Self-assembled three dimensional network designs for soft electronics
Open accessAbstract
Low modulus, compliant systems of sensors, circuits and radios designed to intimately interface with the soft tissues of the human body are of growing interest, due to their emerging applications in continuous, clinical-quality health monitors and advanced, bioelectronic therapeutics. Although recent research establishes various materials and mechanics concepts for such technologies, all existing approaches involve simple, two-dimensional (2D) layouts in the constituent micro-components and interconnects. Here we introduce concepts in three-dimensional (3D) architectures that bypass important engineering constraints and performance limitations set by traditional, 2D designs. Specifically, open-mesh, 3D interconnect networks of helical microcoils formed by deterministic compressive buckling establish the basis for systems that can offer exceptional low modulus, elastic mechanics, in compact geometries, with active components and sophisticated levels of functionality. Coupled mechanical and electrical design approaches enable layout optimization, assembly processes and encapsulation schemes to yield 3D configurations that satisfy requirements in demanding, complex systems, such as wireless, skin-compatible electronic sensors.
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Additional advances are needed to meet the challenging requirements of the NICU, where comprehensive, continuous sensing with wireless functionality, clinical-grade measurement fidelity, and mechanical form factors that eliminate risk of harm to exceptionally fragile neonatal skin are essential.
“Although such systems can support various types of biophysical measurements of physiological health (8–13), additional advances are needed to meet the challenging requirements of the NICU, where comprehensive, continuous sensing with wireless functionality, clinical-grade measurement fidelity, and mechanical form factors that eliminate risk of harm to exceptionally fragile neonatal skin are essent”
From Binodal, wireless epidermal electronic systems with in-sensor analytics for neonatal intensive care (2019) · cites this paper as [13]
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- Authors
- Jang, K.-I., Li, K., Chung, H. U., Xu, S., Jung, H. N., Yang, Y., Kwak, J. W., Jung, H. H., Song, J., Yang, C., Wang, A., Liu, Z., Lee, J. Y., Kim, B. H., Kim, J.-H., Lee, J., Yu, Y., Kim, B. J., Jang, H., Yu, K. J., Kim, J., Lee, J. W., Jeong, J.-W., Song, Y. M., Huang, Y., Zhang, Y., & Rogers, J. A.
- Affiliations
- University of Illinois Urbana-Champaign (US)
- Northwestern University (US)
- University of California San Diego (US)
- Daegu Gyeongbuk Institute of Science and Technology (KR)
- Tsinghua University (CN)
- Institute of High Performance Computing (SG)
- Yonsei University (KR)
- University of Colorado Boulder (US)
- Gwangju Institute of Science and Technology (KR)
- Corresponding author
- Huang, Yonggang
- Zhang, Yihui
- Rogers, John A.
- ORCID
- Jang, Kyung-In
- Li, Kan
- Chung, Ha Uk
- Xu, Sheng
- Jung, Han Na
- Yang, Yiyuan
- Kwak, Jean Won
- Jung, Han Hee
- Yang, Ce
- Wang, Ao
- Liu, Zhuangjian
- Lee, Jong Yoon
- Kim, Bong Hoon
- Kim, Jae-Hwan
- Lee, Jungyup
- Yu, Yongjoon
- Kim, Bum Jun
- Jang, Hokyung
- Yu, Ki Jun
- Kim, Jeonghyun
- Lee, Jung Woo
- Jeong, Jae-Woong
- Song, Young Min
- Huang, Yonggang
- Zhang, Yihui
- Rogers, John A.
- Venue
- Nature Communications
- Published
- 2017-06-21
- Volume
- 8
- Issue
- 1
- Pages
- 15894-15894
- ISSN
- 2041-1723 (ISSN-L)
- PMC
- PMC5482057
- OpenAlex
- W2641153533
- Cited by
- 445
- References
- 8
- Citations by year
- 2026: 20 · 2025: 43 · 2024: 52 · 2023: 51 · 2022: 53 · 2021: 54 · 2020: 50 · 2019: 62 · 2018: 53 · 2017: 7
- FWCI
- 21.18
- Type
- journal article
- Language
- en
- Open access
- gold
- doi.org
- Locations
- Nature Communications (publishedVersion, cc-by)
- PubMed Central (publishedVersion, cc-by)
- PubMed (publishedVersion)
- National University of Singapore (submittedVersion, cc-by)
- RePEc: Research Papers in Economics (submittedVersion)
- DOAJ (DOAJ: Directory of Open Access Journals) (submittedVersion, cc-by-sa)
- eScholarship (California Digital Library) (submittedVersion)
- eScholarship (California Digital Library) (submittedVersion, cc-by)
- Cambridge University Engineering Department Publications Database (submittedVersion)
- KAIST Institutional Repository (KAIST) (submittedVersion)
- Apollo (University of Cambridge) (submittedVersion, cc-by)
- Apollo (cc-by)
- Funders
- National Science Foundation (1534120, 1400169, 1300846)
- National Natural Science Foundation of China (11672152)
- Division of Civil, Mechanical and Manufacturing Innovation (CMMI‐1400169, CMMI1534120)
- Topics
- Physical Sciences › Engineering › Biomedical Engineering › Advanced Sensor and Energy Harvesting Materials
- Physical Sciences › Engineering › Biomedical Engineering › Soft Robotics and Applications
- Physical Sciences › Engineering › Mechanical Engineering › Advanced Materials and Mechanics
- Keywords
- self-assembly, soft electronics, compressive buckling, wireless sensors, bioelectronics, health monitoring, encapsulation, layout optimization
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