties of a novel nano-thermal interface materialPeng Wanli, Carl Zandén, Lilei Ye, Xiuzhen Lu, Johan Liu · 2013 · IEEE International Conference on Nanotechnology (IEEE-NANO)
- Nanotechnology RADAR thermal managementCarlo Falessi, Anna Maria Fiorello, Francesco Toschi, Emanuela Tamburri, Silvia Orlanducci, Maria Letizia Terranova, Aldo Di Carlo, Daniele Passeri, Marco Rossi · 2008 · IEEE Radar Conference (RadarConf)
- Highly selective sensors based on Carbon Nanotubes transistors, fabricated using an original dynamic spray technique, for gas electronic fingerprinting.Paolo Bondavalli, Louis Gorintin, Pierre Legagneux, Jean‐Pierre Simonato, L. Cailler · 2010 · Proceedings of IEEE Sensors/Proceedings of IEEE Sensors ...
- Recent Progress ofThermal Interface MaterialsJohan Liu, Teng Wang, Björn Carlberg, Masahiro Inoue · 2008
- Simultaneous Characterization of Theta-JC and Theta-JB Using Through-Package 1-D Heat FlowJichul Kim, Jae Choon Kim, Mina Choi, Eunseok Cho, Hyunggil Baek, Hogeon Song, Sayoon Kang · 2011 · IMAPSource Proceedings
- Solvent Soaking and Drying of Carbon Nanotube Forests for Enhanced Contact Area and Thermal Interface ConductanceJohn H. Taphouse, Baratunde A. Cola · 2013 · ASME International Conference on Micro/Nanoscale Heat and Mass Transfer (MNHMT)
- An investigation of the fabrication and characterisation of nanocomposite thermal interface materialsAlessio Munari · 2011 · Arrow@dit (Dublin Institute of Technology)
- Carbon Nanotube Arrays for Enhanced Thermal Interfaces to Thermoelectric ModulesKimberly R. Saviers, Stephen L. Hodson, James R. Salvador, Linda S. Kasten, Timothy S. Fisher · 2012 · AIAA International Energy Conversion Engineering Conference (IECEC)
- Locally reinforced polymer-based composites for efficient heat dissipation of multiple heat sourcesChao Yuan, Mengyu Huang, Yupu Ma, Xiaobing Luo · 2016 · China Semiconductor Technology International Conference (CSTIC)
- Environmentally Friendly Packaging Technology for a Sustainable Future環境調和型実装技術委員会 · 2012 · Journal of The Japan Institute of Electronics Packaging
- CNT-BCB composites as a bonding interface material for 3D integrationXU Xiang-ming, Zhimin Tan, Zheyao Wang · 2011 · IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
- Board-Level thermal management systems with application in electronics and power electronicsAliakbar Soleymani Koohbanani · 2016
- Effects of the Fiber Distribution and Number of Nearby Fibers on the Thermal Conductivity for Aligned CNT-Silicon Oil CompositesDiana Grandio · 2016 · Scholar Commons (Santa Clara University)
- Thermal Transport and Mechanical Properties of Carbon Nanotube ArraysRong-Shiuan Chu · 2012 · eScholarship (California Digital Library)
- Implication of Size-Controlled Graphite Nanosheets as Building Blocks for Thermal Conductive Three-Dimensional Framework Architecture of NanocarbonsKeun-Young Shin, Sung Gook Jin, Bong June Sung, Sang Soo Lee · 2017 · Nanoscale and Microscale Thermophysical Engineering
- Chemical Modification of High Performance Metal-based Nanocomposite Thermal Interface Materials Toward Efficient Cooling in Electronic SystemsCengiz Yegin, Nirup Nagabandi, Kevin M. Holder, Elisa Teipel, Mustafa E. S. Akbulut · 2018 · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
- Reversible Structure Formation of Aluminum Trihydroxide (ATH) Dispersions in Polydimethylsiloxane (PDMS)Christopher J. Cox, Brentley Hovey, Timothy D. Fornes, Saad A. Khan · 2018 · Langmuir
- Investigation of thermal management options for robotsEren Sevinchan · 2018 · e-scholar@UOIT (University of Ontario Institute of Technology)
- The Effects of Local Structure on Thermal Transport in Carbon Nanotube NetworksRichard N. Salaway · 2014
- Research on Application of New Types of Fiber Reinforced Composites in Safety TechnologyHuazhen Wei, Danyong Wang, Juncong Liu, Haiyun Zhang, LI Shu-hu, Yadong Liu · 2019 · IOP Conference Series Materials Science and Engineering
- Experimental Investigation of Interface Thermal Resistance for High Power Electronic ModuleTao Wei, Guoping Chen, Xiangju Kong, Jiyu Qian · 2019 · Lecture notes in electrical engineering
- High-Durability Coating for Improved Thermal Management of Pluggable Optical ModulesR. Chesterfield, P. Goli, Sarah E. Querelle, E. Sullivan, Z. Hoyt, Kurt G. Olson, M. Bren, Attila Aranyosi, S. Doan, V. Le · 2020 · Optical Fiber Communication Conference
- Design of a steady state thermal conductivity measurement device for CNT RET polymer compositesBrian M. Louie · 2011 · eScholarship (California Digital Library)
- Versatile TIM Solution with Chain Network Solder CompositeRunsheng Mao, Sihai Chen, Elaina Zito, David Bedner, Ning-Cheng Lee · 2020 · International Conference on Electronic Packaging Technology (ICEPT)
- Contact Measurements of Blackbody TemperaturesVictor I. Sapritsky, Alexander V. Prokhorov · 2020 · Springer series in measurement science and technology
- Influence Of Aluminum Particles On Thermal Interface Material Hardness And Thermal ConductivityRoslan Kamarudin, Mohd Zulkifly Abdullah, Zuraihana Bachok, Mohd Sharizal Abdul Aziz, Fakhrozi Che Ani · 2020 · International journal of scientific and technology research
- Versatile TIM Solution with Chain Network Solder CompositeRunsheng Mao, Sihai Chen, Elaina Zito, David Bedner, Ning-Cheng Lee · 2020 · IMAPSource Proceedings
- A Study on the Thermal Conductivity of Thermal Grease According to Cu-Ni ContentHaneul Kang, Hyunji Kim, Sung-Hoon Im, Jin-Ho Yang, Sunchul Huh · 2021 · Key engineering materials
- Improving thermally-limited burst performance of microprocessors using high conductivity graphite spreadersRavishankar Srikanth, Nandigama Bhargav · 2021 · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
- Calculation of Thermal Processes in the Contact Zones of Elements in Various Technological ProcessesVladimir Stepanovich Kondratenko, V. V. Kadomkin, Olga N. Tretiyakova · 2022 · Smart innovation, systems and technologies
- Chip packagingXiaobing Luo, Run Hu · 2018 · Elsevier eBooks
- Effect of Al2O3 gradation on rheological behavior and thermomechanical properties of epoxy molding CompoundsXin Xie, Mengdi Zhang, Kexin Fu, Wenji Ai, Pengli Zhu, Qing Xie · 2022 · International Conference on Electronic Packaging Technology (ICEPT)
- Molecular Dynamics Study: Correlation of Heat Conduction Across S-L Interfaces Between Constant Heat Flux and Shear Applied to Liquid SystemsAbdul Rafeq Saleman, Mohamad Shukri Zakaria, Ridhwan Jumaidin, Nur Hazwani Mokhtar, Nor Aslily Sarkam · 2022 · Journal of Mechanical Engineering
- An over-penalized weak Galerkin method for parabolic interface problems with time-dependent coefficientsWenya Qi, Lunji Song · 2022 · Journal of Computational and Applied Mathematics
- Formation of Coatings Based on Al2O3 on Polypropylene by the Electron-Beam Method in the Forevacuum Pressure RegionV. T. Tran, A. S. Klimov, Aleksey A. Zenin · 2022 · Proceedings of Tomsk State University of Control Systems and Radioelectronics
- Reworkable & rehealable packaging materials from the introduction of orthogonal dynamic covalent chemistriesTeddie Magbitang, Lucas C. Moore, Roy Yu, Kamal K. Sikka, Akhiro Horibe, Rudy J. Wojtecki · 2022 · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
- Interfacial Heat Transport Properties of Graphene/Natural Rubber Composites Studied Based on Molecular Dynamics ApproachGuiming An, Yeqi Yan, Yancheng Tao, Tao Li · 2023 · SSRN Electronic Journal
- SiC Die Attach Based on Sintered for Wide Band Gap SemiconductorKoyo Kobori · 2024 · IMAPSource Proceedings
- Accurate Identification of Viscoelastic Constitutive Equation of Thermal Interfacial MaterialsYu Ting Zhou, Xiaoxin Lu, Shengchang Ding, Rong Sun, Jibao Lu · 2023 · International Conference on Electronic Packaging Technology (ICEPT)
- An accurate numerical prediction for the thermal conductivity of thermal interface materialsXiaoxin Lu, Jiabin Huang, Nan Pu Cheng, Dongdong Ding, Jibao Lu, Rong Sun · 2023 · International Conference on Electronic Packaging Technology (ICEPT)
- Thermally Enhanced Thermal Interfacial MaterialsXiaobing Luo, Run Hu, Bin Xie · 2024 · Wiley eBooks
- Interfacial Heat Transport Properties of Graphene/Natural Rubber Compositesstudied Based on Molecular Dynamics ApproachGuiming An, Yeqi Yan, Yancheng Tao, Chuanke Liang, Zexin Liu, Tao Li · 2024 · SSRN Electronic Journal
- Thermal Conductivity and Interface Strength Evolution of TIM-Copper with Temperature and Humidity ConditioningPradeep Lall, Madhu Kasturi, Jaimal M. Williamson, Varughese Mathew · 2024 · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
- Effect of electrically aligned polycrystalline diamond flakes on the through-plane thermal conductivity of heat conduction sheetsMasafumi Inaba, Seiya Seike, Yingchen Chen, Soichiro Ichiki, Yoshihiko Kubota, Shinya Ohmagari, Michihiko Nakano, Junya Suehiro · 2024 · Functional Diamond
- Thermal resistance investigate of copper-copper interface based on femtosecond laser periodic microstructureNing Wang, Zihan Liu, Hualong Zhao, Xiongtao Zhao, Yupeng Zhang · 2024 · Advanced Laser Processing and Manufacturing
- A design for high thermally conductive and electrically semiconducting graphene-based hybrid structuresL. J. Gong, H. L. Shi, Jinli Yang, Qingzhen Han, H. Yang, Q. H. Liu, Zhaotan Jiang · 2025 · Modern Physics Letters B
- Temperature Distribution Sensor for Real-Time Monitoring of Thermal Interface MaterialSunbin Hwang, Junya Kurumida · 2025 · IEEE Sensors Journal
- Surface Treatment of AlN Filler for Improvement of Reliability in Silicone Resin CompositesM. Takakusaki, Isao Masada, Y. Iizuka, T. Hamasaka, Atsushi Sakamoto, G. Hamasaka · 2025 · International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)
- A Fundamental Study on Interfacial Properties of Indium Thermal Interface MaterialsP.-A. Juan, Kuan-Chen Kung, Chih-chien Pan, Shih‐kang Lin · 2025 · International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)
- Thermal Conductivity Enhancement in Pdms Composites Via Shear-Induced Alignment of H-Bn and Al2o3fillersXing Guo, Ruoyu Huang, Lishi Fu, Lingyu Chen, Ming‐Yuan Lin, Rui Mu, Yufeng Zhang, Xueao Zhang · 2025 · SSRN Electronic Journal
- Influence of High Thermal Conductivity Copper Rod on Phase Change Kinetics in Cylindrical Heat SinkShivam M. Vakhariya, Bikash Kumar, Sunny Saini, Y. Naresh, Jyotirmay Banerjee · 2025 · Journal of Thermal Science and Engineering Applications
- Multiscale Evaluation of Thermal Conductance of Thermal Interface MaterialsJaehyeon Song, Hyun Sik Woo, Hakjun Kim, Sungjun Kim, Chan Ho Park, Woong‐Ryeol Yu, Hyejin Jang · 2025 · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
- Polymer-Based Thermal Interface Material Modeling and SelectionLiangkai Ma, Brian Clark, Joe Sootsman · 2025 · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
- Indium Solder TIM Stability under Temperature CyclingPiyush Kulkarni, Ali Davoodabadi, Zechen Zhang, Scott N. Schiffres · 2025 · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
- Two-Phase Counter-Flow Expanding Channels for Compliant Direct AttachMark Schultz, Pritish R. Parida, Shurong Tian, Cory VanDeventer, Brian Werneke, Timothy Chainer · 2025 · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
- The interfacial properties of Indium thermal interface materialsP.-A. Juan, Kuan-Chen Kung, Shih‐kang Lin · 2025 · International Microsystems, Packaging, Assembly and Circuits Technology Conference
- Characterization of nano-scale materials for interconnect and thermal dissipation application in electronics packagingXin Luo · 2014 · Chalmers Publication Library (Chalmers University of Technology)
- Evaluating the effectiveness of phase change material and liquid metal integration in laptop cooling systemSurya Naik, Irshaad Hussain, Gururaj Fattepur, Shridhar Mandal · 2025 · AIP conference proceedings
- Grid‐Shaped, Vertically Aligned Carbon Nanotube Architectures for Electrical, Optical, and Mechanical BolometersYasameen Al-Mafrachi, Sandeep Yadav, Sascha Preu, Jörg J. Schneider, Oktay Yilmazoglu · 2026 · Advanced Sensor Research
- Active Measurement Wafer for Thermal Characterization in Chiplet-Based SystemsAndy Heinig · 2025 · IEEE Electronics Packaging Technology Conference (EPTC)
- Porosity-tunable LPBF copper wicks directly printed on silicon for high-heat-flux cooling: Thermal, mechanical, and reliability characteristics as a function of laser processing conditionsHarish Kumar Lattupalli, Emily M. Stallbaumer-Cyr, Ketankumar Jayantkumar Yogi, Sina Ghadi, Stephen R. Cain, Lan Yao, Tiwei Wei, Scott N. Schiffres · 2026 · Additive manufacturing
- Efficient foam-based thermal interface material functionalized with MWCNTs for CPU cooling applications: thermal performance modeling and Experimental studiesNehal Ali, Badawi Anis, Mohamed Elhadary · 2026 · Scientific Reports
- Characterization of the local mechanical properties of interfaces in heteregeneous materialsJean-Baptiste Giouse · 2018
- Evalutation et optimisation des transferts thermiques aux interfaces des assemblages pour le domaine spatialSimon Vandevelde · 2019
- Design of a High-Stability Phase-Based Laser Rangefinder Based on Embedded Systems仕强 邱 · 2026 · Applied Physics
- Model reduction for thermal management of high power electronic components for aerospace applicationHazem Ben Aissia · 2019
- Fabrication, architecture design, and characterization of a new Al/graphite flakes (Gf) composite used for thermal managementZhengyan Shen · 2020
- Etudes électrothermiques de dispositifs électroniques innovants pour les technologies submicroniquesRenan Lethiecq · 2020
- 51Chapter 3 Effect of the Interface on Thermal, Mechanical, and Optical PropertiesWeiwei Zhang, Caijing Shi · 2025 · De Gruyter eBooks
- Influence de charges carbonées sur la dissipation thermique de nouveaux composites diélectriquesLurayni Díaz Chacón · 2016
- Highly flexible AlN/PTFE composite films with excellent thermal dissipation, electrical insulation and compliance properties for advanced electronic packagingShupei Lv, Fengqi Han, Lu Chen, Shanshan Yang, Binyuan Wu, Jing Ouyang, Deliang Chen · 2026 · Composites Communications
- Study on Thermal Resistance Characteristics and Thermal Validation of Indium Foil-Filled Thermal Interfaces for Space CamerasCaixia Liu, Junjun Qin, Yonglin Bai, Jiatao Wang, Yinlin Li · 2026 · Applied Sciences
- Boron Nitride Nanosheets as Prospective Filler for Dielectric Thermally Conductive Elastomeric FilmsN. S. Romanov, E. A. Danilov, I. A. Komarov · 2025 · Inorganic Materials
- Assessing heat-source/heat-sink interfacial heat transfer: TIM conductivity, pressure and NMP effects from source-sink thermal response and inverse analysesRamakrishna Devananda Pathumudy, K. Narayan Prabhu · 2026 · Thermochimica Acta
- Molecular Dynamics Simulation of Interfacial Structure and Thermal Resistance between Organic-Modified Metal Oxides and PolypropyleneTakamasa Saito, Takao Tsukada, Eita Shoji, Gota Kikugawa, Donatas Surblys, Momoji Kubo, Masaki Kubo · 2026 · The Journal of Physical Chemistry C
- Development of AlN Fillers for Composite Resins with High Thermal Conductivity and Low Bond-Line ThicknessYusaku Imasaku, Atushi Sanagawa, Isao Masada, Go Hamasaka, Yukihiro Kanechika · 2026 · International Conference on Electronics Packaging (ICEP)
- Organic‐Solvent‐Free Fabrication of Highly Thermally Conductive and Electrically Insulating Films via Magnetic Alignment of Large h‐ BN Platelets in Waterborne PolyurethaneZihan Teng, Yue Wang, Shanshan Chao, Liangjun Shen, Yuan Wang, X D Li, E Songfeng, Lejia Wang · 2026 · Journal of Applied Polymer Science
- Simultaneous Estimation of Interfacial and Bulk Thermal Resistances in Thermal Interface Materials with Si Substrates under Controlled Uniaxial Pressure Using Lock-in ThermographyKota Hasegawa, Takamasa Hirai, Fuyuki Ando, Ryo Takahashi, Naoki Takahara, Ken‐ichi Uchida · 2026 · Annual IEEE Semiconductor Thermal Measurement and Management Symposium/Proceedings
- Surface-engineered diamond/liquid metal composites with significantly enhanced thermal conductivity for advanced thermal interface materialsLi, Busheng Zhang, Junchen Huang, Hongming Chen, W J Wang, Xinbo He · 2026 · Applied Surface Science
- A Critical Straight-Segment-Length Threshold for Drastic Thermal Conductivity Enhancement in CNT/Cu Composites結城昭正, Kanau Sakoguchi, Keiki Fukuda, Hiroaki Koga, Takeshi Hashishin · 2026 · SSRN Electronic Journal
- Anisotropic Thermal Conductivity in Topologically Networked Protein-MXene CompositesMert Vural, Huihun Jung, John A. Tomko, Patrick Hopkins, Melik C. Demirel · 2026 · bioRxiv (Cold Spring Harbor Laboratory)
- Experimental Study of a Heat Dissipation Radiator for a LED Luminaire Made from Alloys with Copper AdditionsDimitar Pavlov, Tsvetomir Stoyanov, Vultchan Georgiev, Veselin Valkov, Plamen Ts. Tsankov, Ivaylo Stoyanov, Milko Yovchev · 2026 · Junior Conference on Lighting (Lighting)
- Polymer Brush-Assisted Reduction of Contact Thermal Resistance via Interfacial Diffusion of a Liquid PolymerTaku Goto, Yasuhito Matsubayashi, Takako K. Nakamura · 2026 · Langmuir
- Investigating interface heat transfer mechanisms in double-walled pipes of heat exchangers under variable mechanical and thermal conditionsBabar Hayat, Qingtong Wei, Wenqian Zhang, Adnan Ibrahim, Mirza Abdullah Rehan, Muzaffar Ali, Shijun Ji · 2026 · International Journal of Thermal Sciences
- A CRITICAL REVIEW OF THERMOPHYSICAL PARAMETERS GOVERNING THE PERFORMANCE OF THERMAL INTERFACE MATERIALS IN ADVANCED ELECTRONIC COOLING SYSTEMSReyhan Arslan, Bedri Onur Küçükyıldırım, Emel Akyol, Ahmet Selim Dalkılıç · 2026 · Scientific works/Elmi eserler