Cited by 272Silicon Carbide Semiconductor TechnologiesReliability and Maintenance OptimizationIntegrated Circuits and Semiconductor Failure Analysis

The DOI matches its Crossref record; 129 of the 133 references it cites were found in a registry or an index.

A Comprehensive Review Toward the State-of-the-Art in Failure and Lifetime Predictions of Power Electronic Devices

Open access

Hanif, Abu, Yu, Yuechuan, DeVoto, Douglas, Khan, Faisal·2019·IEEE Transactions on Power Electronics

DOI 10.1109/tpel.2018.2860587

Open this paper in CoChat — free account Open PDF

Abstract

This paper discusses various types of failure mechanisms, precursor parameters, and accelerated aging-based procedures to estimate the remaining life of power electronic devices. Special attention has been given to summarize the different techniques typically used for measuring the junction temperature, because it plays a vital role during accelerated aging and condition monitoring. We reviewed more than 250 papers, and the references list 139 of them in order to explain and address the advantages and disadvantages of various techniques toward the reliability prognosis. Thus, this paper can be considered as an expedient reference to conduct future research on lifetime prediction of existing power electronic devices.

The claims and statistics of this paper haven’t been checked yet.

Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.

Integrity signals

Registry

Crossref · 10.1109/tpel.2018.2860587

Cites

129 of 129 references verified0 citation errors · 0 not checkable

Statistics

Claims the paper makes

The claims and statistics of this paper haven’t been checked yet.

Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.

Claims other papers make about this one

Each is checked against this paper’s own text: does it say what the citing paper says it does?

Self-check

Percentages, sums and reported differences re-computed from the paper’s own numbers.

The self-check needs the paper’s full text.

A Study of the Effects of Cyclic Thermal Stresses on a Ductile Metal
Coffin, L. F. (1954) · Transactions of the American Society of Mechanical Engineers · doi:10.1115/1.4015020 · Cited by 2,241
Condition Monitoring for Device Reliability in Power Electronic Converters: A Review
Yang, S., Xiang, D., Bryant, A., Mawby, P., Ran, L., & Tavner, P. (2010) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2010.2049377 · Cited by 1,278
Behavior of materials under conditions of thermal stress
Manson, S. S. (1953) · NASA STI Repository (National Aeronautics and Space Administration) · Cited by 1,230
Selected failure mechanisms of modern power modules
Ciappa, M. (2002) · Microelectronics Reliability · doi:10.1016/s0026-2714(02)00042-2 · Cited by 1,039
Survey on Reliability of Power Electronic Systems
Song, Y., & Wang, B. (2012) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2012.2192503 · Cited by 867
Transitioning to Physics-of-Failure as a Reliability Driver in Power Electronics
Wang, H., Liserre, M., Blaabjerg, F., de Place Rimmen, P., Jacobsen, J. B., Kvisgaard, T., & Landkildehus, J. (2014) · IEEE Journal of Emerging and Selected Topics in Power Electronics · doi:10.1109/jestpe.2013.2290282 · Cited by 693
Ageing and Failure Modes of IGBT Modules in High-Temperature Power Cycling
Smet, V., Forest, F., Huselstein, J.-J., Richardeau, F., Khatir, Z., Lefebvre, S., & Berkani, M. (2011) · IEEE Transactions on Industrial Electronics · doi:10.1109/tie.2011.2114313 · Cited by 620
Fast power cycling test of IGBT modules in traction application
Held, M., Jacob, P., Nicoletti, G. J., Scacco, P., & Poech, M. (2002) · IEEE International Conference on Power Electronics and Drive Systems (PEDS) · doi:10.1109/peds.1997.618742 · Cited by 587
Untitled work
(2008) · Cited by 578
Solder joint fatigue models: review and applicability to chip scale packages
Lee, W. W., Nguyen, L. T., & Selvaduray, G. S. (2000) · Microelectronics Reliability · doi:10.1016/s0026-2714(99)00061-x · Cited by 525

Flagged first, then by citations

Show all 133 references

4 of the 133 references couldn’t be matched to a known paper.

Research works printed but not linked: 7

singh, 0, Power MOSFET failure mechanisms, telecommunications energy conference, Proc 26th Annu Int Telecommun Energy Conf, 499
valentine, 0, Failure mechanisms of insulated gate bipolar transistors (IGBTs), Proc NREL Photovolt Rel Workshops, 6
scheuermann, 0, Chip temperature measurement without additional sensors, Bodo's Power Syst, 58
2017, Standard Practices for Cycle Counting in Fatigue Analysis Annual Book of ASTM Standards
2010, Power Semiconductor Reliability Handbook, Alpha & Omega Semiconductor, 8
10.1109/TPEL.2016.2521899 · DOI · Paper page
lobsiger, 0, Voltage, current and temperature measurement concepts enabling intelligent gate drives, ECPE Workshop Electronics Around the Power Switch Gate Drives Sensors and Control

Sorted by citations

Items 101–200 of 272

Precise and Fast Real-Time Measurement of Junction Temperature in SiC Power MOSFETs
Hu, B., Wang, J., Ke, Z., Zhang, C., He, M., Yu, H., & Ding, Y. (2024) · IEEE Transactions on Industry Applications · doi:10.1109/tia.2024.3432863 · Cited by 8
Comparative analysis and evaluation of ageing forecasting methods for semiconductor devices in online health monitoring
Villalobos, A., Barrutia, I., Alzola, R. P., Dragičević, T., & Aizpurua, J. I. (2025) · Engineering Applications of Artificial Intelligence · doi:10.1016/j.engappai.2025.110545 · Cited by 8
Degradation Detection of Power Switches in a Live Three Phase Inverter using SSTDR Signal Embedded PWM Sequence
Roy, S., Hanif, A., & Khan, F. (2020) · IEEE International Reliability Physics Symposium proceedings · doi:10.1109/irps45951.2020.9128311 · Cited by 8
Self-citation
Control and Management of Multiple Converters in a Residential Smart Grid
Starke, M. R., Xiao, B., Thapa, A., Bhowmik, P. K., Campbell, S. L., Moorthy, R. S. K., & Chinthavali, M. (2021) · Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition · doi:10.1109/apec42165.2021.9487327 · Cited by 8
Review of parametric fault prediction methods for power electronic circuits
Fan, J., & Yuan, W. (2021) · Engineering Research Express · doi:10.1088/2631-8695/ac340b · Cited by 8
End-of-Life Detection of Power Electronic Converters by Exploiting an Application-Level Health Precursor
Kjær, M., Wang, H., & Blaabjerg, F. (2022) · IEEE Open Journal of Power Electronics · doi:10.1109/ojpel.2022.3196134 · Cited by 8
Prediction Method for the Remaining Useful Life of Power MOSFETs Based on Deep Learning
Gao, L., Liu, C., Wu, F., Qin, Y., Wang, Y., & Huo, M. (2025) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2025.3586684 · Cited by 7
Thermal Management in Biomedical Devices: A Review of Heat Transfer Mechanisms in Wearable Technologies
Obanor, E. I., Oyedepo, S. O., Dirisu, J. O., John, M. E., Obanor, P. O., Obanor, P. O., & Nkwor, J. C. (2025) · Biomedical Materials & Devices · doi:10.1007/s44174-025-00461-8 · Cited by 7
Solder die attach lifetime characterization of SOT-227 power MOSFET module in a 3-phase inverter under power cycling
Cheng, H., & Hsu, C.-W. (2023) · Journal of Mechanics · doi:10.1093/jom/ufad043 · Cited by 7
Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation
Cheng, H., & Liu, Y.-C. (2022) · Journal of Electronic Packaging · doi:10.1115/1.4055591 · Cited by 7
Recursive zonotopic set-membership approach for system-level prognostics with application to linear parameter-varying systems
Al-Mohamad, A., Puig, V., & Hoblos, G. (2022) · ISA Transactions · doi:10.1016/j.isatra.2022.09.031 · Cited by 7
A Review of Techniques for Effective Thermal Management in Power ElectronicsPreprint
Orville, T., Tajwar, M., Bihani, R., Saha, P., & Hannan, M. A. (2024) · SSRN Electronic Journal · doi:10.2139/ssrn.4858468 · Cited by 7
Porous pathways to chill: Unravelling the influence of metal foam characteristics on heat transfer dynamics through experimental investigation
Khoso, A. Q., Fareedi, A. U. R., Khan, H., Manca, O., Buonomo, B., & Nardini, S. (2025) · International Journal of Heat and Mass Transfer · doi:10.1016/j.ijheatmasstransfer.2025.127829 · Cited by 6
Advancements in TLP Bonding for Power Electronics Die‐Attach Applications
Battal, F., Boss, D., Poelma, R. H., Vlieg, E., & Schermer, J. J. (2025) · Advanced Materials Technologies · doi:10.1002/admt.202501166 · Cited by 6
Harmonic Mitigation in Inverter Circuits Through Innovative LC Filter Design Using PSIM
Usman, H. M., Mahmud, M., Saminu, S., & Ibrahim, S. (2024) · Jurnal Ilmiah Teknik Elektro Komputer dan Informatika · doi:10.26555/jiteki.v10i1.28398 · Cited by 6
Review on the Thermal Parameters Applications in the Reliability of Power Semiconductor Device
Shen, H., Zhang, J., Sun, P., & Ma, X. (2024) · IEEE International Electrical and Energy Conference (CIEEC) · doi:10.1109/cieec60922.2024.10583571 · Cited by 6
Data-driven Prognostics based on Evolving Fuzzy Degradation Models for Power Semiconductor Devices
Boutrous, K., de Bessa, I. V., Puig, V., Nejjari, F., & Palhares, R. M. (2022) · PHM Society European Conference · doi:10.36001/phme.2022.v7i1.3338 · Cited by 6
Short-Circuit Behavior and Voltage Redistribution of IGBTs in Bridge Structures
Yang, Y., Wu, Y., Li, X., Zhao, Z., Zhou, J., He, Z., Cui, X., & Tang, G. (2022) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2022.3208592 · Cited by 6
Mission profile simplification method for reliability analysis of PV converters
Fogsgaard, M. B., Bahman, A. S., Iannuzzo, F., & Blaabjerg, F. (2022) · Microelectronics Reliability · doi:10.1016/j.microrel.2022.114651 · Cited by 6
Direct On-Chip IGBT Thermal Sensing Using Adhesive Bonded FBG Sensors
Chen, S., Vilchis-Rodriguez, D. S., Barnes, M., & Djurović, S. (2023) · IEEE Sensors Journal · doi:10.1109/jsen.2023.3301070 · Cited by 6
Fault detection observer design for networked control system with long time-delays and data packet dropout
Li, X., Wu, X., Xu, Z., & Huang, C. (2010) · Journal of Systems Engineering and Electronics · doi:10.3969/j.issn.1004-4132.2010.05.023 · Cited by 6
Dynamic Safe Operating Area (SOA) of Power Semiconductor Devices
Roy, S., & Khan, F. (2020) · Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition · doi:10.1109/apec39645.2020.9124189 · Cited by 6
Self-citation
Open-Circuit Fault Diagnosis for Three-Level ANPC Inverter Drives Using Improved 1D Convolutional Neural Network
Wu, S., Xu, S., Yao, C., Li, G., & Ma, G. (2024) · International Power Electronics and Motion Control Conference (EPE-PEMC) · doi:10.1109/ipemc-ecceasia60879.2024.10567864 · Cited by 5
A Gate Open-Circuit Failure Detection Method of SiC MOSFETs Based on Internal Gate State Extraction
Yu, S., Wang, Z., Tan, L., Qin, J., Zhou, D., Wu, Y., Zhou, Y., Xin, G., & Shi, X. (2024) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2024.3444464 · Cited by 5
A Lifetime Prediction Method for SiC MOSFET Under Low Air Pressure Environment Considering Variation of Convective Heat Transfer Coefficient
Wang, Z., Du, X., Nie, H., & Tai, H. (2025) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2025.3582296 · Cited by 5
Comparison Study on Parametric Fault Diagnosis Using BPNN, SVM and SDAE for DC-DC Converters in Aircraft
Wang, T., Sun, J., Yao, W., Zhang, X., Li, W., & Wang, Y. (2023) · European Conference on Power Electronics and Applications · doi:10.23919/epe23ecceeurope58414.2023.10264256 · Cited by 5
Damage-Based Lifetime Modeling for Power Electronic Devices
Guo, C., Guo, C., & Lu, Z. (2023) · PHM Society Asia-Pacific Conference · doi:10.36001/phmap.2023.v4i1.3756 · Cited by 5
The reliability prediction of torpedo electronic components in service life
Liang, Q., Zhang, X., & Hu, Q. (2021) · Journal of Navigation · doi:10.1017/s0373463321000552 · Cited by 5
A Data-Driven Approach for Predicting Remaining Useful Life of Semiconductor Devices Based on Machine Learning and Synthetic Data Generation: A Review and Case Study on SiC MOSFETs
Cruz, Y. J., Castaño, F., Villalonga, A., Mishra, M., & Haber, R. E. (2025) · IEEE Access · doi:10.1109/access.2025.3596444 · Cited by 4
Remaining Useful Life Prediction of SiC MOSFETs Based on SVMD-SSA-Transformer Model
Lin, Y., Guo, Q., Cai, W., Zhang, X., & Yang, L. (2025) · Electronics · doi:10.3390/electronics14214284 · Cited by 4
Multi-Physics Models of a Low-Voltage Power Semiconductor System-in-Package for Automotive Applications
Mauromicale, G., Calabretta, M., Scarcella, G., Scelba, G., & Sitta, A. (2022) · Journal of Electronic Packaging · doi:10.1115/1.4056413 · Cited by 4
Study of thermocouple degradation through accelerated aging under corrosive environment
Kumar, V. D., Bhattacharyya, A., Behera, R. P., & Prabakar, K. (2023) · International Conference on Signal Processing and Integrated Networks (SPIN) · doi:10.1109/spin57001.2023.10116553 · Cited by 4
RUL Estimation for Package Failure of Power Electronic Devices Using Integral Mean of Precursor Signal
Lu, Z., Guo, C., Ghesquière, P., Kriegel, K., & Mitić, G. (2023) · PHM Society Asia-Pacific Conference · doi:10.36001/phmap.2023.v4i1.3643 · Cited by 4
Reliability Analysis of Modular Multilevel Converters in MVDC Applications
Tian, Y., & Konstantinou, G. S. (2024) · e-Prime - Advances in Electrical Engineering Electronics and Energy · doi:10.1016/j.prime.2024.100671 · Cited by 4
A Survey on Mission-Profile-Based Stress Testing of Electric Motor Drives
Živković, L., Benšić, T., Barukčić, M., & Kurtović, G. (2025) · Applied Sciences · doi:10.3390/app15095082 · Cited by 4
Remaining Useful Life Prediction of SiC MOSFETs Using the Autoformer-RELM Model
Luo, W., Liu, Y., Pan, Y., & Bai, L. (2025) · IEEE Transactions on Instrumentation and Measurement · doi:10.1109/tim.2025.3579735 · Cited by 7
Aging Detection of Multiple Power Switches in a Live 3-Phase Inverter using Reflectometry
Roy, S., Hanif, A., & Khan, F. (2020) · IEEE Kansas Power and Energy Conference (KPEC) · doi:10.1109/kpec47870.2020.9167565 · Cited by 4
Self-citation
Micro-controllers and Power Devices used in Multilevel Inverters - A Survey
Suryawanshi, A. R., Chopade, N. B., & Mehta, H. (2021) · International Conference on Green Energy, Computing and Sustainable Technology (GECOST) · doi:10.1109/gecost52368.2021.9538707 · Cited by 4
Reliability analysis and reliable operation of three-level ANPC inverter
Zheng, X., Huang, X., Chen, P., Chong, Z., & Yuan, Z. (2023) · Frontiers in Energy Research · doi:10.3389/fenrg.2022.1124523 · Cited by 4
Prognostics and Health Management Using Nonlinear Cumulative Damage Model for Electronic Devices Under Variable Loading
Lee, S., Park, S., & Han, C. (2023) · IEEE Access · doi:10.1109/access.2023.3347780 · Cited by 4
A Fault-Tolerant Hybrid Cascaded H-Bridge Topology
Mhiesan, H. G., Mantooth, A., & Siwakoti, Y. P. (2019) · IEEE Energy Conversion Congress and Exposition (ECCE) · doi:10.1109/ecce.2019.8912836 · Cited by 4
Mission-Profile Based Reliability Analysis Scheme of IGBT Modules for Traction Rectifier
Ke, Q., Xu, Z., Ge, X., Deng, Q., Wang, H., Zhang, L., & Li, J. (2022) · International Power Electronics Conference (IPEC) · doi:10.23919/ipec-himeji2022-ecce53331.2022.9807257 · Cited by 4
IGBT Junction Temperature Monitoring and State Identification Based on AWG-NN
Li, T., Pei, S., & Zhang, J. (2025) · IEEE Sensors Journal · doi:10.1109/jsen.2025.3596186 · Cited by 3
Experimental investigation on the thermal performance of heat pipe with hybrid wick structure
Zheng, F., Li, H., Chen, D., Xu, S., Yu, C., & Li, X. (2025) · Thermal Science and Engineering Progress · doi:10.1016/j.tsep.2025.103968 · Cited by 3
Design of Cu/Zr Alloy Interface for Enhanced Thermal Fatigue Performance in Electronic Packaging
Ferguson, J. B., Kanel, S. R., Jones, J. G., Shenogin, S. V., Sihn, S., Mahalingam, K., Wheeler, R. A., Bowers, C. T., Islam, M. S., & Roy, A. K. (2025) · ACS Omega · doi:10.1021/acsomega.5c06959 · Cited by 3
Turn-OFF Delay Time Based Online Junction Temperature Monitoring for SiC MOSFETs Over Aging
Zhang, B., Wang, Z., Zou, Z., Shi, G., Qiu, Y., & Du, B. (2025) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2025.3596062 · Cited by 3
Decoupled Degradation Monitoring of IGBT Modules Based on Temperature-Quantified Indicators
Ge, X., Liao, Y., Xie, D., Xu, Z., Ke, Q., Wang, H., Zhang, Y., Lutz, J., & Basler, T. (2026) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2026.3662375 · Cited by 3
Materials Engineering and Artificial Intelligence Innovations: A Comprehensive Review
Bouiti, K., Hamdouni, Y. E., Labjar, N., Labjar, H., Lagmiri, S. N., Nasrellah, H., & Hajjaji, S. E. (2025) · Journal of Materials Engineering and Performance · doi:10.1007/s11665-025-11040-9 · Cited by 3
Effect of Thermal Cycle Ageing on the Breakdown Performance of Epoxy and Its Micro-composites
Long, Y., Cheng, Z., Yan, Z., Chen, D., Li, J., Hu, J., Wang, K., Xia, H., & Wang, S. (2021) · IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) · doi:10.1109/ceidp50766.2021.9705385 · Cited by 3
Health Factor Prediction Of Power Drive Components Based On GWO-LSTM
Lv, C., Cheng, J., Tan, M., & Ding, W. (2022) · Global Reliability and Prognostics and Health Management Conference (PHM) · doi:10.1109/phm-yantai55411.2022.9941778 · Cited by 3
Lifetime estimation of p-channel power VDMOSFETs applied in automotive applications
Mitrović, N., Veljković, S., Prijić, Z., & Danković, D. (2023) · Zooming Innovation in Consumer Technologies Conference (ZINC) · doi:10.1109/zinc58345.2023.10174162 · Cited by 3
A stochastic model-based prognostic for IGBT power module remaining useful life estimation using a physical model-based shape function
Al-Sqour, A.-M. B., Ibrahim, A., Khatir, Z., & Cornet, S. (2024) · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · doi:10.1109/eurosime60745.2024.10491565 · Cited by 3
Lifetime Prediction in Power Semiconductor Devices: A Comparative study between Analytical Modeling and Artificial Neural Network
Vaccaro, A., Zilio, A., & Magnone, P. (2023) · Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition · doi:10.1109/apec43580.2023.10131380 · Cited by 3
Influence of Pulse Duration on the Double Linear Damage Accumulation Rule With Power Cycling Test for the Lifetime Prediction in Power Devices
Zhang, C., Du, B., Qiao, K., & Cui, S. (2025) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2025.3538565 · Cited by 2
An Asymmetric SiC Power Module Directly Integrated with Vapor Chamber for Thermal Balancing in MMC
Wang, B., Zhou, X., Zhu, Y., Qi, M., Lin, H., Yao, B., Huang, S., Wang, X., Wu, Q., & Liu, W. (2025) · Applied Sciences · doi:10.3390/app152010869 · Cited by 2
Electrical Treeing Resistance in Epoxy Resins With Varied Molecular Structures Under High-Frequency and High-Temperature Conditions
Zhang, Y., Cai, Y., Lin, W., Liu, Y., Hu, H., & Wu, K. (2025) · IEEE Transactions on Dielectrics and Electrical Insulation · doi:10.1109/tdei.2025.3648700 · Cited by 2
Recycling power semiconductor devices
Sun, P., Zeng, Z., Pan, X., Ran, L., Hu, Y., Huang, S., Wang, Y., & Li, J. (2026) · Nature Reviews Electrical Engineering · doi:10.1038/s44287-025-00242-x · Cited by 4
Stress-driven reliability-by-design for heterogeneous integration: from packaging architectures to intelligent management
Jing, X., Sun, W., Wong, Y. H., He, P., Cao, L., & Zhang, S. (2026) · Chip · doi:10.1016/j.chip.2026.100195 · Cited by 2
FEM-aided damage model calibration method for experimental results
Fogsgaard, M. B., & Iannuzzo, F. (2020) · Microelectronics Reliability · doi:10.1016/j.microrel.2020.113915 · Cited by 2
Long-Term Forecasting Method for Power Electronics-Based System Design
Sandelić, M., Zhang, Y., Peyghami, S., Sangwongwanich, A., & Blaabjerg, F. (2022) · International Conference on Probabilistic Methods Applied to Power Systems (PMAPS) · doi:10.1109/pmaps53380.2022.9810651 · Cited by 2
A Gate Current Detection for Short-Circuit Protection of SiC MOSFET
Hu, B., Ke, Z., He, M., Zhang, C., Liu, Z., & Wang, J. (2023) · IEEE China International Youth Conference on Electrical Engineering (CIYCEE) · doi:10.1109/ciycee59789.2023.10401650 · Cited by 2
Health Condition Estimation for Discrete Power Electronic Devices under Package Failure
Lu, Z., & Otto, A. (2024) · IEEE Conference on Prognostics and Health Management · doi:10.1109/icphm61352.2024.10626431 · Cited by 2
Storage Life Prediction of High-Voltage Diodes Based on Improved Artificial Bee Colony Algorithm Optimized LSTM-Transformer Framework
Liu, Z., Yang, S., & Suo, B. (2025) · Electronics · doi:10.3390/electronics14153030 · Cited by 2
Simple Hybrid Model for Estimating Remaining Useful Life of SiC MOSFETs in Power Cycling Experiments
Eng, M. P., Lövberg, A., Misiorny, M., Vermelin, W. S., Brinkfeldt, K., & Mishra, M. (2023) · PHM Society Asia-Pacific Conference · doi:10.36001/phmap.2023.v4i1.3744 · Cited by 2
An Outlook on Power Electronics Reliability and Reliability Monitoring
Martin, H., Smits, E. C. P., Poelma, R. H., van Driel, W. D., & Zhang, G. (2024) · Springer eBooks · doi:10.1007/978-3-031-59361-1_10 · Cited by 2
Study on Fretting Wear and Electrical Contact for Single PP-IEGT Chip Module under Power Cycling Test
Dai, S., Liu, Z., Zhao, Y., Wang, Z., & Li, G. (2021) · IEEE International Electrical and Energy Conference (CIEEC) · doi:10.1109/cieec50170.2021.9510736 · Cited by 1
Reliability analysis of torpedo loading based on fractional-order optimization model
Yang, C., Liang, Q., Hao, X., & Lin, S. (2023) · Journal of Systems Engineering and Electronics · doi:10.23919/jsee.2023.000085 · Cited by 1
When Views Do Not Match: Different Insights of Management and Staff Into Frequency Converter Reliability and Maintenance
Korpinen, K., Kärkkäinen, T. J., & Silventoinen, P. (2023) · IEEE Engineering Management Review · doi:10.1109/emr.2023.3346036 · Cited by 1
Optimization Design of Temperature Field Distribution for AC High Voltage Parallel Capacitors
Guo, J., Lin, H., Li, H., Xu, M., Huang, X., & Jiang, S. (2024) · Journal of Physics Conference Series · doi:10.1088/1742-6596/2785/1/012120 · Cited by 1
IoT-Based IGBT Power Module Health Monitoring System With RUL Estimation for Electric Drive Applications
Manikandan, R., & Singh, R. R. (2024) · IEEE Access · doi:10.1109/access.2024.3443138 · Cited by 1
A Junction Temperature Monitoring Method with Miller Plateau based on Principal Component Analysis and Artificial Neural Networks
Luo, S., Yang, B., Zhao, Y., Xiang, L., Shi, X., Yu, B., Luo, H., & Li, W. (2024) · CPSS & IEEE International Symposium on Energy Storage and Conversion (ISESC) · doi:10.1109/isesc63657.2024.10785269 · Cited by 1
On the validity of rainflow counting-based lifetime assessment for power electronics assembly
Zhao, D., Letz, S., Leib, J., & Eckardt, B. (2025) · Microelectronics Reliability · doi:10.1016/j.microrel.2025.115651 · Cited by 1
Physical Resilience in a Multiport Converter for Prosumer Systems: Proposal and Analysis
González-Rivera, J., Cardenas, V. M., Quiroz-Vazquez, F., Gonzalez-Garcia, M. A., & Hernandez, R. (2025) · IEEE Access · doi:10.1109/access.2025.3561102 · Cited by 1
Life Prediction Model for Press-Pack IGBT Module Based on Thermal Resistance Degradation
Zhou, R., Wang, X., Li, J., An, T., Yu, Z., Wang, X., & Li, Y. (2025) · Electronics · doi:10.3390/electronics14091726 · Cited by 1
A Biodegradable Radical Polymer Enables High‐Performance, Physically Transient Organic Memory
Ko, J., Kim, S., Kim, D., Lim, T., Jin, S., Jeong, Y., Joo, Y., & Cho, S. (2025) · Angewandte Chemie · doi:10.1002/ange.202422826 · Cited by 1
Physics-informed Neural Network Approach for Early Degradation Trajectory Prediction of Power Semiconductor Modules
Kong, J., Zhang, Y., Zhang, Y., Wick, L., Hansen, F. L., Zhou, D., & Wang, H. (2025) · Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition · doi:10.1109/apec48143.2025.10977327 · Cited by 1
Lifetime Prediction of High-Current IGBT Modules Considering Bond Wire Degradation Under Nonconstant Stress
Jiang, X., Fan, T., Qiu, Z., Zheng, D., He, G., Ning, P., & Wen, X. (2025) · IEEE Journal of Emerging and Selected Topics in Power Electronics · doi:10.1109/jestpe.2025.3585655 · Cited by 1
AI-Based Optimization of Co-Designed Stacked Metallized Substrate Module Structures
Zaghari, P., Sinha, S. S., Hopkins, D. C., & Ryu, J. E. (2025) · International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) · doi:10.1109/3d-peim64703.2025.11180267 · Cited by 1
FCS-MPC-based temperature balancing method for single-phase three-level rectifiers under IGBT aging conditions
Yu, Y., Luo, G., Tao, H., He, Y., & Liu, Z. (2025) · Journal of Power Electronics · doi:10.1007/s43236-025-01200-4 · Cited by 1
Self-citation
Optimization of multi-orifice synthetic jet configuration using flow and heat transfer characteristics coupled with machine learning
Kumar, R., Mirikar, D., Rehman, M. Z. U., Bhatnagar, A., Kumar, N., & Yadav, H. (2025) · International Communications in Heat and Mass Transfer · doi:10.1016/j.icheatmasstransfer.2025.110160 · Cited by 1
Active thermal management method of dual-motor drive system for improving the travel performance of electric tracked vehicles
Zu, W., Ying, Z., Ding, X., & Zhang, S. (2026) · Thermal Science and Engineering Progress · doi:10.1016/j.tsep.2026.104608 · Cited by 1
Structured risk assessment for electrochemical energy storage system: Integrating consistency enhanced-FAHP and complex coupling relationship network
Fu, Y., Wang, Y., Zheng, R., Meng, J., Li, M., & Chen, X. (2026) · Applied Energy · doi:10.1016/j.apenergy.2026.128168 · Cited by 1
A New Index for Reliability Assessment of Power Semiconductor Devices: IGBTs
Babadi, A. N., Bina, M. T., & Amjadifard, R. (2022) · Power Electronics, Drive Systems, and Technologies Conference (PEDSTC) · doi:10.1109/pedstc53976.2022.9767227 · Cited by 1
Comparison of SiC MOSFET Thermal Performance Under Different PWM Strategies
Zou, Y., Damzyn, J., & Kuruppu, S. S. (2023) · Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition · doi:10.1109/apec43580.2023.10131177 · Cited by 1
Lifetime analysis of two commercial PV converters using multi-year degradation modelling
Fogsgaard, M. B., Zhang, Y., Bahman, A. S., Iannuzzo, F., & Blaabjerg, F. (2023) · e-Prime - Advances in Electrical Engineering Electronics and Energy · doi:10.1016/j.prime.2023.100205 · Cited by 1
A Junction Temperature Monitoring Method Based on the Combined TSEPs for Power Devices
Wang, H., Xu, Z., Liang, G., & Ge, X. (2023) · IEEE International Electrical and Energy Conference (CIEEC) · doi:10.1109/cieec58067.2023.10166304 · Cited by 1
Discrete Packaged Power Diode's Electro-Thermal Behaviour Modelling Method In A Standard CAD Environment
Montaner, L., Kaïd, A., Roqueta, F., Hébrard, L., & Kammerer, J.-B. (2023) · International Workshop on Thermal Investigations of ICs and Systems · doi:10.1109/therminic60375.2023.10325886 · Cited by 1
A Multi-Metrics In Situ Aging Detector for SiC Power MOSFET Modules with Full Driver-Integration Capability
Zhao, S., & Khan, F. (2024) · Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition · doi:10.1109/apec48139.2024.10509184 · Cited by 1
Self-citation
An Improved Stress-strain Model Considering the Aging Effect of Solder Layers
Yuan, S., Wang, L., Liu, Y., Chen, Q., Zhao, Z., & Gao, K. (2024) · International Power Electronics and Motion Control Conference (EPE-PEMC) · doi:10.1109/ipemc-ecceasia60879.2024.10567492 · Cited by 1
Beyond-Nominal Operation of GaN-Based Converters for High-Power Density Applications
Hussain, A., Sado, K. A., Perez, D., & Booth, K. (2024) · IEEE Transportation Electrification Conference and Expo · doi:10.1109/itec60657.2024.10598924 · Cited by 1
A Sequential Probability Ratio Based Lifetime Prediction Method for Electronic Systems
Liu, C., Li, H., Li, D., Wang, S., Yu, Y., & Chen, J. (2024) · International Conference on Sensing, Diagnostics, Prognostics, and Control (SDPC) · doi:10.1109/sdpc62810.2024.10707757 · Cited by 1
Self-citation
Reliability Prediction of Power Converters at Accelerated High Temperature Using Weibull Proportional Hazard Model
Chaturvedi, A., Chaturvedi, S. K., & Sarma, M. (2024) · International Conference on Electrical, Computer, Communications and Mechatronics Engineering (ICECCME) · doi:10.1109/iceccme62383.2024.10796258 · Cited by 1
Multi-Converter System Modelling in Cost for Reliability Studies
Sandelić, M., Davoodi, A., Sangwongwanich, A., Peyghami, S., & Blaabjerg, F. (2021) · IEEE ... Workshop on Control and Modeling for Power Electronics · doi:10.1109/compel52922.2021.9645998 · Cited by 1
Circuit Health State Estimation via An Integrated Deep Neural Network
(2020) · International Journal of Circuits Systems and Signal Processing · doi:10.46300/9106.2020.14.85 · Cited by 1
Junction Temperature Extraction of the Power Semiconductor Device
Du, X., Zhang, J., Li, G., Yu, Y., Qian, C., & Du, R. (2022) · CPSS power electronics series · doi:10.1007/978-981-19-3132-1_4 · Cited by 1
Self-citation
Risk Analysis of Power Electronics-based Power Systems Using Physics-of-degradation in Power Electronic Converters
Kjær, M. (2023) · doi:10.54337/aau561804316 · Cited by 1
Methodologies for Structural Integrity Evaluation of Power Semiconductor Modules
MIYAZAKI, N., SHISHIDO, N., & HAYAMA, Y. (2020) · Journal of The Japan Institute of Electronics Packaging · doi:10.5104/jiep.23.173
Mechanistic Power Module Degradation Modelling Concept with Feedback
Fogsgaard, M. B., Reigosa, P. D., Iannuzzo, F., & Hartmann, M. (2020) · European Conference on Power Electronics and Applications · doi:10.23919/epe20ecceeurope43536.2020.9215897
Methodology to Quantify Impact of Package Delamination on Performance of High-Side Smart Power Switch Design
Chu, M., Chen, J., Rahman, A., & Murugan, R. (2020) · IMAPSource Proceedings · doi:10.4071/2380-4505-2020.1.000015
Discussion on the Test Methodologies for Structural Integrity of Power Module
MIYAZAKI, N., KOGANEMARU, M., SHISHIDO, N., Sakaguchi, T., HAYAMA, Y., & Hagihara, S. (2021) · Journal of The Japan Institute of Electronics Packaging · doi:10.5104/jiep.jiep-d-21-00004

Authors: Hanif, A., Yu, Y., DeVoto, D., & Khan, F.
Affiliations: University of Missouri–Kansas City (US)
University of Utah (US)
National Laboratory of the Rockies (US)
ORCID: Hanif, Abu
Yu, Yuechuan
DeVoto, Douglas
Khan, Faisal
Venue: IEEE Transactions on Power Electronics
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Published: 2019-05
Volume: 34
Issue: 5
Pages: 4729-4746
ISSN: 0885-8993 (ISSN-L)
1941-0107
DOI: 10.1109/tpel.2018.2860587
OpenAlex: W2884957744
Cited by: 272
References: 133
Citations by year: 2026: 34 · 2025: 61 · 2024: 40 · 2023: 47 · 2022: 28 · 2021: 30 · 2020: 24 · 2019: 7
FWCI: 5.84
Type: journal article
Language: en
Open access: green
www.osti.gov
Licence: ieeexplore.ieee.org/Xplorehelp/downloads/license-information/IEEE.html (vor)
doi.org/10.15223/policy-029 (stm-asf)
doi.org/10.15223/policy-037 (stm-asf)
Locations: IEEE Transactions on Power Electronics (publishedVersion)
OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) (submittedVersion)
Funders: National Renewable Energy Laboratory
Topics: Physical Sciences › Engineering › Electrical and Electronic Engineering › Silicon Carbide Semiconductor Technologies
Physical Sciences › Engineering › Safety, Risk, Reliability and Quality › Reliability and Maintenance Optimization
Physical Sciences › Engineering › Electrical and Electronic Engineering › Integrated Circuits and Semiconductor Failure Analysis
Keywords: power devices, failure mechanisms, lifetime prediction, accelerated aging, remaining life estimation, junction temperature measurement, condition monitoring

About these checks

Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.

Statistics and arithmetic are recomputed, not judged.

Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.

What counts as a claim ›How we measure confidence ›How we check this ›

Are you an author, or do you see a problem with this page? Request a review

A Comprehensive Review Toward the State-of-the-Art in Failure and Lifetime Predictions of Power Electronic Devices

Abstract

Overview

Integrity signals

Verification

Claims the paper makes

Claims other papers make about this one

Self-check

Citations

Cites

Cited by

Related

Metadata

Record

About these checks