Limits to Thermal Transport in Nanoscale Metal Bilayers due to Weak Electron-Phonon Coupling in Au and Cu
Abstract
Weak electron-phonon coupling in Au and Cu produces a significant thermal resistance when heat flows from a thin Pt layer into a thin Au or Cu layer on picosecond time scales. Metal bilayers (Pt/Au and Pt/Cu) were prepared by magnetron sputter deposition; thermal transport in the bilayers was studied by time domain thermoreflectance in the temperature range 38<T<300 K. Analysis of heat transfer in the bilayer yields the electron-phonon coupling parameter g(T) of Au and Cu. Our results for g(T) are consistent with the temperature dependence predicted by the two-temperature model of Kaganov et al. [Sov. Phys. JETP 4, 173 (1957)] and help bridge the gap between data obtained using pump-probe spectroscopy at room temperature and electrical measurements at low temperatures.
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In platinum, electrons with mean free paths of about 10 nm are the dominant heat carriers, and strong electron-phonon coupling ensures that they are in thermal equilibrium with the lattice.
“In Pt, electrons with MFPs B10 nm (ref.32) are the dominant heat carriers, and strong electron-phonon coupling ensures that they are in thermal equilibrium with the lattice 33 .”
From Broadband phonon mean free path contributions to thermal conductivity measured using frequency domain thermoreflectance (2013) · cites this paper as [33]
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- Authors
- Wang, W., & Cahill, D. G.
- Affiliations
- University of Illinois Urbana-Champaign (US)
- Venue
- Physical Review Letters
- Publisher
- American Physical Society (APS)
- Published
- 2012-10-26
- Volume
- 109
- Issue
- 17
- Pages
- 175503-175503
- ISSN
- 0031-9007 (ISSN-L)
- 1079-7114
- OpenAlex
- W2329286917
- Cited by
- 90
- References
- 39
- Citations by year
- 2026: 3 · 2025: 4 · 2024: 9 · 2023: 5 · 2022: 9 · 2021: 6 · 2020: 11 · 2019: 6 · 2018: 9 · 2017: 5 · 2016: 6 · 2015: 7 · 2014: 5 · 2013: 5
- FWCI
- 2.50
- Type
- journal article
- Language
- en
- Open access
- closed
- Licence
- Locations
- Physical Review Letters (publishedVersion)
- PubMed (publishedVersion)
- OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) (submittedVersion)
- Funders
- U.S. Department of Energy
- Topics
- Physical Sciences › Materials Science › Materials Chemistry › Thermal properties of materials
- Physical Sciences › Engineering › Mechanics of Materials › Thermoelastic and Magnetoelastic Phenomena
- Physical Sciences › Engineering › Mechanics of Materials › Thermography and Photoacoustic Techniques
- Keywords
- electron-phonon coupling, heat transport, gold, copper, thermal resistance, time-domain thermoreflectance, two-temperature model, nanoscale heat transfer
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