Soft Core/Shell Packages for Stretchable Electronics
Open accessAbstract
This paper presents materials and core/shell architectures that provide optimized mechanical properties in packages for stretchable electronic systems. Detailed experimental and theoretical studies quantitatively connect the geometries and elastic properties of the constituent materials to the overall mechanical responses of the integrated systems, with a focus on interfacial stresses, effective modulus, and maximum extent of elongation. Specific results include core/shell designs that lead to peak values of the shear and normal stresses on the skin that remain less than 10 kPa even for applied strains of up to 20%, thereby inducing minimal somatosensory perception of the device on the human skin. Additional, strain‐limiting mesh structures embedded in the shell improve mechanical robustness by protecting the active components from strains that would otherwise exceed the fracture point. Demonstrations in precommercial stretchable electronic systems illustrate the utility of these concepts.
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The elastomeric microfluidic devices exhibited an effective modulus of ~0.16 MPa, comparable to human skin and previously reported epidermal devices.
“These elastomeric microfluidic devices exhibited an effective modulus of ~0.16 MPa, comparable to human skin and previously reported epidermal devices (37, 38).”
From A soft, wearable microfluidic device for the capture, storage, and colorimetric sensing of sweat (2016) · cites this paper as [37]
The maximum normal and shear stresses at the device/phantom skin interface were far below the threshold for somatosensory perception of forces (20 kPa) during ~30% stretch of the skin.
“The maximum normal and shear stresses at the device/phantom skin interface were far below the threshold for somatosensory perception of forces (20 kPa) during ~30% stretch of the skin (fig. S4) (37).”
From A soft, wearable microfluidic device for the capture, storage, and colorimetric sensing of sweat (2016) · cites this paper as [37]
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- Authors
- Lee, C. H., Ma, Y., Jang, K., Banks, A., Pan, T., Feng, X., Kim, J. S., Kang, D., Raj, M. S., McGrane, B. L., Morey, B., Wang, X., Ghaffari, R., Huang, Y., & Rogers, J. A.
- Affiliations
- University of Illinois Urbana-Champaign (US)
- Northwestern University (US)
- Tsinghua University (CN)
- MC10 (United States) (US)
- Corresponding author
- Huang, Yonggang
- Rogers, John A.
- ORCID
- Venue
- Advanced Functional Materials
- Publisher
- Wiley
- Published
- 2015-05-15
- Volume
- 25
- Issue
- 24
- Pages
- 3698-3704
- ISSN
- 1616-301X (ISSN-L)
- 1616-3028
- OpenAlex
- W1501095414
- Cited by
- 131
- References
- 10
- Citations by year
- 2026: 1 · 2025: 5 · 2024: 9 · 2023: 5 · 2022: 11 · 2021: 17 · 2020: 6 · 2019: 25 · 2018: 22 · 2017: 14 · 2016: 16
- FWCI
- 8.61
- Type
- journal article
- Language
- en
- Open access
- green
- www.osti.gov
- Locations
- Advanced Functional Materials (publishedVersion)
- OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) (submittedVersion)
- KAIST Institutional Repository (KAIST) (submittedVersion)
- Funders
- U.S. Department of Energy (DEFG0207ER46471)
- Topics
- Physical Sciences › Engineering › Biomedical Engineering › Advanced Sensor and Energy Harvesting Materials
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Nanomaterials and Printing Technologies
- Physical Sciences › Engineering › Mechanical Engineering › Advanced Materials and Mechanics
- Keywords
- stretchable electronics, interfacial stress, effective moduli, somatosensory perception, mechanical robustness, elastic properties
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