Nanofabrication for all-soft and high-density electronic devices based on liquid metal
Open accessAbstract
Innovations in soft material synthesis and fabrication technologies have led to the development of integrated soft electronic devices. Such soft devices offer opportunities to interact with biological cells, mimicking their soft environment. However, existing fabrication technologies cannot create the submicron-scale, soft transducers needed for healthcare and medical applications involving single cells. This work presents a nanofabrication strategy to create submicron-scale, all-soft electronic devices based on eutectic gallium-indium alloy (EGaIn) using a hybrid method utilizing electron-beam lithography and soft lithography. The hybrid lithography process is applied to a biphasic structure, comprising a metallic adhesion layer coated with EGaIn, to create soft nano/microstructures embedded in elastomeric materials. Submicron-scale EGaIn thin-film patterning with feature sizes as small as 180 nm and 1 μm line spacing was achieved, resulting in the highest resolution EGaIn patterning technique to date. The resulting soft and stretchable EGaIn patterns offer a currently unrivaled combination of resolution, electrical conductivity, and electronic/wiring density.
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Scaling the array with a 100-nm-line width is anticipated to reduce energy consumption to 2.64 nJ, outperforming GPU-based inference by more than four orders of magnitude.
“We anticipate that the energy consumption can reach 2.64 nJ, outperforming GPU-based inference by more than four orders of magnitude”
From Flexible self-rectifying synapse array for energy-efficient edge multiplication in electrocardiogram diagnosis (2025) · cites this paper as [55]
The Results sections describe 100-nm-designed liquid-metal lines and soft sensor arrays, but do not connect either to inference energy consumption. Searches for “2.64 nJ,” GPU-based inference, and energy savings found no passage supporting the projected value or comparison. Page numbers are unavailable in our copy. (LLM, conf=0.78)
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- Authors
- Kim, M.-G., Brown, D. K., & Brand, O.
- Affiliations
- Georgia Institute of Technology (US)
- Corresponding author
- Brand, Oliver
- Venue
- Nature Communications
- Published
- 2020-02-21
- Volume
- 11
- Issue
- 1
- Pages
- 1002-1002
- ISSN
- 2041-1723 (ISSN-L)
- PMC
- PMC7035367
- OpenAlex
- W3008821181
- Cited by
- 186
- References
- 56
- Citations by year
- 2026: 17 · 2025: 33 · 2024: 40 · 2023: 33 · 2022: 33 · 2021: 21 · 2020: 9
- FWCI
- 8.24
- Type
- journal article
- Language
- en
- Open access
- gold
- doi.org
- Locations
- Nature Communications (publishedVersion, cc-by)
- Europe PMC (PubMed Central) (publishedVersion, cc-by)
- PubMed Central (publishedVersion, cc-by)
- PubMed (publishedVersion)
- RePEc: Research Papers in Economics (submittedVersion)
- DOAJ (DOAJ: Directory of Open Access Journals) (submittedVersion, cc-by-sa)
- Funders
- National Science Foundation (1711259, 1542174)
- Georgia Institute of Technology (ECCS-1542174)
- Division of Electrical, Communications and Cyber Systems (1542174, ECCS 1542174, 1711259)
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Nanomaterials and Printing Technologies
- Physical Sciences › Engineering › Biomedical Engineering › Nanofabrication and Lithography Techniques
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Advancements in Photolithography Techniques
- Keywords
- eutectic gallium-indium alloy, liquid metal electronics, soft electronics, nanofabrication, submicron patterning, elastomeric substrates, stretchable electronics, high-density electronics
- MeSH terms
- Alloys, Electric Conductivity, Electronics, Equipment Design, Gallium, Indium, Metals, Printing, Surface Properties, Elastomers, Nanotechnology, Electrical Equipment and Supplies, Manufacturing Industry
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