Thermal Interface Materials: Historical Perspective, Status, and Future Directions
Cited by (926)
Items 601–700 of 926
- Intermetallic growth and thermal impedance at the In32.5Bi16.5Sn/Cu interfaceChun‐Hao Chen, Chung-Lin Yang, Tung‐Han Chuang · 2022 · Journal of Alloys and Compounds
- A molecular dynamics study on the solid–liquid polymer interface: insight into the effect of surface roughness scale and polymer chain length on interfacial thermal resistanceQing-Yao Luo, Donatas Surblys, Hiroki Matsubara, Taku Ohara · 2024 · Molecular Physics
- Independent Control of Electrical and Thermal Properties of Polymer Composites for Low Thermal Resistance Interface MaterialsShabas Ahammed Abdul Jaleel, Mohamad Alayli, Seongsu Cheon, Seunghyun Baik · 2025 · Advanced Engineering Materials
- Effect of Noncovalent Bonding Modified Graphene on Thermal Conductivity of Graphene/Natural Rubber Composites Based on Molecular Dynamics ApproachZexin Liu, Chuanke Liang, Yeqi Yan, Yancheng Tao, Guiming An, Tao Li · 2025 · Langmuir
- Junction to case thermal resistance variability due to temperature induced package warpageThomas Nordstog, Christopher Henry, Cameron Nelson, Jesse E. Galloway, Phillip Fosnot, Quan Pham · 2017 · Annual IEEE Semiconductor Thermal Measurement and Management Symposium/Proceedings
- Thermal Engineering at the Limits of the CMOS EraKrishna Vasanth Valavala, Keith D. Coulson, Manjunath C. Rajagopal, Dhruv Gelda, Sanjiv Sinha · 2018 · Elsevier eBooks
- The Effect of Thermal-Induced Warpage and Degeneration of Thermal Interface Materials on the Thermal Performance of a Flip-Chip PackageRuoyu Jiang, Cheng Zhonz, Haozhe Wang, Chenglong Li, Zheng Yi, Linlin Ren, Jibao Lu, Rong Sun, Ching‐Ping Wong · 2021 · International Conference on Electronic Packaging Technology (ICEPT)
- On-Chip Thermal Management and Hot-Spot RemediationAvram Bar‐Cohen, Peng Wang · 2021 · Springer eBooks
- Nanoscale Heat Transport of Vertically Aligned Carbon Nanotube Bundles for Thermal Management ApplicationsJean Spièce, Kunal J. Lulla, Pauline de Crombrugghe, Laurent Divay, Odile Bezencenet, Benoit Hackens, Pascal Gehring, Alexander Robson, Charalambos Evangeli, Oleg Kolosov · 2024 · ACS Applied Materials & Interfaces
- Superior thermal conductivity of carbon nanoscroll based thermal interface materialsYu Wang, Yingyan Zhang · 2015 · IEEE Electronic Components and Technology Conference (ECTC)
- EXPERIMENTAL STUDY OF COEFFICIENT OF THERMAL EXPANSION OF ALIGNED GRAPHITE THERMAL INTERFACE MATERIALSChung-Lung Chen, Hsiu-hung Chen, Zhao Yuan · 2013 · Frontiers in Heat and Mass Transfer
- Thermally Conductive Polymer Matrix CompositesXingcun Colin Tong · 2010 · Springer series in advanced microelectronics
- Heat Dissipation Technology of IGBT Module PackageIl-Woong Suh, Hoon-Sun Jung, Young‐Ho Lee, Young-Hun Kim, Sung‐Hoon Choa · 2014 · Journal of the Microelectronics and Packaging Society
- Capacitive sensing of local bond layer thickness and coverage in thermal interface materialsStephen H. Taylor, Suresh V. Garimella · 2016 · International Journal of Heat and Mass Transfer
- Thermal insulator transition induced by interface scatteringBrian A. Slovick, Srini Krishnamurthy · 2016 · Applied Physics Letters
- Probability of conductive bond formation in a percolating network of nanowires with fusible tipsKonrad Rykaczewski, Robert Y. Wang · 2018 · Applied Physics Letters
- Study on reduction of thermal conductivity of composite phase change material using Cu nanoparticlesJu‐Lan Zeng, Ting Xie, Yuxiang Zhang, Liu‐Mo Jiang, Kun-Yu Li, Sai‐Bo Yu, Shaofen Wang · 2018 · Energy Sources Part A Recovery Utilization and Environmental Effects
- Micro Heat Sink Structure with High Thermal Conductive Composite via Micromachining ProcessYongpeng Wu, Liyan Lai, Yan Wang, Zhuoqing Yang, Hong Wang, Guifu Ding · 2019 · International Conference on Solid-State Sensors, Actuators and Microsystems
- Capillary-driven evaporative heat transfer of silicon microchannel with nanoporous membrane composite wickRongkuo Ding, Guodong Xia, Li Ran, Chenchen Song · 2025 · Applied Thermal Engineering
- Spatial variation of thermal properties in thermal interface materials using a frequency domain thermoreflectance methodZechen Zhang, Piyush Kulkarni, Je-Young Chang, Matthias A. Daeumer, Ahmad R. Gharaibeh, Bahgat G Sammakia, Scott N. Schiffres · 2026 · Applied Thermal Engineering
- Estimating the Thermal Conductivity of Thin Films: A Novel Approach Using the Transient Plane Source MethodDavid Landry, Renzo Flores, Renée B. Goodman · 2023 · ASME Journal of Heat and Mass Transfer
- Fabrication and enhanced thermal performance of a self-rewetting wick of silicon-based loop heat pipeDongfang Zhou, Lin Wei Guo, Xin Lan, Jingzhi Zhang, Xinyu Wang, Wenjing Du, Gongming Xin · 2024 · International Communications in Heat and Mass Transfer
- Preparation and surface modification of vertically structured indium/graphite elastomer thermal pad for effective heat dissipationYisimayili Tuersun, Pingjun Luo, Yixin Chen, Xu Huang, Mingdeng Huang, Sheng Chu · 2025 · Composites Communications
- UV curing polyurethane–acrylate composites as full filling thermal interface materialsYamin Che, Cui Liu, Nian Li, Wei Chao Guo, Min Xi, Shudong Zhang, Zhenyang Wang · 2022 · New Journal of Chemistry
- Understanding the Effect of Nanoparticle Size on Thermal Conductivity in Amorphous Nanoporous Materials Made from Colloidal Building BlocksVivian R. K. Wall, Sophia C. King, Glareh Natalie Kashanchi, Suixuan Li, Man Li, Tiphaine Galy, Darrell Harry, Susan Eungyung Ju, Michal Marszewski, Laurent Pilon et al. · 2022 · The Journal of Physical Chemistry C
- Fabrication of carbon nanotube thermal interface material on aluminium alloy substratesZhaoli Gao, Kai Zhang, M.M.F. Yuen · 2010 · International Conference on Electronic Packaging Technology (ICEPT)
- Characterization of Die-Attach Thermal Interface of High-Power Light-Emitting Diodes: An Inverse ApproachDae-Suk Kim, Bongtae Han, Avram Bar‐Cohen · 2015 · IEEE Transactions on Components Packaging and Manufacturing Technology
- Nonhomogeneous morphology and the elastic modulus of aligned carbon nanotube filmsYoonjin Won, Yuan Gao, Roberto Guzmán de Villoria, Brian L. Wardle, Rong Xiang, Shigeo Maruyama, Thomas William Kenny, Kenneth E. Goodson · 2015 · Journal of Micromechanics and Microengineering
- Fabrication of compliant three-dimensional microstructures as surface coatings for dry contact thermal conductance enhancementRyan Wasielewski, Jin Cui, Liang Pan, Justin A. Weibel · 2016 · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
- High-performance carbon nanotubes thermal interface materialsJamaliah Idris, Win Hon Tan · 2014 · IEEE/CPMT International Electronics Manufacturing Technology Symposium
- Reliability of low melt alloys as thermal interface materialsChandan K. Roy, Michael C. Hamilton, Wayne R. Johnson, Roy W. Knight, Daniel Kevin Harris · 2017 · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
- Single- and Multiphase Flow for Electronic CoolingYogendra Kumar Joshi, Zhimin Wan · 2017 · Springer eBooks
- Experimental Studies on the Effect of Thermal Interface Material and Mounting Technique on the Thermal Resistance of Device Cooling ArrangementChetan Urabinahatti, Syed Shahjahan Ahmad, Gopalaratnam Narayanan · 2019 · National Power Electronics Conference (NPEC)
- Use of 1D mechanical and thermal models to predetermine the heat transferable by a thermal interface material layer in space applicationsSimon Vandevelde, Alain Daidié, Marc Sartor · 2020 · Proceedings of the Institution of Mechanical Engineers Part C Journal of Mechanical Engineering Science
- Environmental reliability of nano-structured polymer-metal composite thermal interface materialXiuzhen Lu, Mengke Zhuang, Lei Zhang, Lilei Ye, Johan Liu · 2012 · International Conference on Electronic Packaging Technology (ICEPT)
- 3D Integrated Circuits: Liquid Cooling and Power DeliveryMuhannad S. Bakir, Gang Huang, Deepak Sekar, Calvin King · 2009 · IETE Technical Review
- Heterogeneous integration of GaAs pHEMT and Si CMOS on the same chipLishu Wu, Yan Jun Zhao, Hong-Chang Shen, Youtao Zhang, Tangsheng Chen · 2016 · Chinese Physics B
- Thermomechanical Modeling of High-Temperature Bonded Interface MaterialsPaul P. Paret, Douglas J. DeVoto, Sreekant V. J. Narumanchi · 2019 · Springer eBooks
- Near-field focusing sensor for characterization of void content in thin dielectric layersStephen H. Taylor, Suresh V. Garimella · 2014 · Measurement Science and Technology
- Interfacial thermal conductance-rheology nexus in metal-contacted nanocompositesIndira P. Seshadri, Theo Borca-Tasciuc, Pawel Keblinski, Ganpati Ramanath · 2013 · Applied Physics Letters
- A “hairy” polymer/3D-foam hybrid for flexible high performance thermal gap filling applications in harsh environmentsManuela Loeblein, Lin Jing, Mingfeng Liu, J. Cheah, Siu Hon Tsang, Edwin Hang Tong Teo · 2017 · RSC Advances
- Low-cost highly-efficient fault tolerant processor design for mitigating the reliability issues in nanometric technologiesHai Yu · 2011
- Surface Modification of Aluminum Nitride and Silicon Oxycarbide for Silicone Rubber CompositesHsien Tang Chiu, Tanapon Sukachonmakul · 2015 · Wiley eBooks
- Application of Low Melt Alloys as Compliant Thermal Interface Materials: A Study of Performance and Degradation under Thermal DuressChandan K. Roy · 2016
- Predicting bond line thickness of polymeric thermal interface materials based on the rheological propertiesJianfeng Fan, Zhenqiang Ye, Xiaoliang Zeng, Jianbin Xu, Linlin Ren, Rong Sun, Ching‐Ping Wong · 2024 · Journal of Applied Physics
- Epoxy Composites Reinforced with Long Al 2 O 3 Nanowires for Enhanced Thermal Management in Advanced Semiconductor PackagingZihao Lin, S.M. Chen, Kyoung‐sik Moon, Wen-Hsi Lee, Ching‐Ping Wong · 2026 · ACS Applied Nano Materials
- Design of yield-stress fluids with ultra-low thermal resistance via surface functionalization of aluminum fillersYuanyuan Xiao, Yimin Wei, Yunsong Pang, Xiaoliang Zeng, Rong Sun · 2025 · Composites Part A Applied Science and Manufacturing
- Effect of Fiber Concentration on Mechanical and Thermal Properties of a Solder Matrix Fiber Composite Thermal Interface MaterialJosef Hansson, Torbjorn M. J. Nilsson, Lilei Ye, Johan Liu · 2019 · IEEE Transactions on Components Packaging and Manufacturing Technology
- Progress in measuring, modeling, and manipulating thermal boundary conductancePamela M. Norris, Leighann Sarah Larkin, Nam Q. Le, Carlos A. Polanco, Justin L. Smoyer, Jingjie Zhang · 2021 · Advances in heat transfer
- Spatial Thermal Conductivity Variation of Particulate-Filled Thermal Interface MaterialsZechen Zhang, Piyush Kulkarni, Matthias A. Daeumer, Ahmad R. Gharaibeh, Je-Young Chang, Bahgat G Sammakia, Scott N. Schiffres · 2022 · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
- Usability: Improving UI/UX in Design by challenges of Materials InnovationsMahmoud Elgazzar, Mina Dawood · 2022 · التصميم الدولية
- Strain controlled shear hardening behavior in suspensions of alumina spheres in a polydimethylsiloxane oligomer matrixZefan Wang, Yu Wang, Yunlan Su, Qian Xing, Alejandro Jesus Müller · 2023 · Polymers for Advanced Technologies
- A Hybrid Pressureless Silver Sintering Technology for High-Power Density ElectronicsYuan Zhao, Bruno Tolla, Doug Katze, Glenda Castaneda, Jo-Anne Wilson, David Brand · 2023 · Journal of Microelectronics and Electronic Packaging
- Influence of thermal interface material using discrete Si-IGBTs and consideration of power cycling conditionsPatrick Heimler, Marco Günther, Cesare Künzel, Josef Lutz, Thomas Basler · 2023 · Microelectronics Reliability
- Microstructure and Property Evolution of Diamond/GaInSn Composites under Thermal Load and High HumidityShijie Du, Hong Min Guo, Jie Zhang, Zhongnan Xie, Hui Yang, Nan Wu, Yulin Liu · 2024 · Materials
- Screen Printed Graphite Nanoplatelet and Nanoparticle Composites for Thermal Interface Materials ApplicationTien-Chan Chang, Yiin‐Kuen Fuh, Sheng‐Xun Tu · 2016 · Microsystem Technologies
- Experiments on the thermal resistance of deformable thermal interface materials under mechanical loadingRichard Kenney, Vaidehi Oruganti, Alfonso Ortega, Don Nguyen, Michael Brooks · 2017 · Annual IEEE Semiconductor Thermal Measurement and Management Symposium/Proceedings
- High Performance Metal-Based Nanocomposite Thermal Interface Materials Toward Enhanced Cooling Efficiency in Electronic ApplicationsNirup Nagabandi, Cengiz Yegin, Mustafa E. S. Akbulut · 2018 · IEEE Electronic Components and Technology Conference (ECTC)
- Fluxless Bonding Technique of Diamond to Copper Using Silver-Indium Multilayer StructureRoozbeh Sheikhi, Yongjun Huo, Chin C. Lee · 2019 · IEEE Electronic Components and Technology Conference (ECTC)
- Reliability Analysis of Thermal Interface Materials (TIMs) in large size FCBGA packageZheng Yi, Cheng Zhong, Haozhe Wang, Jibao Lu, Rong Sun, Ching‐Ping Wong · 2021 · International Conference on Electronic Packaging Technology (ICEPT)
- Viscoelastic Characterization and Simulation of Thermal Interface MaterialsCheng Zhong, Chenglong Li, Yunxia Wang, Jibao Lu, Linlin Ren, Rong Sun, Ching‐Ping Wong · 2021 · International Conference on Electronic Packaging Technology (ICEPT)
- Numerical Study on Effect of Contact and Interfacial Resistance on Thermal Conductivity of Dispersed CompositesAtsushi Kondô, Hiroshi Matsuura, Yoshiharu Ito · 2023 · Materials
- An Improved Efficient Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface MaterialsB. Dan, Bahgat G Sammakia, Ganesh Subbarayan, S. Kanuparthi · 2013 · Journal of Electronic Packaging
- Pressure-Dependent Thermal Characterization of Biporous Copper StructuresCheng‐Hui Lin, Yoonjin Won · 2019 · IEEE Transactions on Components Packaging and Manufacturing Technology
- Rapid Enhancement of Thermal Conductivity by Incorporating Oxide-Free Copper Nanoparticle Clusters for Highly Conductive Liquid Metal-based Thermal Interface MaterialsSeokkan Ki, Jaehwan Shim, Seungtae Oh, Seunggeol Ryu, Jaechoon Kim, Youngsuk Nam · 2021 · IEEE Electronic Components and Technology Conference (ECTC)
- Thermal performance characterization of nano thermal interface materials after power cyclingShuangxi Sun, Xin Luo, Carl Zandén, Björn Carlberg, Lilei Ye, Johan Liu · 2012 · IEEE Electronic Components and Technology Conference (ECTC)
- Polymer nanofiber based continuous metal phase composite for thermal management applicationsBjörn Carlberg, Johan Liu, Li‐Lei Ye · 2010 · Electronic System-Integration Technology Conference (ESTC)
- Study of CNT growth termination mechanism: Effect of catalyst diffusionZhaoli Gao, M.M.F. Yuen · 2012 · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
- Design and evaluation of polymer-carbon nanotube composites for reliable, low resistance, static and dynamic thermal interface materialsCraig E. Green, Leonardo F. Prinzi, Baratunde A. Cola · 2016 · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
- Thermal coefficients of Earth fuller reinforced with nano-oxide particlesGyan Prakash Sharma, Arti Bansal, Ramvir Singh · 2021 · Nano Express
- Metal Surface Treatments for Enhanced Heat Transfer in Metal–Composite Hybrid StructuresDong Hyun Kim, Wonhwa Lee, Jung Bin Park, Jea Uk Lee · 2025 · Micromachines
- Thermal Performance of Silicone and Non-Silicone Thermal Pads as Thermal Interface MaterialsChandan K. Roy, Landon Yarbrough, Hammad Quddus, Megan Batchelor · 2025 · Journal of Experimental and Theoretical Analyses
- Heat sink design investigation via CFD thermal analysis and additive manufacturing rapid prototypingAshkan Alimehr, Arash Nikniazi, Alireza Jalali, Mark R. Daymond, Majid Pahlevani, Vahid Fallah · 2025 · The International Journal of Advanced Manufacturing Technology
- Dual-functional soft magnetic interface materials for quantum packagingZahra Barani, Harshil Goyal, Chase C. Tillman, Oluchi Onwuvuche, Jacob Ward, Mark L. Adams · 2025 · Applied Physics Letters
- Thermal contact resistance between two solid Nylon 66 thin films characterized by Flash DSC measurementYongxuan Chen, Kefeng Xie, Wenbing Hu · 2025 · Thermochimica Acta
- Experimental and numerical investigation of an integrated manifold microchannel cooling system for large-area, high-power electronicsZhou Yang, Kui Li, Yuchi Yang, Wei Wang, Wu Gao, Chi Zhang · 2026 · Applied Thermal Engineering
- Density Modulated Vertical Carbon Nanotube Architectures with Bolometric EffectYasameen Al-Mafrachi, Sandeep Yadav, Sascha Preu, Jörg J. Schneider, Oktay Yilmazoglu · 2024 · Advanced Engineering Materials
- On the Edge of Passive Cooling for Power Converters: Review and Future TrendsZhengwei Dong, Liwei Zhou · 2025 · IEEE Transportation Electrification Conference and Expo
- TIM selection criteria for silicon validation environmentYing Feng Pang, Rahima K. Mohammed, Ridvan Amir Sahan, Yi Xia, Mohanraj Prabhugoud · 2010 · Annual IEEE Semiconductor Thermal Measurement and Management Symposium/Proceedings
- Microprocessor Temperature Sensing and Thermal ManagementChandra Mohan Jha, Jaime A. Sanchez · 2015 · Springer eBooks
- Thermally Conductive Graphene Film/Indium/Aluminum Laminated Composite by Vacuum Assisted Hot-pressingHao Liu, Maomao Zhang, Shujin Chen, Nan Wang, Yong Zhang, Johan Liu · 2020 · International Conference on Electronic Packaging Technology (ICEPT)
- Comparison between two numerical methods for the computation of thermal conductivities of particulate composites: FEM and GeoDictXiaoxin Lu, Jiabin Huang, Jianbin Xu, Jibao Lu, Rong Sun, Ching‐Ping Wong · 2021 · International Conference on Electronic Packaging Technology (ICEPT)
- High Thermal Conductivity of Plasticine‐Based Nanocomposites Developed Using Simple Fabrication for Heat Management in Electronic DevicesSyed Abdul Momin, M. Mariatti · 2021 · Advanced Engineering Materials
- High Performance Compliant Heat SinksMark Schultz · 2022 · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
- Thermal and dielectric multiple percolation in α‐Si 3 N 4 whiskers/silicone rubberDian Zhang, Jiawen Liu, Xiaofeng Yang, Xuan Liu, Qingquan Liang, Yijun Liu · 2023 · Polymer Engineering and Science
- Quantification of switchable thermal conductivity of ferroelectric materials through second-principles calculationJingtong Zhang, Chengwen Bin, Yunhong Zhao, Huazhang Zhang, Sheng Sun, Peng Han, Chang Long Liu, Tao Xu, Gang Tang, Tong‐Yi Zhang et al. · 2024 · Materials Today Physics
- Compliant Direct Attach Liquid CoolingMark Schultz, Pritish R. Parida · 2024 · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
- Nanotechnology radar thermal managementCarlo Falessi, Anna Maria Fiorello, Francesco Toschi, Emanuela Tamburri, Silvia Orlanducci, Maria Letizia Terranova, Aldo Di Carlo, Daniele Passeri, Marco Rossi · 2009 · IEEE Aerospace and Electronic Systems Magazine
- Electrophoretic Deposition of Carbon Nanotubes on Heat Spreader for Fabrication of Thermal Interface Materials (TIM)Raihana Bahru, Abdul Rahman Mohamed, Wei-Ming Yeoh, Khatijah Aisha Yaacob · 2017 · Sains Malaysiana
- Study on thermal contact resistance of low melting alloy used as thermal interface materialMC. Kumar Swamy, Satyanarayan, R. Pinto · 2022 · Materials Today Proceedings
- Thermal analysis and heat dissipation optimization of 3D packaging with TSV interposerHe Ma, Daquan Yu, Jun Wang · 2012 · International Conference on Electronic Packaging Technology (ICEPT)
- Electrothermally bonded carbon nanotube interfacesSriharsha V. Aradhya, Suresh V. Garimella, Timothy S. Fisher · 2008 · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
- Transient thermal characterization with applications to optimized thermal packaging of multi-core microprocessorsYizhang Yang, Maxat N. Touzelbaev · 2008 · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
- Double-sided tin nanowire arrays for advanced thermal interface materialsBo Feng, Fardin Faruque, Peng Bao, An‐Ting Chien, Satish Kumar, George P. Peterson · 2013 · Annual IEEE Semiconductor Thermal Measurement and Management Symposium/Proceedings
- Preparation of VACNT TIM by a novel metallization and chemical bonding processT.S. Wang, Jintang Shang, Jingdong Liu · 2012 · International Conference on Electronic Packaging Technology (ICEPT)
- Atomistic simulations of heat transfer at carbon nanotube/Si interfacesAjing Cao, Jianmin Qu, Matthew Yao · 2010 · IEEE Electronic Components and Technology Conference (ECTC)
- Thermal Conductivity of Thermally Conductive Ceramic Composites and Silicon Carbide/Epoxy Composites through Wetting ProcessYongseon Hwang, Jooheon Kim, WonChul Cho · 2014 · Polymer(Korea)
- Preparation and Thermal Characterization of Carbon Nanotubes-Based Composites for Applications in Electronics PackagingFrancesco Toschi, Emanuela Tamburri, Valeria Guglielmotti, Maria Letizia Terranova, Andrea Reale, Aldo Di Carlo, Daniele Passeri, Marco Rossi, Carlo Falessi, Annamaria Fiorello et al. · 2008 · International Conference on Quantum, Nano and Micro Technologies (ICQNM)
- Thermal Conductance of Cu and Carbon Nanotube Interface Enhanced by a Graphene LayerZhengxing Huang, Liying Wang, Suyuan Bai, Zhenan Tang · 2015 · Chinese Physics Letters
- Carbon Nanotubes and Graphene for Microwave/RF Electronics PackagingXiaoxing Lü · 2017 · Springer eBooks