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16.3 A 28nm 384kb 6T-SRAM Computation-in-Memory Macro with 8b Precision for AI Edge Chips
Abstract
Recent SRAM-based computation-in-memory (CIM) macros enable mid-to-high precision multiply-and-accumulate (MAC) operations with improved energy efficiency using ultra-small/small capacity (0.4-8KB) memory devices. However, advanced CIM-based edge-AI chips favor multiple mid/large capacity SRAM-CIM macros: with high input (IN) and weight (W) precision to reduce the frequency of data reloads from external DRAM, and to avoid the need for additional SRAM buffers or ultra-large on-chip weight buffers. However, enlarging memory capacity and throughput increases the delay parasitics on WLs and BLs, and the number of parallel computing elements; resulting in longer compute latency (tAC), lower energy-efficiency (EF), degraded signal margin, and larger fluctuations in power consumption across data-patterns (see Fig. 16.3.1). Recent SRAM-CIM macros tend to not use in-lab SRAM cells, with a logic-based layout, in favor of foundry provided compact-layout 8T [2], 3, [5] or 6T cells with local-computing cells (LCCs) [4], [6] to reduce the cell-array area and facilitate manufacturing. This paper presents a SRAM-CIM structure using (1) a segmented-BL charge-sharing (SBCS) scheme for MAC operations, with low energy consumption and a consistently high signal margin across MAC values (MACV); (2) An new LCC cell, called a source-injection local-multiplication cell (SILMC), to support the SBCS scheme with a consistent signal margin against transistor process variation; and (3) A prioritized-hybrid-ADC (Ph-ADC) to achieve a small area and power overhead for analog readout. A 28nm 384kb SRAM-CIM macro was fabricated using a foundry compact-6T cell with support for MAC operations with 16 accumulations of 8b-inputs and 8b-weights with near-full precision output (20b). This macro achieves a 7.2ns tACand a 22.75TOPS/W EF for 8b-MAC operations with an FoM (IN-precision × W-precision × output-ratio × output-channel × EF/tAC) 6× higher than prior work.
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“Although several compute-in-memory or near-memory approaches based on SRAMs and digital compute35–38 have been presented in the literature, most of these do not address the energy and time costs of reloading weights, thus making direct side-by-side comparisons against NVM-based weight-stationary approaches difficult.”
From An analog-AI chip for energy-efficient speech recognition and transcription (2023) · cites this paper as [38]
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- 10.1109/ISSCC19947.2020.9062995 · DOI
- 10.1109/ISSCC.2019.8662392 · DOI
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An analog-AI chip for energy-efficient speech recognition and transcription
Ambrogio, S., Narayanan, P., Okazaki, A., Fasoli, A., Mackin, C., Hosokawa, K., Nomura, A., Yasuda, T., Chen, A., Friz, A., et al. (2023) · Nature · doi:10.1038/s41586-023-06337-5 · Cited by 269
“Although several compute-in-memory or near-memory approaches based on SRAMs and digital compute 35–38 have been presented in the literature, most of these do not address the energy and time costs of reloading weights, thus making direct side-by-side comparisons against NVM-based weight-stationary…”
BackgroundMori, H., Zhao, W.-C., Lee, C.-E., Lee, C.-F., Hsu, Y.-H., Chuang, C., Hashizume, T., Tung, H.-C., Liu, Y.-Y., Wu, S.-R., et al. (2023) · IEEE International Solid-State Circuits Conference · doi:10.1109/isscc42615.2023.10067555 · Cited by 130
“Recent work examined tradeoffs between MAC throughput, energy efficiency and accuracy for analog based CIM [1-3].”
BackgroundWu, P., Su, J.-W., Hong, L., Ren, J.-S., Chien, C.-H., Chen, H.-Y., Ke, C.-E., Hsiao, H.-M., Li, S.-H., Sheu, S.-S., et al. (2023) · IEEE International Solid-State Circuits Conference · doi:10.1109/isscc42615.2023.10067527 · Cited by 117
“This paper presents a true FP-IMC macro featuring (1) a hybrid-domain macro structure that enables computation of both the exponent and mantissa in an FP-MAC within the same IMC macro.”
BackgroundMethodInfluentialSelf-citationA 65-nm 8T SRAM Compute-in-Memory Macro With Column ADCs for Processing Neural Networks
Yu, C., Yoo, T., Chai, K. T. C., Kim, T. T.-H., & Kim, B. (2022) · IEEE Journal of Solid-State Circuits · doi:10.1109/jssc.2022.3162602 · Cited by 118
Tu, F., Wu, Z., Wang, Y., Liang, L., Liu, L., Ding, Y., Liu, L., Wei, S., Xie, Y., & Yin, S. (2022) · IEEE Journal of Solid-State Circuits · doi:10.1109/jssc.2022.3213542 · Cited by 102
“2) For Challenge1b , we design the CIM macro with a bitline-transpose structure to align the directions of input feeding and weight writing, instead of the previous wordline-feeding solutions [6], [15], [23].”
BackgroundMethodResultInfluentialGuo, A., Si, X., Chen, X., Dong, F., Pu, X.-Y., Li, D., Zhou, Y., Ren, L., Xue, Y., Dong, X., et al. (2023) · IEEE International Solid-State Circuits Conference · doi:10.1109/isscc42615.2023.10067260 · Cited by 94
“Unlike previous SRAMCIMs [1-6] that only support INT-MAC operations, this work supports both FP-MAC and INT-MAC operations and achieve >1.”
MethodInfluentialSelf-citationTu, F., Wang, Y., Wu, Z., Liang, L., Ding, Y., Kim, B., Liu, L., Wei, S., Xie, Y., & Yin, S. (2022) · IEEE Journal of Solid-State Circuits · doi:10.1109/jssc.2022.3222059 · Cited by 97
“…(CIM) eliminates the bottleneck by integrating multiply–accumulation (MAC) into memory, such as static random access memory (SRAM) [13], [14], [15], [24], [25] and resistive RAM (ReRAM) [6], [21], [22], which has proved to be a promising architecture for energy-efficient NN acceleration.”
BackgroundYue, J., He, C., Wang, Z., Cong, Z., He, Y., Zhou, M., Sun, W., Li, X.-Q., Dou, C., Zhang, F., et al. (2023) · IEEE International Solid-State Circuits Conference · doi:10.1109/isscc42615.2023.10067779 · Cited by 86
“precharge/discharge similar to [6], or 2× transistor-count reduction at the same power”
BackgroundHung, J.-M., Wen, T.-H., Huang, Y.-H., Huang, S.-P., Chang, F.-C., Su, C.-I., Khwa, W.-S., Lo, C., Liu, R.-S., Hsieh, C.-C., et al. (2022) · IEEE Journal of Solid-State Circuits · doi:10.1109/jssc.2022.3200515 · Cited by 75
Self-citationSu, J.-W., Chou, Y.-C., Liu, R., Liu, T.-W., Lu, P.-J., Wu, P.-C., Chung, Y.-L., Hong, L.-Y., Ren, J.-S., Pan, T., et al. (2022) · IEEE Journal of Solid-State Circuits · doi:10.1109/jssc.2022.3199077 · Cited by 68
“Other works using a voltage divider to generate the analog signal for MAC operations [24], [26], [28], [29], [32], [34], [36], [37], [38], [39], [40] are prone to considerable dc current consumption on the bitline (BL).”
BackgroundInfluentialSelf-citationA review on SRAM-based computing in-memory: Circuits, functions, and applications
Lin, Z., Tong, Z., Zhang, J., Wang, F., Tian, X., Zhao, Y., Wu, X., Peng, C., Lu, W., Zhao, Q., et al. (2022) · Journal of Semiconductors · doi:10.1088/1674-4926/43/3/031401 · Cited by 61
Kim, H., Mu, J., Yu, C., Kim, T. T.-H., & Kim, B. (2023) · IEEE Transactions on Circuits and Systems I Regular Papers · doi:10.1109/tcsi.2022.3232648 · Cited by 47
“Existing SRAM-based CIM macros implemented arithmetic operations using different analog circuit operations, such as the bitline discharging operations [2], [7], [8], [10], [11], [14], [17] and charge-domain operations using capacitors [3], [4], [12], [13], [15].”
MethodKim, S., Kim, S., Um, S., Kim, S., Kim, K., & Yoo, H. (2023) · IEEE Journal of Solid-State Circuits · doi:10.1109/jssc.2023.3273238 · Cited by 51
“The previous works [1], [2], [3], [4], [5], [6] use an ADC with 4–5-bit precision, and [2] uses an ADC with adjustable precision, whereas the proposed processor can operate without high-cost ADC.”
InfluentialBenchmarking In-Memory Computing Architectures
Shanbhag, N. R., & Roy, S. K. (2022) · IEEE Open Journal of the Solid-State Circuits Society · doi:10.1109/ojsscs.2022.3210152 · Cited by 57
“Next, we apply the data analysis strategy to SRAM-based IMCs first and then compare SRAM-, eNVM-, eDRAM-based IMCs, and digital accelerators.”
InfluentialZhang, B., Saikia, J., Meng, J., Wang, D., Kwon, S., Myung, S., Kim, H., Kim, S. J., Seo, J.-S., & Seok, M. (2023) · IEEE Journal of Solid-State Circuits · doi:10.1109/jssc.2023.3332017 · Cited by 46
“As compared to the conventional ADC-first approach [26], [31], [35], our scheme brings a 60.7% reduction in the A/D conversion area as well as a 66.7% reduction in the A/D conversion energy.”
ResultInfluentialChen, Z., Wen, Z., Wan, W., Pakala, A., Zou, Y., Wei, W.-C., Li, Z., Chen, Y., & Yang, K. (2024) · IEEE Journal of Solid-State Circuits · doi:10.1109/jssc.2024.3422826 · Cited by 41
In-Memory Computing for Machine Learning and Deep Learning
Lepri, N., Glukhov, A., Cattaneo, L., Farronato, M., Mannocci, P., & Ielmini, D. (2023) · IEEE Journal of the Electron Devices Society · doi:10.1109/jeds.2023.3265875 · Cited by 52
“The mixed approach has been demonstrated either with emerging NVM, such as RRAM [137], [138], [139], [140], [141] or FeFET [142], [143], or with various SRAM cells, generally from 6T to 12T [23], [144], [145], [146], [147].”
MethodWu, P.-C., Su, J.-W., Chung, Y.-L., Hong, L.-Y., Ren, J.-S., Chang, F.-C., Wu, Y., Chen, H.-Y., Lin, C.-H., Hsiao, H.-M., et al. (2023) · IEEE Journal of Solid-State Circuits · doi:10.1109/jssc.2023.3343669 · Cited by 38
“As with previous in-array local-computing-cell structures [29], [31], [32], [33], [34], [35], [37], [41], the two transmission gates (T1 and T2) in the EDC-MUX connect global BL (GBL-GBLB) to local BL (LBL-LBLB) for read and write operations in memory mode.”
BackgroundMethodResultInfluentialSelf-citationAn Overview of Computing-in-Memory Circuits With DRAM and NVM
Kim, S., & Yoo, H. (2023) · IEEE Transactions on Circuits & Systems II Express Briefs · doi:10.1109/tcsii.2023.3333851 · Cited by 38
“However, in recent years, attention to static random access memory (SRAM)-based implementation has increased rapidly [5], [6], [7], [8], [9], [10], [11], [12], [13], [14].”
BackgroundInfluentialKneip, A., Lefebvre, M., Verecken, J., & Bol, D. (2023) · IEEE Journal of Solid-State Circuits · doi:10.1109/jssc.2023.3269098 · Cited by 39
“…compared to charge-domain operations [12], [35], while avoiding multiple sequential BL(B) switching as in high-precision current-domain designs [36]; 2) relaxed ADC precision because of the multi-bit ABN implementation, yielding to a better amor-tization of the ADC conversion energy; and 3) an…”
Background10T SRAM Computing-in-Memory Macros for Binary and Multibit MAC Operation of DNN Edge Processors
Nguyen, V. T., Kim, J.-S., & Lee, J. (2021) · IEEE Access · doi:10.1109/access.2021.3079425 · Cited by 43
“Recent works show large capacity SRAM-CIM macros, for example, 64 Kb [28], 384 Kb [29], and 4.5 Mb [33], which allows the application to speech recognition and image classification.”
BackgroundInfluentialWu, P.-C., Su, J.-W., Hong, L.-Y., Ren, J.-S., Chien, C.-H., Chen, H.-Y., Ke, C.-E., Hsiao, H.-M., Li, S.-H., Sheu, S.-S., et al. (2023) · IEEE Journal of Solid-State Circuits · doi:10.1109/jssc.2023.3309966 · Cited by 41
“Advanced artificial intelligence (AI) chips [26], [27], [28], [29], [30], [31], [32], [33], [34], [35], [36], [37], [38], [39], [40], [41], [42], [43] require high-precision inputs (IN), weights ( W ) , and outputs (OUT) for high inference accuracy as well as high energy efficiency and rapid…”
BackgroundInfluentialSelf-citationA 28 nm 16 Kb Bit-Scalable Charge-Domain Transpose 6T SRAM In-Memory Computing Macro
Song, J., Tang, X., Qiao, X., Wang, Y., Wang, R., & Huang, R. (2023) · IEEE Transactions on Circuits and Systems I Regular Papers · doi:10.1109/tcsi.2023.3244338 · Cited by 35
“…including SRAM-based [15], [16], [17], [18], [19], [20], [21], [22], [23], [24], [25], [26], [27], [28], [29], [30], [31], [32], [33], [34], [35], [36], [37], [38], [39], [40], [41], [42], eDRAM-based [43], [44], [45], and emerging memory-based ones [46], [47], [48], [49], [50], [51], [52].”
BackgroundMethodInfluentialKim, S., Um, S., Jo, W., Lee, J., Ha, S., Li, Z., & Yoo, H. (2024) · IEEE Journal of Solid-State Circuits · doi:10.1109/jssc.2024.3362699 · Cited by 35
“Therefore, most previous designs [15], [16], [17], [21], [22], [23], [25], [27], [29], [30] adopt the combination with programmable digital logic for multibit and fan-in extension, as shown in Fig.”
BackgroundMethodInfluentialYao, C.-Y., Wu, T., Liang, H.-C., Chen, Y., & Liu, T.-T. (2023) · IEEE Journal of Solid-State Circuits · doi:10.1109/jssc.2022.3224363 · Cited by 41
“These partial MAC results are then processed by MAC aggregation or near-memory computing (NMC) circuitry to complete full-precision MACs [13], [14], [15], [16], [17], [18], [19], [20], [21], [22], [23], [24], [25].”
MethodSelf-citationIn Situ Storing 8T SRAM-CIM Macro for Full-Array Boolean Logic and Copy Operations
Lin, Z.-T., Tong, Z.-Z., Wang, F.-M., Zhang, J., Zhao, Y., Sun, P.-F., Xu, T., Zhang, C., Li, X., Wu, X.-L., et al. (2023) · IEEE Journal of Solid-State Circuits · doi:10.1109/jssc.2022.3206318 · Cited by 37
“The mixed-signal CIM accelerates CNN algorithms [7], [17], [18], whereas digital-domain CIM accelerates AES algorithms [3], [19].”
MethodA Survey of Computing-in-Memory Processor: From Circuit to Application
Sun, W., Yue, J., He, Y., Huang, Z., Wang, J., Jia, W., Li, Y., Lei, L., Jia, H., & Liu, Y. (2023) · IEEE Open Journal of the Solid-State Circuits Society · doi:10.1109/ojsscs.2023.3328290 · Cited by 32
“The E local term corresponds to the local read energy in near memory computing [49] or CIM architecture with shared computing circuits [41], [50] Apart from the energy overhead, the latency of weight reloading L reload can be reduced and even hidden by ping-pong storage at the penalty of doubled…”
BackgroundRoadmap on low-power electronics
Ramesh, R., Salahuddin, S., Datta, S., Diaz, C. H., Nikonov, D. E., Young, I. A., Ham, D., Chang, M., Khwa, W.-S., Lele, A. S., et al. (2024) · APL Materials · doi:10.1063/5.0184774 · Cited by 43
Self-citationChen, Y., Yin, G., Zhou, M., Tang, W., Yang, Z., Lee, M., Du, X., Yue, J., Liu, J., Yang, H., et al. (2023) · IEEE Transactions on Circuits and Systems I Regular Papers · doi:10.1109/tcsi.2023.3266269 · Cited by 35
“Fabricated results in [11], [29], and [30] have demonstrated the high energy efficiency of current-domain SRAM-CiM.”
Khwa, W., Wu, P., Su, J.-W., Cheng, C.-Y., Hsu, J.-M., Chen, Y.-C., Hsieh, L.-J., Bai, J.-C., Kao, Y.-S., Lou, T.-H., et al. (2025) · IEEE International Solid-State Circuits Conference · doi:10.1109/isscc49661.2025.10904606 · Cited by 33
Self-citationTrending IC design directions in 2022
Chan, C., Cheng, L., Deng, W., Feng, P., Li, G., Huang, M., Jia, H., Jie, L., Lei, K., Liu, X., et al. (2022) · Journal of Semiconductors · doi:10.1088/1674-4926/43/7/071401 · Cited by 38
“4% transistor reduction with 2569 F2/b area efficiency[21].”
BackgroundSharma, V., Zhang, X., Dhakad, N. S., & Kim, T. T.-H. (2025) · IEEE Transactions on Circuits and Systems I Regular Papers · doi:10.1109/tcsi.2025.3547853 · Cited by 25
“Since a smaller memory can not store and process the huge data at the same time, and hence requires frequent energy-consuming weight reloading for computation [17], as shown in Fig.”
InfluentialXiao, K., Cui, X., Qiao, X., Song, J., Luo, H., Wang, X., & Wang, Y. (2023) · IEEE Transactions on Circuits & Systems II Express Briefs · doi:10.1109/tcsii.2023.3234620 · Cited by 33
“Capacitor-based CIM SRAM [8], [9], [10], [11], [12], [13], [14], [15] has recently become popular because of its high energy efficiency for DCNNs and robustness against PVT variations.”
BackgroundSDP: Co-Designing Algorithm, Dataflow, and Architecture for In-SRAM Sparse NN Acceleration
Tu, F., Wang, Y., Liang, L., Ding, Y., Liu, L., Wei, S., Yin, S., & Xie, Y. (2022) · IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems · doi:10.1109/tcad.2022.3172600 · Cited by 28
“grating multiply accumulation (MAC) into memory, such as resistive RAM (ReRAM) [2], [20], [24], [30] and SRAM [22], [25], [26], [32].”
BackgroundChen, Y., Yin, G., Tan, Z., Lee, M., Yang, Z., Liu, Y., Yang, H., Ma, K., & Li, X. (2022) · ACM/IEEE Design Automation Conference (DAC) · doi:10.1145/3489517.3530576 · Cited by 21
“In a custom accelerator chip design, to reduce the memory-wall overheads of energy and latency in frequent DRAM data accesses [1][2], computing-in-memory (CiM) techniques have been proposed based on CMOS SRAM/eDRAM[3][4][5] and other beyond-CMOS technologies [6][7].”
BackgroundMethodResultInfluentialYue, J., Liu, Y., Feng, X., He, Y., Wang, J., Yuan, Z., Zhan, M., Liu, J., Su, J.-W., Chung, Y.-L., et al. (2023) · IEEE Journal of Solid-State Circuits · doi:10.1109/jssc.2023.3324954 · Cited by 28
“Unfortunately, the existing on-chip CIM storage (16 kb–4.5 Mb) [7], [8], [24], [25], [26], [27], [28], [29] cannot hold all weight data for a large NN model of complex datasets.”
BackgroundInfluentialSelf-citationA Practical Design-Space Analysis of Compute-in-Memory With SRAM
Spetalnick, S. D., & Raychowdhury, A. (2022) · IEEE Transactions on Circuits and Systems I Regular Papers · doi:10.1109/tcsi.2021.3138057 · Cited by 23
“Moving forward, we expect designers to continue to focus on CIM systems with ADC designs that are energy efficient across a lower precision range ( e.g. 2-7 bits), like the medium-precision successive-approximation register (SAR) designs recently shown in some CIM SRAM works [17]–[19], [21].”
BackgroundYin, G., Chen, Y., Zhou, M., Tang, W., Lee, M., Yang, Z., Liao, T., Du, X., Narayanan, V., Yang, H., et al. (2023) · IEEE Journal of Solid-State Circuits · doi:10.1109/jssc.2023.3326955 · Cited by 23
“Notably, these initiatives aimed at enlarging the CiM capacity, as presented by the capacity (384 kb in [10] and 1 Mb in [11]) or the CiM macro density (1.041 Mb/mm 2 in 28-nm CMOS in [12]).”
BackgroundInfluentialSRAM-Based Computing-in-Memory Macro With Fully Parallel One-Step Multibit Computation
Choi, E. J., Choi, I., Jeon, C., Yun, G., Yi, D., Ha, S., Chang, I., & Je, M. (2022) · IEEE Solid-State Circuits Letters · doi:10.1109/lssc.2022.3206416 · Cited by 29
“Most of all, static random-access memory (SRAM)-based CIM techniques [3], [4], [5], [6], [7], [8], [9] have attracted interest due to their fast write speed, low write energy, and good compatibility with the latest CMOS technology [2].”
BackgroundAn 11T SRAM Cell for the Dual-Direction In-Array Logic/CAM Operations
Wei, F., Cui, X., Zhang, S., & Zhang, X. (2023) · IEEE Transactions on Circuits & Systems II Express Briefs · doi:10.1109/tcsii.2023.3337119 · Cited by 20
“The in-memory multiply accumulation (MAC) computations are discussion in [1], [2], [3], [4], [5], [6], [7], [8], [9], [10].”
Low-Power and Scalable BEOL-Compatible IGZO TFT eDRAM-Based Charge-Domain Computing
Tang, W., Liu, J., Sun, C., Zheng, Z., Liu, Y., Yang, H., Jiang, C. H., Ni, K., Gong, X., & Li, X. (2023) · IEEE Transactions on Circuits and Systems I Regular Papers · doi:10.1109/tcsi.2023.3317170 · Cited by 28
“…buffers or external DRAM, thereby decreasing the footprint, and reducing high-cost weight reloads from external memories in terms of dataflow [8]. eDRAM has a higher density than SRAM and more mature fabrication than emerging NVMs, making it a promising solution for CiM with high memory…”
BackgroundBenchmarking and modeling of analog and digital SRAM in-memory computing architectures
Houshmand, P., Sun, J., & Verhelst, M. (2023) · arXiv.org · doi:10.48550/arxiv.2305.18335 · Cited by 22
“[27], 28, 2b/4b [24], 16, 4b/4b [28], 28, 5b/1b”
A 22 nm Floating-Point ReRAM Compute-in-Memory Macro Using Residue-Shared ADC for AI Edge Device
Hsu, H.-H., Wen, T.-H., Khwa, W.-S., Huang, W.-H., Ke, Z.-E., Chin, Y.-H., Wen, H.-J., Chang, Y., Hsu, W., Lele, A. S., et al. (2024) · IEEE Journal of Solid-State Circuits · doi:10.1109/jssc.2024.3470211 · Cited by 22
“…this so-called memory wall issue, including compute-in-memory (CIM) devices based on SRAM (SRAM-CIM) [1], [2], [3], [4], [5], [6], [7], [8], [9], [10] or nonvolatile CIM (nvCIM) [11], [12], [13], [14], [15], [16], [17], [18], [19], [20], [21], [22], [23], [24], [25], [27], [28], [29], [30],…”
Self-citationMulti-Bit Compute-In Memory Architecture Using a C-2C Ladder Network
Kushwaha, D., Abotula, J. K., Kohli, R., Mishra, J., Dasgupta, S., & Bulusu, A. (2023) · IEEE Transactions on Circuits & Systems II Express Briefs · doi:10.1109/tcsii.2023.3329261 · Cited by 20
“Thus, many recent works [4], [5], [6], [7], [8], [9], [10], [11], [12] approached compute in memory (CIM) to alleviate the Von Neumann bottleneck and perform the fundamental operation of CNN: MAC (multiply and accumulate) in the memory itself, which eliminates the huge power consumption for data…”
BackgroundQiao, X., Guo, Q., Tang, X., Song, J., Wei, R., Li, M., Wang, R., & Wang, Y. (2024) · IEEE Transactions on Circuits and Systems I Regular Papers · doi:10.1109/tcsi.2024.3353464 · Cited by 19
“The SRAM-based CIM design [1], [2], [3], [4], [5], [6], [7], [8], [9], [10], [11], [12], [13], [14], [15], [16], [17], [18], [19], [20], [21], [22], [23], [24] has surpassed the thousands of TOPS/W computation energy efficiency.”
BackgroundAn Eight-Core RISC-V Processor With Compute Near Last Level Cache in Intel 4 CMOS
Chen, G. K., Knag, P. C., Tokunaga, C., & Krishnamurthy, R. K. (2022) · IEEE Journal of Solid-State Circuits · doi:10.1109/jssc.2022.3228765 · Cited by 27
“It performs computation with current summing [9], charge sharing [10], [11], or a combination of analog and digital circuits [12], [13].”
BackgroundMemristive dynamics enabled neuromorphic computing systems
Yan, B., Yang, Y., & Huang, R. (2023) · Science China Information Sciences · doi:10.1007/s11432-023-3739-0 · Cited by 20
“Then low-power 1HT1R-based CIM component conducts cognitive processing with CNN for the image segmentation [105,106].”
MethodAnanthanarayanan, S., Reniwal, B. S., & Upadhyay, A. K. (2023) · International Conference on VLSI Design · doi:10.1109/vlsid57277.2023.00035 · Cited by 18
“MAC operations incorporating a source-injection local multiplication cell and segmented bit-line sharing is discussed in [6].”
BackgroundAn In-Memory Computing SRAM Macro for Memory-Augmented Neural Network
Kim, S., Lee, W., Kim, S., Park, S., & Jeon, D. (2021) · IEEE Transactions on Circuits & Systems II Express Briefs · doi:10.1109/tcsii.2021.3132063 · Cited by 18
A Multiply-Less Approximate SRAM Compute-In-Memory Macro for Neural-Network Inference
Diao, H., He, Y., Li, X., Tang, C., Jia, W., Yue, J., Luo, H., Song, J., Li, X., Yang, H., et al. (2024) · IEEE Journal of Solid-State Circuits · doi:10.1109/jssc.2024.3433417 · Cited by 20
“1, computing-in-memory addresses this limitation by incorporating the processing unit into memory cells to perform basic operations (OPs) locally [6], [7], [8], [9], [10], [11], [12], [13], [14], [15], [16], [17], [18], [19], [20], [21], [22], [23], [24], [25], [26].”
From macro to microarchitecture: reviews and trends of SRAM-based compute-in-memory circuits
Zhang, Z., Chen, J., Chen, X., Guo, A., Wang, B., Xiong, T., Kong, Y., Pu, X., He, S., Si, X., et al. (2023) · Science China Information Sciences · doi:10.1007/s11432-023-3800-9 · Cited by 20
“This subsection outlines some of the silicon-verified SRAM-CIM studies that adopt charge domain computing paradigm (see Table 3) [69,75,76].”
InfluentialSelf-citationFLEX-CIM: A Flexible Kernel Size 1-GHz 181.6-TOPS/W 25.63-TOPS/mm 2 Analog Compute-in-Memory Macro
Fu, Y., Yu, W.-H., Un, K.-F., Chan, C., Zhu, Y., Zhang, M., Martins, R. P., & Mak, P. (2024) · IEEE Journal of Solid-State Circuits · doi:10.1109/jssc.2024.3386192 · Cited by 21
“In [17] and [18], the ADC features dynamic resolution by detecting the partial sum voltage but requires an additional circuit and detection phase, lowering the throughput of the CIM.”
BackgroundMethodInfluentialZhao, C., Fang, J., Jiang, J., Xue, X., & Zeng, X. (2022) · IEEE Transactions on Circuits and Systems I Regular Papers · doi:10.1109/tcsi.2022.3215535 · Cited by 19
“Given that SRAM features full maturity and compatibility in advanced technologies compared with the emerging memory devices like RRAM, MRAM and PCM, etc., the SRAM-based CIMs have been under intensive study for CNN acceleration in energy-efficient edge applications [2], [3], [4], [5].”
BackgroundMethodEfficient Processing of MLPerf Mobile Workloads Using Digital Compute-In-Memory Macros
Sun, X., Cao, W., Crafton, B., Akarvardar, K., Mori, H., Fujiwara, H., Noguchi, H., Chih, Y.-D., Chang, M., Wang, Y., et al. (2023) · IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems · doi:10.1109/tcad.2023.3333290 · Cited by 18
“MAC operations are implemented across each column, typically by current or charge summation along the bitline (BL) in analog CIM (ACIM) [23], through an adder tree in DCIM [8], or through a combined analog–digital–hybrid scheme [24].”
MethodSelf-citationDesign of Multimode In-Memory Computing Architecture Based on SRAM
Liu, Y.-Y., Wang, H., Gai, S.-H., & Shi, Q. (2023) · International Conference on Natural Computation, Fuzzy Systems and Knowledge Discovery · doi:10.1109/icnc-fskd59587.2023.10281154 · Cited by 14
“Charged mode IMC [6] represents the multiplication result as capacitive charge in the memory unit, realizes the summation of multiple capacitive charges in the same column through the charge redistribution of the bit line, and transmits the result to the ADC output multiplication and accumulation.”
BackgroundWang, Y., Tu, F., Liu, L., Wei, S., Xie, Y., & Yin, S. (2022) · IEEE Transactions on Circuits and Systems I Regular Papers · doi:10.1109/tcsi.2022.3216735 · Cited by 17
“Many CIM accelerators [16], [17], [19], [23], [24] have been designed in the past few years, proving CIM is a promising technique for efficient NN acceleration.”
BackgroundMethodYu, C., Jiang, H., Mu, J., Chai, K. T. C., Kim, T. T.-H., & Kim, B. (2024) · IEEE Transactions on Circuits and Systems I Regular Papers · doi:10.1109/tcsi.2024.3411608 · Cited by 15
“Many DNN accelerators based on SRAM-based CIM macros [14], [15], [16], [17], [18], [19], [20], [21], [22], [23], [24], [25], [26], [27], [28], [29], [30], [31], [32], [33], [34], [35], [36], [37], [38], [39], [40], [41], [42], [43], [44], [45], [46] have recently been proposed to demonstrate…”
Sehgal, R., Mehra, R., Ni, C., & Kulkarni, J. P. (2023) · European Solid-State Circuits Conference (ESSCIRC) · doi:10.1109/esscirc59616.2023.10268726 · Cited by 13
“weight storage density due to larger bitcells, while eDRAM is too leaky, requiring frequent refresh; 2) MRAM, RRAM, and eFLASH require additional process steps increasing the integration cost; 3) Power-hungry DACs for providing Inputs (IN); 4) Accurate reference voltage (VREF) generation circuits for ADCs; 5) Limited…”
BackgroundEidetic: An In-Memory Matrix Multiplication Accelerator for Neural Networks
Eckert, C. A., Subramaniyan, A. K., Wang, X., Augustine, C., Iyer, R., & Das, R. (2022) · IEEE Transactions on Computers · doi:10.1109/tc.2022.3214151 · Cited by 9
“In-SRAM computing is an attractive solution for thememorywall problem experienced by neural networks [2], [3], [4], [5], [6], [7], [8], [9], [10], [11], [12], [13], [14], [15], [16], [17], [18].”
BackgroundMohith, V., & Sakthivel, R. (2025) · Results in Engineering · doi:10.1016/j.rineng.2025.108460 · Cited by 7
An Integer-Floating-Point Dual-Mode Gain-Cell Computing-in-Memory Macro for Advanced AI Edge Chips
Wu, P.-C., Khwa, W.-S., Wu, J.-J., Su, J.-W., Jhang, C.-J., Chen, H.-Y., Ke, Z.-E., Chiu, T.-C., Hsu, J.-M., Cheng, C.-Y., et al. (2024) · IEEE Journal of Solid-State Circuits · doi:10.1109/jssc.2024.3470215 · Cited by 14
“…CIM (SRAM-CIM) enables multiply-and-accumulate (MAC) operations [20], [21], [22], [23], [24], [25], [26], [27], [28], [29], [30], [31], [32], [33], [34], [35], [36], [37], [38], [39], [40] with short compute latency, high energy efficiency, and fast system-level response times in the…”
InfluentialSelf-citationXue, C., Qiao, X., Ren, X., Du, G., Wang, Y., & He, Y.-D. (2024) · IEEE Transactions on Circuits and Systems - II - Express Briefs · doi:10.1109/tcsii.2023.3345878 · Cited by 12
“[8], [9], [10], [11], [12], [13], [14].”
Lee, M., Tang, W., Chen, Y., Wu, J., Zhong, H., Xu, Y., Liu, Y., Yang, H., Narayanan, V., & Li, X. (2023) · ACM/IEEE Design Automation Conference (DAC) · doi:10.1109/dac56929.2023.10247934 · Cited by 12
“However, the limited on-chip capacity of SRAM and even eDRAM results in inevitable on-off-chip data movement when a large network is deployed [11].”
BackgroundMorphable CIM: Improving Operation Intensity and Depthwise Capability for SRAM-CIM Architecture
Lo, Y.-C., & Liu, R.-S. (2023) · Design Automation Conference · doi:10.1109/dac56929.2023.10247750 · Cited by 12
“Figure 1 (b) shows the utilization for processing the first 18 layers of MobileNet-v2 with state-of-the-art CIM [7], where all of the depth-wise layers achieve near-zero utilization.”
MethodSelf-citationAlgorithm Hardware Co-Design for ADC-Less Compute In-Memory Accelerator
Negi, S., Saxena, U., Sharma, D., Victor, J., Ahmed, I., Gupta, S. K., & Roy, K. (2024) · IEEE transactions on circuits and systems for artificial intelligence. · doi:10.1109/tcasai.2024.3495587 · Cited by 9
“Prior efforts to reduce ADC precision in CiM hardware have explored techniques such as exploiting input sparsity [9], [12] and quantizing partial sums using non-linear quantization [13], [14] or linear quantization with a smaller dynamic range [15].”
Lu, L., Mani, A., & Do, A. (2023) · International Symposium on Circuits and Systems · doi:10.1109/iscas46773.2023.10181328 · Cited by 11
“1) [2].”
Xiao, K., Qiao, X., Cui, X., Song, J., Luo, H., Wang, X., & Wang, Y. (2024) · IEEE Transactions on Circuits & Systems II Express Briefs · doi:10.1109/tcsii.2024.3360284 · Cited by 11
“1, BWN and TWN, generally require both positive (Q) and inverse (QB) code in the weight memory [3], [6], [8], while AND-based multi-bit MAC needs only the positive code [2], [4], [7].”
BackgroundBenchmarking DNN Mapping Methods for the in-Memory Computing Accelerators
Wang, Y., & Fong, X. (2023) · IEEE Journal on Emerging and Selected Topics in Circuits and Systems · doi:10.1109/jetcas.2023.3328864 · Cited by 11
“The intensive MAC operations in CONV and FC can greatly benefit from the use of IMC, as demonstrated by earlier works [1], [2], [3], [4], [5], [6], [7], [8], [9], [10], [11], [12].”
BackgroundMethodZhang, K., Zhang, D., Song, M., Guo, Z., Wang, Y., Wang, C., Zhang, Y., & Zeng, L. (2023) · IEEE Transactions on Circuits and Systems I Regular Papers · doi:10.1109/tcsi.2023.3296675 · Cited by 11
“CIM designs [16], [17], [18], [19], [20], [21], [22], [23],”
Tyagi, P., & Mittal, S. (2025) · Design, Automation and Test in Europe · doi:10.23919/date64628.2025.10992830 · Cited by 9
“However, Analog CIM architectures [7]–[11] encounter problems such as non-linearity, signal degradation, and low signal margin.”
Optical convolution operations with optical neural networks for incoherent color image recognition
Kim, B., Kim, Y., Kim, M., Yang, S. I., Jeong, D. S., & Park, W. I. (2024) · Optics and Lasers in Engineering · doi:10.1016/j.optlaseng.2024.108740 · Cited by 8
Zhang, H.-C., Yu, W.-H., Yang, Z., Un, K.-F., Yin, J., Martins, R. P., & Mak, P.-I. (2025) · IEEE Journal of Solid-State Circuits · doi:10.1109/jssc.2024.3413891 · Cited by 9
“Some works adopt compute-in-memory (CIM) techniques [11], [12], [13], [14] to improve the energy efficiency, yet they consume microwatt-level power consumption that exceeds nanowatt-level power budget.”
Chen, T., Wang, W., Chen, J., Fu, H., Yi, W., Cheng, B., Zhang, H., & Pan, B. (2024) · IEEE Transactions on Circuits and Systems I Regular Papers · doi:10.1109/tcsi.2024.3384271 · Cited by 9
“7(a), the 32-bit RISC-V extension instruction includes opcode in [6:0] for custom definition, segments [11:7], [19:15], [24:20] for register indices, [31:25] for funct7 intervals, and bits 12, 13, 14 to control registers rs2, rs1, rd usage.”
BackgroundSong, J., Tang, X.-Y., Luo, H.-Y., Xu, K., Wang, Y., Ji, Z.-G., Wang, R., & Huang, R. (2022) · International Symposium on Security in Computing and Communications · doi:10.1109/a-sscc56115.2022.9980797 · Cited by 8
“This Work ISSCC’21 [1] VLSI’19 [3] ISSCC’21 [4] ISSCC’21 [5] JSSC’22 [6] Technology 65nm 65nm 150nm 65nm 28nm 65nm Computing Cell Structure 2X6T+6T (SRAM) 8X6T+LCC (SRAM) 1T1R (RRAM) 1T1C (eDRAM) 32X6T +SILMC (SRAM) 8T (SRAM) Computing Topology Charge-IAF Current-mode Current-IAF Charge-sharingCharge-sharing Current-m…”
BackgroundInfluentialLiu, F., Yin, A., Xue, C., Wang, B., Feng, Z., Liu, H., Li, X., Gao, H., Xiong, T., & Si, X. (2024) · IEEE Transactions on Very Large Scale Integration (VLSI) Systems · doi:10.1109/tvlsi.2024.3446045 · Cited by 6
Self-citationYook, C.-G., & Shim, W. (2024) · IEEE Transactions on Electron Devices · doi:10.1109/ted.2024.3469183 · Cited by 6
“Manytypes of memory devices have been proposed as memory for PIM, such as static random access memory (SRAM) [1], [2], [3], [4], [5], resistive random access memory (RRAM) [6], [7], [8], and phase change memory (PCM) [9], [10], [11].”
BackgroundA Local Transpose 9T SRAM Compute-In-Memory Macro with Programmable Single-Slope SAR ADC
Zhang, X., Jo, Y.-J., Liu, J., Zhou, J., Zheng, Y., & Kim, T. T.-H. (2022) · IEEE Asian Solid-State Circuits Conference (A-SSCC) · doi:10.1109/a-sscc56115.2022.9980672 · Cited by 7
“Most reported works have focused on conducting forward data propagation for inference [1-2].”
BackgroundKneip, A., Lefebvre, M., Verecken, J., & Bol, D. (2022) · European Solid-State Circuits Conference (ESSCIRC) · doi:10.1109/esscirc55480.2022.9911348 · Cited by 7
“Novel architectures based on charge [3] or digital [5] computing help to reduce this loss, yet at the expense of area and/or energy efficiency.”
BackgroundJo, Y.-J., Zhang, X., Liu, J., Zhou, J., Zheng, Y., & Kim, T. T.-H. (2023) · IEEE Solid-State Circuits Letters · doi:10.1109/lssc.2023.3260090 · Cited by 9
“Therefore, successive approximation (SAR) and single-slope (SS) type ADCs are commonly used to meet the requirements [5], [6].”
BackgroundMethodInfluentialSong, J., Tang, X., Xu, B., Diao, H., Luo, H., Wu, Z., Wang, Y., Wang, R., & Huang, R. (2025) · IEEE Journal of Solid-State Circuits · doi:10.1109/jssc.2025.3580366 · Cited by 4
“Compared to digital CIM, analog CIM can perform accumulation directly on the bitline or CL [26], [37], [38], [39], significantly increasing storage density.”
Xu, Z.-L., Li, T., Lee, M.-Y., Jia, C., Zhang, S., George, S., Yang, H. L., Narayanan, V., & Li, X. (2025) · IEEE Transactions on Circuits and Systems I Regular Papers · doi:10.1109/tcsi.2025.3610874 · Cited by 5
“Both issues severely degrade the energy e ffi ciency of the CMOS-based CiMs [11].”
A Microscaling Multi-Mode Gain-Cell Computing-in-Memory Macro for Advanced AI Edge Device
Tien, J.-C., Wu, P.-C., Khwa, W.-S., Lele, A. S., Su, J.-W., Cheng, C.-Y., Hsu, J.-M., Chen, Y.-C., Hsieh, L.-J., Bai, J.-C., et al. (2025) · IEEE Journal of Solid-State Circuits · doi:10.1109/jssc.2025.3617944 · Cited by 5
“SRAM-based CIM (SRAM-CIM) enables low-latency multiply-and-accumulate (MAC) operations with high energy e ffi ciency (EEF) [1], [2], [3], [4], [5], [6], [7], [8], [9], [10], [11], [12], [13], [14].”
Self-citationXie, C., Shao, Z., Zhang, M., Du, Y., & Du, L. (2025) · IEEE Journal of Solid-State Circuits · doi:10.1109/jssc.2025.3563387 · Cited by 5
“Among CIM accelerators based on various memory technologies (DRAM [16], SRAM [17], and resistive random access memory (ReRAM) [18]), ReRAM-based and SRAM-based CIM have obtained widespread research interest due to their high density and reliability [19].”
Cao, Q., Wang, S., Fu, H., Gao, Q., Chen, Z., Gao, L., & Liang, F. (2025) · IEEE Transactions on Very Large Scale Integration (VLSI) Systems · doi:10.1109/tvlsi.2025.3573753 · Cited by 4
“Enhanced SRAM-based IMC architectures [14], [15], [16], [17], [18], [19] achieved Boolean logic functions like AND , NOR , and XOR .”
Xie, W., Sang, H., Kwon, B., Im, D., Kim, S., Kim, S., Lee, K., & Yoo, H. (2024) · IEEE Journal of Solid-State Circuits · doi:10.1109/jssc.2024.3470033 · Cited by 6
“…the memory and computing units, processing-in-memory (PIM) architecture is adopted by integrating computing within memory arrays themselves, as described in recent works across diverse types of memories, including SRAM [17], [18], [19], [20], [21], [22], DRAM [4], [23], and NVM [5], [24], [25].”
CIMFlow: An Integrated Framework for Systematic Design and Evaluation of Digital CIM Architectures
Qi, Y., Yang, J., Wang, Y., Wang, Y., Wang, D., Tang, L., Duan, C., He, X., & Zhao, W. S. (2025) · ACM/IEEE Design Automation Conference (DAC) · doi:10.1109/dac63849.2025.11133270 · Cited by 2
“Mainstream CIM designs can be broadly categorized into analog [7]–[9] and digital [10]–[12] approaches.”
A 65-nm 55.8-TOPS/W Compact 2T eDRAM-Based Compute-in-Memory Macro With Linear Calibration
Zhang, X.-Y., Jo, Y.-J., & Kim, T. T.-H. (2025) · IEEE Transactions on Very Large Scale Integration (VLSI) Systems · doi:10.1109/tvlsi.2024.3520588 · Cited by 6
“Existing works have explored weight sparsity and zero-skipping (ZS) techniques to improve energy efficiency [5], [6].”
Ma, Y., Meng, Y.-L., Xuan, Z.-H., Chen, S., & Kang, Y. (2025) · ACM Trans. Design Autom. Electr. Syst. · doi:10.1145/3724394 · Cited by 6
“Analog CIM [10, 14, 22, 23, 29] performs MAC operations in analog domains, such as current, charge, and time.”
Choi, B., Choi, E. J., Yi, D., Chun, J., Ha, S., Chang, I., & Je, M. (2024) · 2024 IEEE European Solid-State Electronics Research Conference (ESSERC) · doi:10.1109/esserc62670.2024.10719461 · Cited by 5
AIO: An Abstraction for Performance Analysis Across Diverse Accelerator Architectures
Rogers, J., Soliman, T., & Jahre, M. (2024) · International Symposium on Computer Architecture · doi:10.1109/isca59077.2024.00043 · Cited by 6
“…proposes efficient accelerator architectures, including logic-side NPM (e.g., Eyeriss [9], GenASM [7], and CryoCore [6]), logic-side PUM (e.g., SCM [57], Analog Compute Engine [19], and IMNPU [13]), memory-side PUM accelerators (e.g., Ambit [52] and Samsung’s PIM-HBM [41]), and memory-side NDP…”
BackgroundMethodInfluentialSu, J.-W., Lu, P.-J., Wu, P.-C., Chou, Y.-C., Liu, T.-W., Chung, Y.-L., Hung, L.-Y., Ren, J.-S., Huang, W.-H., Chien, C.-H., et al. (2023) · IEEE Transactions on Circuits & Systems II Express Briefs · doi:10.1109/tcsii.2023.3331375 · Cited by 6
“ADCs have also been applied to output operations [10], [11], [16], [17]; however, that approach is not energy efficient, due to the need to transfer the ADC output to the readout circuit.”
BackgroundMethodSelf-citationChallenges in Circuits of Nonvolatile Compute-In-Memory for Edge AI Chips
Hsu, H.-H., Wen, T.-H., Wu, P.-C., Jhang, C.-J., You, D.-Q., Chen, P.-C., & Chang, M. (2023) · IEEE International Midwest Symposium on Circuits and Systems (MWSCAS) · doi:10.1109/mwscas57524.2023.10405877 · Cited by 8
Self-citationProbabilistic Compute-in-Memory Design for Efficient Markov Chain Monte Carlo Sampling
Fu, Y., Shi, D., Fan, A., Yue, W., Yang, Y., Huang, R., & Yan, B. (2023) · IEEE Transactions on Circuits and Systems I Regular Papers · doi:10.1109/tcsi.2023.3337529 · Cited by 6
“As one of the promising solutions to overcome von Neumann bottleneck [16], [17], [18], [19], [20], this technology has been developed to perform energy-efficient computations in many AI applications [21], [22], [23], [24], [25], [26], [27], [28].”
MethodDesign Methodology towards High-Precision SRAM based Computation-in-Memory for AI Edge Devices
Xiong, T., Zhou, Y., Kong, Y., Wang, B., Guo, A., Wang, Y., Xue, C., Hsu, H., Si, X., & Yang, J. (2021) · International SoC Design Conference · doi:10.1109/isocc53507.2021.9613913 · Cited by 6
“8/1 bit ISSCC19 Sandwich [3] ISSCC21 [7] 4/4 bit 8/8 bit 8/8 bit 4/4 bit ISSCC21 [8] Input /Weight bit ISSCC20 TWT [6] 8/8 bit 4/4 bit Fig.”
Self-citationA Construction Kit for Efficient Low Power Neural Network Accelerator Designs
Jokic, P., Azarkhish, E., Bonetti, A., Pons, M., Emery, S., & Benini, L. (2022) · ACM Transactions on Embedded Computing Systems · doi:10.1145/3520127 · Cited by 9
“A 384kb SRAM-based 8b precision CIM in 28nm [66] is demonstrated to have 28% area overhead compared to a pure SRAM array while achieving up to 22.”
BackgroundMethodCIMinus: Empowering Sparse DNN Workloads Modeling and Exploration on SRAM-Based CIM Architectures
Qi, Y.-J., Yang, J.-L., Yang, R.-B., Duan, C.-L., He, X.-L., He, Z.-Y., Pan, W., & Zhao, W.-S. (2025) · IEEE transactions on computers · doi:10.1109/tc.2025.3628114 · Cited by 5
“This approach not only increases the capacity of the in-memory architecture, but also improves the overall system performance and efficiency [16], [22].”
Jhang, C.-J., Khwa, W.-S., Wu, P.-C., Lele, A. S., Wu, P.-S., Ke, C.-E., Chiu, T.-C., Hung, Y.-C., Hsu, W.-T., Hsu, J.-M., et al. (2024) · IEEE transactions on circuits and systems for artificial intelligence. · doi:10.1109/tcasai.2024.3443770 · Cited by 4
“The FoM of the proposed time-digital-hybrid SRAM-CIM was 1.2-1.61x higher than that of previous works using single-domain INT SRAM-CIM [6], [14], [21], due to the high accuracy of digital-domain computation (used for the MSB input) and the high energy ef fi ciency of time-domain computation (used…”
BackgroundMethodInfluentialSelf-citationMao, W., Li, F., Liu, J., Xiao, R., Huang, K., Li, Y., Yu, H., Liu, Y., & Han, G. (2023) · IEEE Transactions on Circuits & Systems II Express Briefs · doi:10.1109/tcsii.2023.3330080 · Cited by 8
“CIM accelerators based on non-volatile memories (NVM) [4], [5], [6] offer in-situ storage and computation advantages, resulting in smaller area and lower power consumption than SRAM-based accelerators [7], [8], [9].”
BackgroundConfigurable in-memory computing architecture based on dual-port SRAM
Zhao, Y., Liu, Y., Zheng, J., Tong, Z., Wang, X., Yu, R., Wu, X., Zhou, Y., Peng, C., Lu, W., et al. (2024) · Microelectronics Journal · doi:10.1016/j.mejo.2024.106163 · Cited by 6
Chang, L., Zhao, X., Yue, T., Yang, X., Li, C., Lin, S., & Zhou, J. (2023) · IEEE Transactions on Very Large Scale Integration (VLSI) Systems · doi:10.1109/tvlsi.2023.3330648 · Cited by 5
“Several CIM circuits have been developed via analog-and digital-domain computation schemes [6], [7], [11].”
Background
Metadata
- Authors
- Su, J.-W., Chou, Y.-C., Liu, R., Liu, T.-W., Lu, P.-J., Wu, P.-C., Chung, Y.-L., Hung, L.-Y., Ren, J.-S., Pan, T., Li, S.-H., Chang, S.-C., Sheu, S.-S., Lo, W.-C., Wu, C.-I., Si, X., Lo, C.-C., Liu, R.-S., Hsieh, C.-C., Tang, K.-T., & Chang, M.-F.
- Affiliations
- National Tsing Hua University (TW)
- Industrial Technology Research Institute (TW)
- ORCID
- Venue
- 2021 IEEE International Solid-State Circuits Conference (ISSCC)
- Publisher
- IEEE
- Published
- 2021-02-13
- Pages
- 250-252
- ISSN
- 0193-6530 (ISSN-L)
- OpenAlex
- W3133754064
- Cited by
- 207
- References
- 0
- Citations by year
- 2026: 21 · 2025: 35 · 2024: 34 · 2023: 54 · 2022: 52 · 2021: 11
- FWCI
- 59.27
- Type
- conference paper
- Language
- en
- Open access
- closed
- Locations
- Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference (publishedVersion)
- Funders
- Nova
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Advanced Memory and Neural Computing
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Low-power high-performance VLSI design
- Physical Sciences › Computer Science › Hardware and Architecture › Parallel Computing and Optimization Techniques
- Keywords
- in-memory computing, 6T SRAM, multiply-accumulate operations, energy efficiency, process variation, analog readout
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