The insulation performance of reactive parylene films in implantable electronic devices
Open accessAbstract
Parylene-C (poly-chloro-p-xylylene) is an appropriate material for use in an implantable, microfabricated device. It is hydrophobic, conformally deposited, has a low dielectric constant, and superb biocompatibility. Yet for many bioelectrical applications, its poor wet adhesion may be an impassable shortcoming. This research contrasts parylene-C and poly(p-xylylene) functionalized with reactive group X (PPX-X) layers using long-term electrical soak and adhesion tests. The reactive parylene was made of complementary derivatives having aldehyde and aminomethyl side groups (PPX-CHO and PPX-CH2NH2 respectively). These functional groups have previously been shown to covalently react together after heating. Electrical testing was conducted in saline at 37 degrees C on interdigitated electrodes with either parylene-C or reactive parylene as the metal layer interface. Results showed that reactive parylene devices maintained the highest impedance. Heat-treated PPX-X device impedance was 800% greater at 10kHz and 70% greater at 1Hz relative to heated parylene-C controls after 60 days. Heat treatment proved to be critical for maintaining high impedance of both parylene-C and the reactive parylene. Adhesion measurements showed improved wet metal adhesion for PPX-X, which corresponds well with its excellent high frequency performance.
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Previous studies of peripheral implants used for rodents have reported peak-to-peak signal amplitudes ranging from 100-900 μV in response to electrical stimuli.
“Previous studies of peripheral implants used for rodents have reported peak-to-peak signal amplitudes ranging from 100–900 μV in response to electrical stimuli [22–27].”
From A novel flexible cuff-like microelectrode for dual purpose, acute and chronic electrical interfacing with the mouse cervical vagus nerve (2017) · cites this paper as [23]
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- Authors
- Seymour, J. P., Elkasabi, Y. M., Chen, H.-Y., Lahann, J., & Kipke, D. R.
- Affiliations
- University of Michigan (US)
- Corresponding author
- Seymour, John P.
- Venue
- Biomaterials
- Publisher
- Elsevier BV
- Published
- 2009-10
- Volume
- 30
- Issue
- 31
- Pages
- 6158-6167
- ISSN
- 0142-9612 (ISSN-L)
- PMC
- PMC2748105
- OpenAlex
- W1969213762
- Cited by
- 147
- References
- 36
- Citations by year
- 2026: 4 · 2025: 8 · 2024: 12 · 2023: 15 · 2022: 8 · 2021: 11 · 2020: 2 · 2019: 5 · 2018: 8 · 2017: 12 · 2016: 10 · 2015: 17 · 2014: 6 · 2013: 10 · 2012: 3
- FWCI
- 2.49
- Type
- journal article
- Language
- en
- Open access
- green
- www.ncbi.nlm.nih.gov
- Licence
- Locations
- Biomaterials (publishedVersion)
- PubMed (publishedVersion)
- Europe PMC (PubMed Central) (acceptedVersion)
- PubMed Central (acceptedVersion)
- Funders
- U.S. Department of Defense
- University of Michigan
- Multidisciplinary University Research Initiative
- National Institute of Biomedical Imaging and Bioengineering (P41EB002030, T32EB005582)
- National Institute of Dental and Craniofacial Research (T32DE007057)
- Topics
- Life Sciences › Neuroscience › Cellular and Molecular Neuroscience › Neuroscience and Neural Engineering
- Physical Sciences › Materials Science › Surfaces, Coatings and Films › Polymer Surface Interaction Studies
- Physical Sciences › Materials Science › Polymers and Plastics › Conducting polymers and applications
- Keywords
- Parylene C, poly(p-xylylene), implantable electronics, dielectric insulation, electrical impedance, wet adhesion, heat treatment, interdigitated electrodes, saline immersion, biocompatibility
- MeSH terms
- Biocompatible Materials, Electrochemistry, Models, Theoretical, Polymers, Xylenes
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