Cited by 90Thermal properties of materialsThermoelastic and Magnetoelastic PhenomenaThermography and Photoacoustic Techniques

Limits to Thermal Transport in Nanoscale Metal Bilayers due to Weak Electron-Phonon Coupling in Au and Cu

Wang, Wei, Cahill, David G.·2012·Physical Review Letters

Abstract

Weak electron-phonon coupling in Au and Cu produces a significant thermal resistance when heat flows from a thin Pt layer into a thin Au or Cu layer on picosecond time scales. Metal bilayers (Pt/Au and Pt/Cu) were prepared by magnetron sputter deposition; thermal transport in the bilayers was studied by time domain thermoreflectance in the temperature range 38<T<300 K. Analysis of heat transfer in the bilayer yields the electron-phonon coupling parameter g(T) of Au and Cu. Our results for g(T) are consistent with the temperature dependence predicted by the two-temperature model of Kaganov et al. [Sov. Phys. JETP 4, 173 (1957)] and help bridge the gap between data obtained using pump-probe spectroscopy at room temperature and electrical measurements at low temperatures.

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Crossref · 10.1103/physrevlett.109.175503

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Authors
Wang, W., & Cahill, D. G.
Affiliations
University of Illinois Urbana-Champaign (US)
Venue
Physical Review Letters
Published
2012-10-26
Volume
109
Issue
17
Pages
175503-175503
ISSN
  • 0031-9007 (ISSN-L)
  • 1079-7114
OpenAlex
W2329286917
Cited by
90
References
39
Citations by year
2026: 3 · 2025: 4 · 2024: 9 · 2023: 5 · 2022: 9 · 2021: 6 · 2020: 11 · 2019: 6 · 2018: 9 · 2017: 5 · 2016: 6 · 2015: 7 · 2014: 5 · 2013: 5
FWCI
2.50
Type
journal article
Language
en
Open access
closed
Locations
  • Physical Review Letters (publishedVersion)
  • PubMed (publishedVersion)
  • OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) (submittedVersion)
Funders
U.S. Department of Energy
Topics
  • Physical Sciences › Materials Science › Materials Chemistry › Thermal properties of materials
  • Physical Sciences › Engineering › Mechanics of Materials › Thermoelastic and Magnetoelastic Phenomena
  • Physical Sciences › Engineering › Mechanics of Materials › Thermography and Photoacoustic Techniques
Keywords
electron-phonon coupling, heat transport, gold, copper, thermal resistance, time-domain thermoreflectance, two-temperature model, nanoscale heat transfer

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