Thermal Interface Materials: Historical Perspective, Status, and Future Directions

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Items 401–500 of 926

1. Thermally Conductive Epoxy Resin Composites Based on 3D Graphene Nanosheet Networks for Electronic Package Heat Dissipation
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2. Thermal Interface Materials in Electronic Packaging
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3. Thermal performance and reliability characterization of bonded interface materials (BIMs)
   Douglas J. DeVoto, Paul P. Paret, Mark Mihalic, Sreekant V. J. Narumanchi, Avram Bar‐Cohen, Kaiser Matin · 2014 · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
4. Bulk Expansion Effect of Gallium-Based Thermal Interface Material
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5. Graphene–graphite hybrid epoxy composites with controllable workability for thermal management
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6. A molecular level performance manipulation of thermal conductivity and moisture diffusivity through a composite membrane considering interfacial resistance
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7. Optimizing filler network formation in poly(hexahydrotriazine) for realizing high thermal conductivity and low oxygen permeation
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8. Anisotropic Thermal Transport in Spray-Coated Single-Phase Two-Dimensional Materials: Synthetic Clay Versus Graphene Oxide
   Alexandra Philipp, Patrick Hummel, Theresa Schilling, Patrick Feicht, Sabine Rosenfeldt, Michael Ertl, Marius Schöttle, Anna M. Lechner, Zhen Xu, Chao Gao et al. · 2020 · ACS Applied Materials & Interfaces
9. Chip packaging: encapsulation of nitride LEDs
   Xiaobing Luo, Run Hu · 2014 · Elsevier eBooks
10. Graphitized-rGO/Polyimide Aerogel as the Compressible Thermal Interface Material with Both High in-Plane and through-Plane Thermal Conductivities
    Peng Fei Lv, Haiquan Cheng, Chenglong Ji, Wei Wei · 2021 · Materials
11. Precuring Matrix Viscosity Controls Thermal Conductivity of Elastomeric Composites with Compression‐Activated Liquid and Solid Metallic Filler Networks
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12. Preparation processes and thermal conductivities of magnetic field- and torsional vibration-induced superoriented carbon fiber composites
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13. Thermal properties of particulate TIMs in squeeze flow
    Reza Hajiaghaee Khiabani, Yogendra Kumar Joshi, Cyrus K. Aidun · 2010 · International Journal of Heat and Mass Transfer
14. A Nanostructuring Method to Decouple Electrical and Thermal Transport through the Formation of Electrically Triggered Conductive Nanofilaments
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15. Preparation of p-Phenylenediamine Modified Graphene Foam/Polyaniline@Epoxy Composite with Superior Thermal and EMI Shielding Performance
    Liu-si Wang, Haoliang Li, Shuning Xiao, Mohan Zhu, Junhe Yang · 2021 · Polymers
16. Gallium oxide-stabilized oil in liquid metal emulsions
    Najam Ul Hassan Shah, Wilson Kong, Nathan Casey, Shreyas Kanetkar, Robert Y. Wang, Konrad Rykaczewski · 2021 · Soft Matter
17. High-performance non-silicone thermal interface materials based on tunable size and polymorphic liquid metal inclusions
    Xiao Jia, Bin Liu, Shikun Li, Xunfeng Li, Jingzhi Zhou, Guohui Zhou, Shijun Wang, Min Xu, Cui Xu, Jun Du et al. · 2022 · Journal of Materials Science
18. Crumpled graphene epoxy nanocomposites modified with polydopamine for advanced semiconductor packaging applications
    Zhijian Sun, Yifan Liu, Ryan Wong, Michael Yu, Jiaxiong Li, Macleary Moran, Mohanalingam Kathaperumal, Ching‐Ping Wong · 2022 · Composites Science and Technology
19. Topological design of channels for squeeze flow optimization of thermal interface materials
    Nikhil Bajaj, Ganesh Subbarayan, Suresh V. Garimella · 2012 · International Journal of Heat and Mass Transfer
20. A molecular dynamics study on the thermal energy transfer and momentum transfer at the solid-liquid interfaces between gold and sheared liquid alkanes
    Abdul Rafeq Saleman, Hari Krishna Chilukoti, Gota Kikugawa, Masahiko Shibahara, Taku Ohara · 2017 · International Journal of Thermal Sciences
21. Performance Testing of 3-W LED Mounted on ZnO Thin Film Coated Al as Heat Sink Using Dual Interface Method
    Mutharasu Devarajan, SUBRAMANI SHANMUGAN, P. Anithambigai, Zeng Yin Ong · 2013 · IEEE Transactions on Electron Devices
22. General multilayer heat transfer model for optical-based thermal characterization techniques
    Xuhui Feng, Charlie King, Sreekant V. J. Narumanchi · 2015 · International Journal of Heat and Mass Transfer
23. Minimizing interface thermal resistance via laser surface micropatterning for enhancing wetting of gallium-based liquid metal with copper
    Xinyu Hu, Ze Tian, Changhao Chen, Guochen Jiang, Lizhong Wang, Rui Peng, Daizhou Li, Hongjun Zhang, Peixun Fan, Minlin Zhong · 2023 · International Journal of Heat and Mass Transfer
24. Enhancement of Mechanical Properties of High-Thermal-Conductivity Composites Comprising Boron Nitride and Poly(methyl methacrylate) Resin through Material Design Utilizing Hansen Solubility Parameters
    Yumi Inagaki, Masakazu Murase, Hiromitsu Tanaka, Daisuke Nakamura · 2024 · ACS Applied Materials & Interfaces
25. Silver-based thermal interface materials with low thermal resistance
    Hui Yu, Rui Zhang, Liangliang Li, Xiaofei Mao, Hongda Du · 2012 · International Conference on Electronic Packaging Technology (ICEPT)
26. Fundamental and innovative approaches for filler design of thermal interface materials based on epoxy resin for high power density electronics application: a retrospective
    Sagar Kumar Nayak, Smita Mohanty, SANJAY KUMAR NAYAK · 2019 · Multiscale and Multidisciplinary Modeling Experiments and Design
27. Analysis of Thermal Performance Metrics—Application to CPU Cooling in HPC Servers
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28. Thermal diffusivity of aligned multi‐walled carbon nanotubes measured by the flash method
    Jani Mäklin, Niina Halonen, Géza Tóth, András Sápi, Ákos Kukovecz, Zoltán Kónya, Heli M. Jantunen, Jyri‐Pekka Mikkola, Krisztián Kordás · 2011 · physica status solidi (b)
29. Thermal conductivities of electrospun polyimide‐mesophase pitch nanofibers and mats
    Han Yan, Nayandeep K. Mahanta, Laurent J. Majerus, Alexis R. Abramson, Miko Cakmak · 2013 · Polymer Engineering and Science
30. Array Volume Fraction-Dependent Thermal Transport Properties of Vertically Aligned Carbon Nanotube Arrays
    Yang Zhao, Rong-Shiuan Chu, Costas P. Grigoropoulos, O. D. Dubón, Arun Majumdar · 2016 · ASME Journal of Heat and Mass Transfer
31. Bonding-induced thermal transport enhancement across a hard/soft material interface using molecular monolayers
    Chao Yuan, Mengyu Huang, Yanhua Cheng, Xiaobing Luo · 2017 · Physical Chemistry Chemical Physics
32. Chemically linked metal-matrix nanocomposites of boron nitride nanosheets and silver as thermal interface materials
    Nirup Nagabandi, Cengiz Yegin, Xuhui Feng, C King, Jun Kyun Oh, Ethan A. Scholar, Sreekant V. J. Narumanchi, Mustafa E. S. Akbulut · 2018 · Nanotechnology
33. Rational design of graphene structures for preparing high-performance thermal interface materials: A mini review
    Junfeng Ying, Wen Dai, Jinhong Yu, Nan Jiang, Cheng‐Te Lin, Qingwei Yan · 2022 · Science China Physics Mechanics and Astronomy
34. Heat management technology for solid‐state high voltage and high repetitive pulse generators: Towards better effects and reliability
    Yanan Wang, Linyuan Ren, Zihao Yang, Saikang Shen, Zichen Deng, Qi Yuan, Weidong Ding, Zhenjie Ding · 2023 · High Voltage
35. Excellent Thermal and Dielectric Properties of Hexagonal Boron Nitride/Phenolic Resin Bulk Composite Material for Heatsink Applications
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36. Fabrication of silicone-based gap filler for electric vehicles using magnesium oxide thermally conductive fillers
    Haewon Jung, Joo‐Hwan Han, In-Chul Jung · 2024 · Journal of the Korean Ceramic Society
37. Thermally conductive polystyrene/epoxy nanocomposites fabricated by selective localization of hybrid fillers
    Le Guo, Chao Xiao, Hui Wang, Lin Chen, Xian Zhang, Kang Zheng, Xingyou Tian · 2016 · Colloid & Polymer Science
38. Design and Validation of a High-Temperature Thermal Interface Resistance Measurement System
    Menglong Hao, Kimberly R. Saviers, Timothy S. Fisher · 2016 · Journal of Thermal Science and Engineering Applications
39. Cooling hot spots by hexagonal boron nitride heat spreaders
    Shuangxi Sun, Jie Bao, Wei Mu, Yifeng Fu, Yong Zhang, Lilei Ye, Johan Liu · 2015 · IEEE Electronic Components and Technology Conference (ECTC)
40. Carbon Nanotube Arrays for Enhanced Thermal Interfaces to Thermoelectric Modules
    Kimberly R. Saviers, Stephen L. Hodson, Timothy S. Fisher, James R. Salvador, Linda S. Kasten · 2013 · Journal of Thermophysics and Heat Transfer
41. Thermal Conductivity Enhancement of Benzocyclobutene With Carbon Nanotubes for Adhesive Bonding in 3-D Integration
    Xiangming Xu, Zheyao Wang · 2011 · IEEE Transactions on Components Packaging and Manufacturing Technology
42. The Importance of the Assembly in Thermoelectric Generators
    Miguel Araiz, Leyre Catalán, Oscar Herrero, G. Pérez-Artieda, Antonio Rodriguez · 2018 · InTech eBooks
43. Thermal Interface Materials Based on Vertically Aligned Carbon Nanotube Arrays: A Review
    Guangjie Yuan, Haohao Li, Bo Shan, Johan Liu · 2018 · Micro and Nanosystems
44. Controlling Thermal Conductivity in Mesoporous Silica Films Using Pore Size and Nanoscale Architecture
    Yan Yan, Man Li, Sophia C. King, Tiphaine Galy, Michal Marszewski, Joon Sang Kang, Laurent Pilon, Yongjie Hu, Sarah H. Tolbert · 2020 · The Journal of Physical Chemistry Letters
45. Thermally conductive adhesives in electronics
    Jan Felba · 2011 · Elsevier eBooks
46. Study on effective thermal conductivity of silicone/phosphor composite and its size effect by Lattice Boltzmann method
    Lan Li, Huai Zheng, Chao Yuan, Run Hu, Xiaobing Luo · 2016 · Heat and Mass Transfer
47. Investigation on heat transfer performance of graphene origami/paraffin nanocomposites using molecular dynamics
    Huanzhi Song, Youzhe Yang, Richard (Chunhui) Yang, Jie Yang, Yingyan Zhang · 2025 · Composites Communications
48. Fully diamond-based embedded manifold microchannel heat sink: Achieving ultra-high heat flux cooling
    Jianyu Du, Xinyi Wei, Haoyang Sun, Shangyang Shi, Jiale Tu, Feng Ji, Junjun Wei, Wei Wang, Chi Zhang · 2026 · International Journal of Heat and Mass Transfer
49. Hybrid carbon thermal interface materials for thermoelectric generator devices
    Seok-Hwan Chung, Jong Tae Kim, Dong Hwan Kim · 2020 · Scientific Reports
50. On the influence of lid materials for flip-chip ball grid array package applications
    Mateus Bagetti Jeronimo, Jens Schindele, Hubert Straub, Przemyslaw Jakub Gromala, Bernhard Wunderle, André Zimmermann · 2022 · Microelectronics Reliability
51. Enhancing the Thermal Conductivity of CNT/AlN/Silicone Rubber Composites by Using CNTs Directly Grown on AlN to Achieve a Reduced Filler Filling Ratio
    Naoyuki Matsumoto, Don Norimi Futaba, Takeo Yamada, Ken Kokubo · 2024 · Nanomaterials
52. Preparation of tourmaline/graphene oxide and its application in thermal interface materials
    Zhihuan Huang, Tao Wang, Xue Liang Zhang, Luning Zheng, Gang Xue, Jinsheng Liang · 2016 · Journal of Composite Materials
53. Elastocaloric cooling: roadmap towards successful implementation in the built environment
    Giulia Ulpiani, Gianluca Ranzi, Florian Bruederlin, Riccardo Paolini, Francesco Fiorito, Shamila Haddad, Manfred Kohl, M. Santamouris · 2019 · AIMS Materials Science
54. Segregated nanofiller: Recent development in polymer-based composites and its applications
    Aquilina Alfred, Saidatul Shima Jamari, M. Mariatti, Suriati Binti Ghazali · 2023 · Materials Today Proceedings
55. Thermal Conductivity Enhancement of Epoxy Composites by Interfacial Covalent Bonding for Underfill and Thermal Interfacial Materials in Cu/Low-K Application
    Qizhen Liang, Kyoung‐sik Moon, Hongjin Jiang, Ching Ping Wong · 2012 · IEEE Transactions on Components Packaging and Manufacturing Technology
56. Improved thermal interface property of carbon nanotube–Cu composite based on supercritical fluid deposition
    Zhonglie An, Masaya Toda, Takahito Ono · 2014 · Carbon
57. Unusual tensile behaviour of fibre-reinforced indium matrix composite and its in-situ TEM straining observation
    Xin Luo, Jianchao Peng, Carl Zandén, Yanping Yang, Wei Mu, Michael Edwards, Lilei Ye, Johan Liu · 2015 · Acta Materialia
58. Maximum Resolution of a Probe-Based, Steady-State Thermal Interface Material Characterization Instrument
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59. Enhanced thermal conductivity of flexible h-BN/polyimide composites films with ethyl cellulose
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60. Silicon carbonitride covered SiC composites for enhanced thermal conductivity and electrical insulation
    Yongseon Hwang, Kisang Ahn, Jooheon Kim · 2014 · Applied Thermal Engineering
61. Analysis of simplified heat transfer models for thermal property determination of nano-film by TDTR method
    Xinwei Wang, Zhe Chen, Fangyuan Sun, Hang Zhang, Yuyan Jiang, Dawei Tang · 2017 · Measurement Science and Technology
62. Designing Oxide Fillers for Advanced Thermal Interface Materials: Recent Progress and Future Perspectives
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63. A Review on Cooling Systems for Portable Energy Storage Units
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64. High‐Yield‐Stress Particle‐Stabilized Emulsion for Form‐Factor‐Free Thermal Pastes with High Thermal Conductivity, Stability, and Recyclability
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65. Thermal interface polymer-based composites materials: a critical review
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66. Thermal Transient Analysis of High-Power Green LED Fixed on BN Coated Al Substrates as Heatsink
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67. Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers
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68. Supercritical fluid processing of boron nitride nanosheets for polymeric nanocomposites of superior thermal transport properties
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69. Investigation of Thermal Greases with Hybrid Fillers and Its Operational Bench Test
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70. Fabrication of glass-ceramics containing spin-chain compound SrCuO2 and its high thermal conductivity
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71. Development of Integrated Modular Motor Drive for Traction Applications
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72. Temperature-dependent thermal conductivity of silicone-Al2O3 nanocomposites
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73. Hybrid Nanocomposite Thermal Interface Materials: The Thermal Conductivity and the Packing Density
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74. Silver nanoparticles decorated α-alumina as a hybrid filler to fabricate epoxy-based thermal conductive hybrid composite for electronics packaging application
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75. Performance of 9.0 W light-emitting diode on various layers of magnesium oxide thin film thermal interface material
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76. Enhanced Thermal Conductivity in Polyimide/Silver Particle Composite Films Based on Spontaneous Formation of Thermal Conductive Paths
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77. Testing and Analysis of Boron-Doped Aluminum Nitride Thin-Film-Coated Al as Thermal Substrates in PCB Fabrication for LED Application
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78. Effects of In Situ Modification of Aluminum Fillers on the Rheological Properties and Thermal Resistance of Gel Thermal Interface Materials
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79. Thermal Characterization of Metal-Diamond Composite Heat Spreaders Using Low-Frequency-Domain Thermoreflectance
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80. Interface regulation of diamond-doped GaInSn composites
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81. A novel steady-state method for measuring thermal conductivity of thermal interface materials with miniaturized thermal test chips
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82. Characterization for graphene as heat spreader using thermal imaging method
    Shirong Huang, Yong Zhang, Shuangxi Sun, Xiaogang Fan, Ling Wang, Yifeng Fu, Yan Zhang, Johan Liu · 2013 · International Conference on Electronic Packaging Technology (ICEPT)
83. Transient thermoreflectance from graphene composites with matrix of indium and copper
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84. Electroplated copper nanowires as Thermal Interface Materials
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85. Thermal characterizations analysis of high-power ThinGaN cool-white light-emitting diodes
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86. Investigation of thermal and mechanical properties of synthetic graphite and recycled carbon fiber filled polypropylene composites
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87. Investigations regarding the influence of soft metal and low melting temperature alloy on thermal contact resistance
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88. Anti-leak, self-adaptive liquid metal-epoxy in-situ cured composites with ultra-low thermal resistance via flexible droplet inclusions
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89. Thermal characterization of thermal interface material bondlines
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90. Thermally Conductive Electrically Insulating Polymer Nanocomposites
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91. Brazed Carbon Nanotube Arrays: Decoupling Thermal Conductance and Mechanical Rigidity
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92. Feasibility investigation and characterization of low-pressure-assisted sintered-silver bonded large-area DBA plates
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93. A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages
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94. The effects of graphene-based films as heat spreaders for thermal management in electronic packaging
    Shirong Huang, Jie Bao, Hui Ye, Ning Wang, Guangjie Yuan, Wei Ke, Dongsheng Zhang, Yue Wang, Yifeng Fu, Lilei Ye et al. · 2016 · International Conference on Electronic Packaging Technology (ICEPT)
95. A compliant microstructured thermal interface material for dry and pluggable interfaces
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96. Exploring the role of liquid braze filling the dissimilar Cf/C-Haynes 230 joint to enhance the interfacial heat transfer
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97. Experimental study on flow optimization and thermal performance enhancement of an ultrathin silicon-based loop heat pipe
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98. Low magnetic field alignment of carbon fibers in a polymer matrix for high-performance thermal interface materials
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99. Lattice thermal conductivity of 8-16-4(sun)-graphyne from reverse nonequilibrium molecular dynamics simulations
    Isaac M. Félix, Raphael M. Tromer, Leonardo Dantas Machado, Douglas Soares Galvao, Luiz Antônio Ribeiro, Marcelo Lopes Pereira · 2025 · International Journal of Heat and Mass Transfer
100. Ultrahigh Thermally Conductive Graphene-Based Thermal Interface Material with Low Compressive Modulus
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