Thermal Interface Materials: Historical Perspective, Status, and Future Directions

Prasher, R.·2006·Proceedings of the IEEE

Cited by (926)

Items 501–600 of 926

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  14. Non-covalent dispersed carbon nanotube–benzocyclobutene composites as a bonding interface material for three-dimensional integration
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  48. Improved methodology for calculating interfacial thermal resistance and uncertainty for steady-state TIM testers with embedded probes
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  50. Influence of Sustained High Temperature Exposure on the Interface Bond Strength between TIM-Copper Substrates
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  53. Failure analysis of thermal degradation of TIM during power cycling
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