Thermal Interface Materials: Historical Perspective, Status, and Future Directions
Prasher, R.·2006·Proceedings of the IEEE
Cited by (926)
Items 301–400 of 926
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- Double-sided tin nanowire arrays for advanced thermal interface materialsBo Feng, Fardin Faruque, Peng Bao, An‐Ting Chien, Satish Kumar, George P. Peterson · 2013 · Applied Physics Letters
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- A protocol to further improve the thermal conductivity of silicone-matrix thermal interface material with nano-fillersLiu Yang, Li Ji · 2021 · Thermochimica Acta
- Large-Area Bonding by Sintering of a Resin-Free Nanosilver Paste at Ultralow Temperature of 180 °CShi Chen, Yunhui Mei, Meiyu Wang, Xin Li, Guo‐Quan Lu · 2022 · IEEE Transactions on Components Packaging and Manufacturing Technology
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- Encapsulated carbon nanotube array as a thermal interface material compatible with standard electronics packagingRuixiang Bai, Yangbing Wei, Jiyuan Xu, Xiaobo Li, Menglin Li, Ziwen Zou, Xinyan Huang, Chengyu Liu, Yiwei Sun, Menglong Hao · 2023 · Nano Research
- Thermal properties of poly(dimethyl siloxane) nanocomposite filled with silicon carbide and multiwall carbon nanotubesJinho Hong, Hyun Seok Choi, Kyung Sub Lee, Sang Eun Shim · 2011 · Polymer International
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- Enhanced thermal transport of hexagonal boron nitride filled polymer composite by magnetic field-assisted alignmentZiyin Lin, Yan Liu, Kyoung‐sik Moon, Ching‐Ping Wong · 2013 · IEEE Electronic Components and Technology Conference (ECTC)
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