Corrosion of silicon integrated circuits and lifetime predictions in implantable electronic devices
Open accessAbstract
Corrosion is a prime concern for active implantable devices. In this paper we review the principles underlying the concepts of hermetic packages and encapsulation, used to protect implanted electronics, some of which remain widely overlooked. We discuss how technological advances have created a need to update the way we evaluate the suitability of both protection methods. We demonstrate how lifetime predictability is lost for very small hermetic packages and introduce a single parameter to compare different packages, with an equation to calculate the minimum sensitivity required from a test method to guarantee a given lifetime. In the second part of this paper, we review the literature on the corrosion of encapsulated integrated circuits (ICs) and, following a new analysis of published data, we propose an equation for the pre-corrosion lifetime of implanted ICs, and discuss the influence of the temperature, relative humidity, encapsulation and field-strength. As any new protection will be tested under accelerated conditions, we demonstrate the sensitivity of acceleration factors to some inaccurately known parameters. These results are relevant for any application of electronics working in a moist environment. Our comparison of encapsulation and hermetic packages suggests that both concepts may be suitable for future implants.
The claims and statistics of this paper haven’t been checked yet.
Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.
Integrity signals
Registry
Cites
Statistics
Claims the paper makes
The claims and statistics of this paper haven’t been checked yet.
Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.
Claims other papers make about this one
Each is checked against this paper’s own text: does it say what the citing paper says it does?
Implant packaging methods to provide biocompatibility and corrosion protection through hermetic packages and coatings and non-hermetic encapsulants aim to offer device lifetimes of years to decades.
“Implant packaging methods to provide a biocompatiblity and corrosion protection through hermetic packages and coatings and non-hermetic encapsulants aim to offer device lifetimes of years to decades [213], [214], [215].”
From Active Neural Interface Circuits and Systems for Selective Control of Peripheral Nerves: A Review (2024) · cites this paper as [214]
Current density through the passivation layer of implantable ASICs affects their lifetime.
“Furthermore, implantable ASICs, should be designed such that the current density through their passivation layer is limited, as this has been shown to affect the lifetime (Vanhoestenberghe and Donaldson 2013).”
From Realizing flexible bioelectronic medicines for accessing the peripheral nerves – technology considerations (2018) · cites this paper as Vanhoestenberghe and Donaldson 2013
For hermetic packages with volumes less than 1mm3, long-life predictability is lost.
“Furthermore, rigid packages are likely to damage the fragile targeted nerves, while it has been shown that for hermetic packages with volumes less than 1mm3, long-life predictability is lost (Vanhoestenberghe and Donaldson 2013).”
From Realizing flexible bioelectronic medicines for accessing the peripheral nerves – technology considerations (2018) · cites this paper as Vanhoestenberghe and Donaldson 2013
Self-check
Percentages, sums and reported differences re-computed from the paper’s own numbers.
The self-check needs the paper’s full text.
Cites
A Review of Accelerated Test Models
Escobar, L. A., & Meeker, W. Q. (2006) · Statistical Science · doi:10.1214/088342306000000321 · Cited by 639 · see citing works
A Review of Accelerated Test ModelsPreprint
Escobar, L. A., & Meeker, W. Q. (2006) · Cited by 518 · see citing works
The first 500 patients with sacral anterior root stimulator implants: general description
Brindley, G. S. (1994) · Spinal Cord · doi:10.1038/sc.1994.126 · Cited by 318 · see citing works
Rizzo, J. F., Wyatt, J. L., Humayun, M. S., de Juan, E., Liu, W., Chow, A. Y., Eckmiller, R., Zrenner, E., Yagi, T., & Abrams, G. W. (2001) · Ophthalmology · doi:10.1016/s0161-6420(00)00430-9 · Cited by 152 · see citing works
Physiological measurements using ultra-high field fMRI: a review
Francis, S., & Sánchez-Panchuelo, R.-M. (2014) · Physiological Measurement · doi:10.1088/0967-3334/35/9/r167 · Cited by 141 · see citing works
Recent humidity accelerations, a base for testing standards
Hallberg, Ö., & Peck, D. S. (1991) · Quality and Reliability Engineering International · doi:10.1002/qre.4680070308 · Cited by 133 · see citing works
A CMOS Chip With Active Pixel Array and Specific Test Features for Subretinal Implantation
Rothermel, A., Liu, L., Aryan, N. P., Fischer, M. D., Wuenschmann, J., Kibbel, S., & Harscher, A. (2009) · IEEE Journal of Solid-State Circuits · doi:10.1109/jssc.2008.2007436 · Cited by 109 · see citing works
The Packaging of Implantable Integrated Sensors
Bowman, L., & MEINDL, J. D. (1986) · IEEE Transactions on Biomedical Engineering · doi:10.1109/tbme.1986.325807 · Cited by 103 · see citing works
Jezernik, S., Craggs, M., Grill, W. M., Creasey, G., & Rijkhoff, N. J. M. (2002) · Neurological Research · doi:10.1179/016164102101200294 · Cited by 102 · see citing works
Nonhermeticity of Polymeric Lid Sealants
Traeger, R. K. (1977) · IEEE Transactions on Parts Hybrids and Packaging · doi:10.1109/tphp.1977.1135193 · Cited by 90 · see citing works
Neuroprostheses to treat neurogenic bladder dysfunction: current status and future perspectives
Rijkhoff, N. J. M. (2004) · Child's Nervous System · doi:10.1007/s00381-003-0859-1 · Cited by 66 · see citing works
Scamans, G., & Rehal, A. S. (1979) · Journal of Materials Science · doi:10.1007/bf00737037 · Cited by 65 · see citing works
Corrosion-induced degradation of microelectronic devices
Osenbach, J. (1996) · Semiconductor Science and Technology · doi:10.1088/0268-1242/11/2/002 · Cited by 64 · see citing works
Moisture, Myths, and Microcircuits
Thomas, R. (1976) · IEEE Transactions on Parts Hybrids and Packaging · doi:10.1109/tphp.1976.1135142 · Cited by 55 · see citing works
Humidity acceleration factor for plastic packaged electronic devices
Klinger, D. J. (1991) · Quality and Reliability Engineering International · doi:10.1002/qre.4680070505 · Cited by 54 · see citing works
Aspects of silicone rubber as an encapsulant for neurological prostheses
Donaldson, P. E. K. (1991) · Medical & Biological Engineering & Computing · doi:10.1007/bf02446293 · Cited by 53 · see citing works
The back-pressurising technique of leak-testing
Howl, D. A., & Mann, C. A. (1965) · Vacuum · doi:10.1016/0042-207x(65)91083-3 · Cited by 52 · see citing works
Temperature acceleration models in reliability predictions: Justification & improvements
Bayle, F., & Mettas, A. (2010) · Proceedings, annual Reliability and Maintainability Symposium/Proceedings. Annual Reliability and Maintainability Symposium · doi:10.1109/rams.2010.5448028 · Cited by 51 · see citing works
The Encapsulation of Microelectronic Devices for Long-Term Surgical Implantation
Donaldson, P. E. K. (1976) · IEEE Transactions on Biomedical Engineering · doi:10.1109/tbme.1976.324586 · Cited by 50 · see citing works
Metallization Corrosion in Silicon Devices by Moisture-Induced Electrolysis
Koelmans, H. (1974) · IEEE International Reliability Physics Symposium proceedings · doi:10.1109/irps.1974.362643 · Cited by 50 · see citing works
Ion transport in encapsulants used in microcircuit packaging
Lantz, L., & PECHT, M. G. (2003) · IEEE Transactions on Components and Packaging Technologies · doi:10.1109/tcapt.2002.806183 · Cited by 49 · see citing works
Wireless technologies for closed-loop retinal prostheses
Ng, D. C., Bai, S., Yang, J., Tran, N., & Skafidas, E. S. (2009) · Journal of Neural Engineering · doi:10.1088/1741-2560/6/6/065004 · Cited by 48 · see citing works
A new approach towards a minimal invasive retina implant
Gerding, H. (2007) · Journal of Neural Engineering · doi:10.1088/1741-2560/4/1/s05 · Cited by 46 · see citing works
Qi, H., Vichare, N. M., Azarian, M. H., & PECHT, M. G. (2008) · IEEE Transactions on Components and Packaging Technologies · doi:10.1109/tcapt.2008.921647 · Cited by 45 · see citing works
Field failure due to creep corrosion on components with palladium pre-plated leadframes
Zhao, P., & PECHT, M. G. (2003) · Microelectronics Reliability · doi:10.1016/s0026-2714(03)00064-7 · Cited by 40 · see citing works
The Limits of Hermeticity Test Methods for Micropackages
Vanhoestenberghe, A., & Donaldson, N. (2011) · Artificial Organs · doi:10.1111/j.1525-1594.2011.01222.x · Cited by 39 · see citing works
Self-citationBalde, J. W. (1991) · IEEE Transactions on Components Hybrids and Manufacturing Technology · doi:10.1109/33.87316 · Cited by 39 · see citing works
Understanding the use of silicone gels for nonhermetic plastic packaging
Wong, C. P., Segelken, J. M., & Balde, J. W. (1989) · IEEE Transactions on Components Hybrids and Manufacturing Technology · doi:10.1109/33.48998 · Cited by 39 · see citing works
Water‐Induced Corrosion of Materials Used for Semiconductor Passivation
Osenbach, J. (1993) · Journal of The Electrochemical Society · doi:10.1149/1.2221147 · Cited by 36 · see citing works
Humidity Threshold Variations for Dendrite Growth on Hybrid Substrates
Marderosian, A. D., & Murphy, C. (1977) · IEEE International Reliability Physics Symposium proceedings · doi:10.1109/irps.1977.362777 · Cited by 35 · see citing works
Olberg, R. C., & Bozarth, J. L. (1976) · Microelectronics Reliability · doi:10.1016/0026-2714(76)90278-x · Cited by 32 · see citing works
Sim, S. P., & Lawson, R. W. (1979) · IEEE International Reliability Physics Symposium proceedings · doi:10.1109/irps.1979.362878 · Cited by 32 · see citing works
New Acceleration Factors for Temperature, Humidity, Bias Testing
Sbar, N., & Kozakiewicz, R. P. (1978) · IEEE International Reliability Physics Symposium proceedings · doi:10.1109/irps.1978.362842 · Cited by 31 · see citing works
Behavior of a ‐ SiN : H and a ‐ SiON : H Films in Condensed Water
Osenbach, J., & Knolle, W. R. (1992) · Journal of The Electrochemical Society · doi:10.1149/1.2069076 · Cited by 28 · see citing works
Iannuzzi, M. (1983) · IEEE Transactions on Components Hybrids and Manufacturing Technology · doi:10.1109/tchmt.1983.1136166 · Cited by 28 · see citing works
Jarvis, J. C., & Salmons, S. (2001) · Medical Engineering & Physics · doi:10.1016/s1350-4533(01)00005-4 · Cited by 26 · see citing works
Striny, K. M., & Schelling, A. (1981) · IEEE Transactions on Components Hybrids and Manufacturing Technology · doi:10.1109/tchmt.1981.1135819 · Cited by 26 · see citing works
Donaldson, P. E. K., & Aylett, B. J. (1995) · PubMed · doi:10.1007/bf02510794 · Cited by 24 · see citing works
Ensuring minimal humidity levels in hermetic implant housings
Schüettler, M., Schatz, A., Ordonez, J. S., & Stieglitz, T. (2011) · Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC) · doi:10.1109/iembs.2011.6090578 · Cited by 24 · see citing works
The permeability of silicone rubber to metal compounds: Relevance to implanted devices
Donaldson, N., Baviskar, P., Cunningham, J. C., & Wilson, D. (2011) · Journal of Biomedical Materials Research Part A · doi:10.1002/jbm.a.33257 · Cited by 22 · see citing works
Self-citationIannuzzi, M. (1983) · IEEE Transactions on Components Hybrids and Manufacturing Technology · doi:10.1109/tchmt.1983.1136165 · Cited by 22 · see citing works
Aspects of silicone rubber as encapsulant for neurological prostheses Part 4: Two-part rubbers
Donaldson, P. E. K. (1997) · Medical & Biological Engineering & Computing · doi:10.1007/bf02530051 · Cited by 20 · see citing works
Understanding the use of silicone gels for non-hermetic plastic packaging
Wong, C. P., Segelken, J. M., & Balde, J. W. (1989) · Proceedings., 39th Electronic Components Conference · doi:10.1109/ecc.1989.77838 · Cited by 20 · see citing works
Aspects of silicone rubber as encapsulant for neurological prostheses
Donaldson, P. E. K., & Aylett, B. J. (1995) · Medical & Biological Engineering & Computing · doi:10.1007/bf02510501 · Cited by 20 · see citing works
Edell, D. J. (2004) · Series on bioengineering and biomedical engineering · doi:10.1142/9789812561763_0016 · Cited by 20 · see citing works
Zrenner, E., Wilke, R. G. H., Bartz‐Schmidt, K. U., Gekeler, F., Besch, D., Benav, H., Bruckmann, A., Porubská, K., Kusnyerik, Á., Sachs, H., et al. (2009) · International Conference on Biomedical Engineering and Informatics (BMEI) · doi:10.1109/bmei.2009.5305315 · Cited by 18 · see citing works
A Flat Interface Nerve Electrode With Integrated Multiplexer
Lertmanorat, Z., Montague, F. W., & Durand, D. M. (2008) · IEEE Transactions on Neural Systems and Rehabilitation Engineering · doi:10.1109/tnsre.2008.2009307 · Cited by 18 · see citing works
Water-treeing as an osmotic phenomenon☆
Fedors, R. F. (1980) · Polymer · doi:10.1016/0032-3861(80)90241-4 · Cited by 17 · see citing works
Reliability Evaluation and Prediction for Discrete Semiconductors
Herr, E., Poe, A., & Fox, A. (1980) · IEEE Transactions on Reliability · doi:10.1109/tr.1980.5220802 · Cited by 15 · see citing works
Plastic packages survive where hermetic packages fail
Sinnadurai, N. (1996) · Microelectronics Reliability · doi:10.1016/0026-2714(96)00065-0 · Cited by 13 · see citing works
Acceleration Factors for IC Leakage Current in a Steam Environment
Weick, W. W. (1980) · IEEE Transactions on Reliability · doi:10.1109/tr.1980.5220744 · Cited by 12 · see citing works
Iannuzzi, M. (1981) · IEEE Transactions on Components Hybrids and Manufacturing Technology · doi:10.1109/tchmt.1981.1135825 · Cited by 10 · see citing works
Corrosion of thin film aluminum metallization: conformal coating materials
Osenbach, J. S., & Zell, J. L. (1993) · IEEE Transactions on Components Hybrids and Manufacturing Technology · doi:10.1109/33.232064 · Cited by 7 · see citing works
An implantable humidity-to-frequency sensor in CMOS technology
Cirmirakis, D., Demosthenous, A., Saeidi, N., Vanhoestenberghe, A., & Donaldson, N. (2011) · Proceedings of IEEE Sensors/Proceedings of IEEE Sensors ... · doi:10.1109/icsens.2011.6127363 · Cited by 6 · see citing works
Self-citationAssessment of Silicone Encapsulation Materials: Screening Techniques
Christou, A., & Wilkins, W. (1977) · IEEE International Reliability Physics Symposium proceedings · doi:10.1109/irps.1977.362780 · Cited by 5 · see citing works
Insulating Biomaterials Research for Implantable Microelectronic Devices
Edell, D. J. (2003) · MRS Proceedings · doi:10.1557/proc-773-n1.9 · Cited by 4 · see citing works
Flagged first, then by citations
1 of the 57 references couldn’t be matched to a known paper.
Research works printed but not linked: 10
- Bayle F & Mettas A 2010 in 'Proceedings of the Reliability and Maintainability Symposium (RAMS), 2010' IEEE pp. 1-6.
- Christou A & Wilkins W 1977 in 'Proc. 15th Annual Reliability Physics Symposium' pp. 112-119.
- Cirmirakis D, Demosthenous A, Saeidi N, Vanhoestenberghe A & Donaldson N 2011 in 'Proc. IEEE Sensors' pp. 1511-1514.
- DerMarderosian A & Murphy C 1977 in 'Proc. 15th Annual Reliability Physics Symposium' pp. 92-100.
- Donaldson N, Vanhoestenberghe A, Saeidi N, Evans J, Liu X, Cirmirakis D, Demosthenous A & Schuettler M 2011 in 'Proc. of the Medical Bionics Conference' Melbourne.
- Koelmans H 1974 in 'Reliability Physics Symposium, 1974. 12th Annual' pp. 168 -171.
- Sbar N L & Kozakiewicz R P 1978 in 'Proc. 16th Annual Reliability Physics Symposium' pp. 161-178.
- Schuettler M, Schatz A, Ordonez J S & Stieglitz T 2011 in 'Proc. 33rd Annual International Conference of the IEEE EMBS' pp. 2296-2299.
- Sim S & Lawson R 1979 in '17th Annual Reliability Physics Symposium' IEEE pp. 103-112.
- Zrenner E, Wilke R, Bartz-Schmidt K U, Gekeler F, Besch D, Benav H, Bruckmann A, Porubska K, Kusnyerik A, Sachs H, Peters T, Wilhelm B, Greppmaier U, Harscher A, Kibbel S, Wrobel W & Stett A 2009 in 'Proc. 2nd International Conference on Biomedical Engineering and Informatics (BMEI)' pp. 1-4.
Cited by
Sorted by citations
Boehler, C., Carli, S., Fadiga, L., Stieglitz, T., & Asplund, M. (2020) · Nature Protocols · doi:10.1038/s41596-020-0389-2 · Cited by 311 · see citing works
Retinal stimulation strategies to restore vision: fundamentals and systems
Yue, L., Weiland, J. D., Roska, B., & Humayun, M. S. (2016) · Progress in Retinal and Eye Research · doi:10.1016/j.preteyeres.2016.05.002 · Cited by 272 · see citing works
An update on retinal prostheses
Ayton, L. N., Barnes, N., Dagnelie, G., Fujikado, T., Goetz, G., Hornig, R., Jones, B. W., Muqit, M. M. K., Rathbun, D. L., Stingl, K., et al. (2020) · Clinical Neurophysiology · doi:10.1016/j.clinph.2019.11.029 · Cited by 223 · see citing works
Self‐Powered Implantable Medical Devices: Photovoltaic Energy Harvesting Review
Zhao, J., Ghannam, R., Htet, K. O., Liu, Y., Law, M. K., Roy, V. A. L., Michel, B., Imran, M. A., & Heidari, H. (2020) · Advanced Healthcare Materials · doi:10.1002/adhm.202000779 · Cited by 219 · see citing works
Micromachining of Parylene C for bioMEMS
Kim, B., & Meng, E. F. (2015) · Polymers for Advanced Technologies · doi:10.1002/pat.3729 · Cited by 206 · see citing works
Weiland, J. D., & Humayun, M. S. (2014) · IEEE Transactions on Biomedical Engineering · doi:10.1109/tbme.2014.2314733 · Cited by 186 · see citing works
Bioelectronics for electrical stimulation: materials, devices and biomedical applications
Huang, Y., Yao, K., Zhang, Q., Huang, X., Chen, Z., Zhou, Y., & Yu, X. (2024) · Chemical Society Reviews · doi:10.1039/d4cs00413b · Cited by 166 · see citing works
Translational opportunities and challenges of invasive electrodes for neural interfaces
Shen, K., Chen, O., Edmunds, J. L., Piech, D. K., & Maharbiz, M. M. (2023) · Nature Biomedical Engineering · doi:10.1038/s41551-023-01021-5 · Cited by 143 · see citing works
Xie, X., Rieth, L., Williams, L., Negi, S., Bhandari, R., Caldwell, R., Sharma, R., Tathireddy, P., & Solzbacher, F. (2014) · Journal of Neural Engineering · doi:10.1088/1741-2560/11/2/026016 · Cited by 137 · see citing works
Development of visual Neuroprostheses: trends and challenges.
Fernandez, E. (2018) · Bioelectronic Medicine · doi:10.1186/s42234-018-0013-8 · Cited by 114 · see citing works
Recent advances in neural dust: towards a neural interface platform
Neely, R., Piech, D. K., Santacruz, S. R., Maharbiz, M. M., & Carmena, J. M. (2018) · Current Opinion in Neurobiology · doi:10.1016/j.conb.2017.12.010 · Cited by 119 · see citing works
Conformable hybrid systems for implantable bioelectronic interfaces
Fallegger, F., Schiavone, G., & Lacour, S. P. (2020) · Advanced Materials · doi:10.1002/adma.201903904 · Cited by 113 · see citing works
A Review: Electrode and Packaging Materials for Neurophysiology Recording Implants
Yang, W., Gong, Y. P., & Li, W. (2021) · Frontiers in Bioengineering and Biotechnology · doi:10.3389/fbioe.2020.622923 · Cited by 107 · see citing works
Electrode Materials for Chronic Electrical Microstimulation
Zheng, X. S., Tan, C., Castagnola, E., & Cui, X. T. (2021) · Advanced Healthcare Materials · doi:10.1002/adhm.202100119 · Cited by 86 · see citing works
Silicon-Integrated High-Density Electrocortical Interfaces
Ha, S., Akinin, A., Park, J., Kim, C., Wang, H., Maier, C., Mercier, P. P., & Cauwenberghs, G. (2016) · Proceedings of the IEEE · doi:10.1109/jproc.2016.2587690 · Cited by 84 · see citing works
The development of neural stimulators: a review of preclinical safety and efficacy studies
Shepherd, R. K., Villalobos, J., Burns, O., & Nayagam, D. A. X. (2018) · Journal of Neural Engineering · doi:10.1088/1741-2552/aac43c · Cited by 81 · see citing works
Modeling and Analysis of Performance Degradation Data for Reliability Assessment: A Review
Li, S., Chen, Z., Liu, Q., Shi, W., & Li, K. (2020) · IEEE Access · doi:10.1109/access.2020.2987332 · Cited by 65 · see citing works
Let There Be Light—Optoprobes for Neural Implants
Alt, M. T., Fiedler, E., Rudmann, L., Ordonez, J. S., Ruther, P., & Stieglitz, T. (2016) · Proceedings of the IEEE · doi:10.1109/jproc.2016.2577518 · Cited by 62 · see citing works
Giagka, V., & Serdijn, W. A. (2018) · Bioelectronic Medicine · doi:10.1186/s42234-018-0010-y · Cited by 58 · see citing works
Advances in visual prostheses: engineering and biological challenges
Borda, E., & Ghezzi, D. (2022) · Progress in Biomedical Engineering · doi:10.1088/2516-1091/ac812c · Cited by 44 · see citing works
Surface-Treated Nanofibers as High Current Yielding Breath Humidity Sensors for Wearable Electronics
Iyengar, S. A., Srikrishnarka, P., Jana, S. K., Islam, M. R., Ahuja, T., Mohanty, J. S., & Pradeep, T. (2019) · ACS Applied Electronic Materials · doi:10.1021/acsaelm.9b00123 · Cited by 44 · see citing works
Nanbakhsh, K., Idil, A. S., Lamont, C. A., Dücső, C., Akgun, Ö. C., Horváth, D., Tóth, K., Meszéna, D., Ulbert, I., Mazza, F., et al. (2025) · Nature Communications · doi:10.1038/s41467-024-55298-4 · Cited by 43 · see citing works
Self-citationAn Electrochemical Impedance-Based Thermal Flow Sensor for Physiological Fluids
Baldwin, A., Yu, L., & Meng, E. F. (2016) · Journal of Microelectromechanical Systems · doi:10.1109/jmems.2016.2614664 · Cited by 43 · see citing works
Ceramic packaging in neural implants
Shen, K., & Maharbiz, M. M. (2020) · Journal of Neural Engineering · doi:10.1088/1741-2552/abd683 · Cited by 44 · see citing works
Fernández, E., Alfaro, A., & González-López, P. (2020) · Frontiers in Neuroscience · doi:10.3389/fnins.2020.00681 · Cited by 35 · see citing works
Caldwell, R., Mandal, H. S., Sharma, R., Solzbacher, F., Tathireddy, P., & Rieth, L. W. (2017) · Journal of Neural Engineering · doi:10.1088/1741-2552/aa69d3 · Cited by 36 · see citing works
Silicone rubber encapsulation for an endoscopically implantable gastrostimulator
Lonys, L., Vanhoestenberghe, A., Julémont, N., Godet, S., Delplancke, M., Mathys, P., & Nonclercq, A. (2015) · Medical & Biological Engineering & Computing · doi:10.1007/s11517-014-1236-9 · Cited by 30 · see citing works
Self-citationMechanical Properties of Thin-Film Parylene–Metal–Parylene Devices
Lee, C. D., & Meng, E. F. (2015) · Frontiers in Mechanical Engineering · doi:10.3389/fmech.2015.00010 · Cited by 29 · see citing works
Lamont, C., Grego, T., Nanbakhsh, K., Shah Idil, A., Giagka, V, Vanhoestenberghe, A., Cogan, S., & Donaldson, N. (2021) · Journal of Neural Engineering · doi:10.1088/1741-2552/abf0d6 · Cited by 28 · see citing works
Self-citationAn Implantable Versatile Electrode-Driving ASIC for Chronic Epidural Stimulation in Rats
Giagka, V., Eder, C. F., Donaldson, N., & Demosthenous, A. (2014) · IEEE Transactions on Biomedical Circuits and Systems · doi:10.1109/tbcas.2014.2330859 · Cited by 25 · see citing works
Self-citationRudmann, L., Langenmair, M., Hahn, B. P., Ordonez, J. S., & Stieglitz, T. (2020) · Sensors and Actuators B Chemical · doi:10.1016/j.snb.2020.128555 · Cited by 24 · see citing works
Circuit modeling of the electrical impedance: I. Neuromuscular disease
Shiffman, C. A., & Rutkove, S. B. (2013) · Physiological Measurement · doi:10.1088/0967-3334/34/2/203 · Cited by 24 · see citing works
Muruve, N. G. G., Cheng, Y. F., Feng, Y., Liu, T., Muruve, D. A., Hassett, D. J., & Irvin, R. T. (2016) · Materials Science and Engineering C · doi:10.1016/j.msec.2016.06.053 · Cited by 23 · see citing works
Design of Ceramic Packages for Ultrasonically Coupled Implantable Medical Devices
Shen, K., & Maharbiz, M. M. (2019) · IEEE Transactions on Biomedical Engineering · doi:10.1109/tbme.2019.2957732 · Cited by 22 · see citing works
Flexible active electrode arrays with ASICs that fit inside the rat’s spinal canal
Giagka, V., Demosthenous, A., & Donaldson, N. (2015) · Biomedical Microdevices · doi:10.1007/s10544-015-0011-5 · Cited by 22 · see citing works
Self-citationSaeidi, N., Schüettler, M., Demosthenous, A., & Donaldson, N. (2013) · Journal of Micromechanics and Microengineering · doi:10.1088/0960-1317/23/7/075021 · Cited by 22 · see citing works
Self-citationAdvances in Penetrating Multichannel Microelectrodes Based on the Utah Array Platform
Leber, M., Körner, J., Reiche, C. F., Yin, M., Bhandari, R., Franklin, R. K., Negi, S., & Solzbacher, F. (2019) · Advances in experimental medicine and biology · doi:10.1007/978-981-13-2050-7_1 · Cited by 22 · see citing works
Huang, X., Denprasert, P. M., Zhou, L., Vest, A. N., Kohan, S., & Loeb, G. E. (2017) · Biomedical Microdevices · doi:10.1007/s10544-017-0189-9 · Cited by 22 · see citing works
A Fully Implantable Opto-Electro Closed-Loop Neural Interface for Motor Neuron Disease Studies
Liu, F., Wu, Y., Almarri, N., Habibollahi, M., Lancashire, H. T., Bryson, J. B., Greensmith, L., Jiang, D., & Demosthenous, A. (2022) · IEEE Transactions on Biomedical Circuits and Systems · doi:10.1109/tbcas.2022.3202026 · Cited by 21 · see citing works
Electrochemical Investigation of PEDOT:PSS/Graphene Aging in Artificial Sweat
Tzaneva, B. R., Mateev, V. M., Stefanov, B. I., Aleksandrova, M. P., & Iliev, I. T. (2024) · Polymers · doi:10.3390/polym16121706 · Cited by 21 · see citing works
Human motion classification based on a textile integrated and wearable sensor array
Teichmann, D., Kuhn, A., Leonhardt, S. K., & Walter, M. (2013) · Physiological Measurement · doi:10.1088/0967-3334/34/9/963 · Cited by 21 · see citing works
Pak, A., Nanbakhsh, K., Hölck, O., Ritasalo, R., Sousa, M., Gompel, M. V., Pahl, B., Wilson, J., Kallmayer, C., & Giagka, V. (2022) · Micromachines · doi:10.3390/mi13040544 · Cited by 19 · see citing works
Wang, C., Fang, C., Zou, Y., Yang, J., & Sawan, M. (2023) · Journal of Neural Engineering · doi:10.1088/1741-2552/acb295 · Cited by 19 · see citing works
Non-hermetic encapsulation for implantable electronic devices based on epoxy
Boeser, F., Ordonez, J. S., Schüettler, M., Stieglitz, T., & Plachta, D. T. T. (2015) · Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC) · doi:10.1109/embc.2015.7318485 · Cited by 18 · see citing works
Research Progress in Corrosion Protection Technology for Electronic Components
Zhao, Q., Liu, X., Wang, H., Zhu, Y., An, Y., Yu, D., & Qi, J. (2023) · Metals · doi:10.3390/met13091508 · Cited by 17 · see citing works
Vėbraitė, I., & Hanein, Y. (2021) · Frontiers in Medical Technology · doi:10.3389/fmedt.2021.675744 · Cited by 16 · see citing works
A calorimetric flow sensor for ultra-low flow applications using electrochemical impedance
Baldwin, A., Hudson, T. Q., & Meng, E. F. (2018) · IEEE International Conference on Micro Electro Mechanical Systems (MEMS) · doi:10.1109/memsys.2018.8346562 · Cited by 16 · see citing works
Non-Hermetic Micropackage for Chronic Implantable Systems
Wang, P., Lachhman, S., Sun, D., Majerus, S. J. A., Damaser, M. S., Zorman, C. A., Feng, P. X. ‐., & Ko, W. H. (2013) · IMAPSource Proceedings · doi:10.4071/isom-2013-ta55 · Cited by 16 · see citing works
Bechtold, C., de Miranda, R. L., Chluba, C., & Quandt, E. (2016) · Biomedical Microdevices · doi:10.1007/s10544-016-0131-6 · Cited by 16 · see citing works
Nanbakhsh, K., Ritasalo, R., Serdijn, W. A., & Giagka, V. (2020) · IEEE Electronic Components and Technology Conference (ECTC) · doi:10.1109/ectc32862.2020.00081 · Cited by 16 · see citing works
An ASIC for Recording and Stimulation in Stacked Microchannel Neural Interfaces
Lancashire, H. T., Jiang, D., Demosthenous, A., & Donaldson, N. (2019) · IEEE Transactions on Biomedical Circuits and Systems · doi:10.1109/tbcas.2019.2891284 · Cited by 15 · see citing works
Self-citationNanbakhsh, K., Kluba, M., Pahl, B., Bourgeois, F., Dekker, R. H., Serdijn, W. A., & Giagka, V. (2019) · Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC) · doi:10.1109/embc.2019.8857702 · Cited by 15 · see citing works
Hermetic chip-scale packaging using Au:Sn eutectic bonding for implantable devices
Szostak, K. M., Keshavarz, M., & Constandinou, T. G. (2021) · Journal of Micromechanics and Microengineering · doi:10.1088/1361-6439/ac12a1 · Cited by 14 · see citing works
Baldwin, A., Yu, L., Pratt, M., Scholten, K., & Meng, E. F. (2017) · Biomedical Microdevices · doi:10.1007/s10544-017-0226-8 · Cited by 13 · see citing works
Ng, K. A., Rusly, A., Gammad, G. G. L., Le, N., Liu, S.-C., Leong, K.-W., Zhang, M., Ho, J. S., Yoo, J., & Yen, S. (2020) · IEEE Transactions on Biomedical Circuits and Systems · doi:10.1109/tbcas.2020.3009088 · Cited by 13 · see citing works
Soft Encapsulation of Flexible Electrical Stimulation Implant: Challenges and Innovations
Debelle, A., Hermans, L., Bosquet, M., Dehaeck, S., Lonys, L., Scheid, B., Nonclercq, A., & Vanhoestenberghe, A. (2016) · European Journal of Translational Myology · doi:10.4081/ejtm.2016.6298 · Cited by 12 · see citing works
Self-citationKoumya, Y., Idouhli, R., Zakir, O., Khadiri, M. E., Zaki, M., Karroumi, J. E., Aityoub, A., Abouelfida, A., & Benyaich, A. (2020) · Chemical Papers · doi:10.1007/s11696-020-01264-5 · Cited by 11 · see citing works
In Vivo Validation of a Less Invasive Gastrostimulator
Lonys, L., Vanhoestenberghe, A., Huberty, V., Hiernaux, M., Cauche, N., Julémont, N., Debelle, A., Huberland, F., Acuña, V., Godfraind, C., et al. (2017) · Artificial Organs · doi:10.1111/aor.13056 · Cited by 11 · see citing works
Self-citationIlic, E., Pardo, A., Hauert, R., Schmutz, P., & Mischler, S. (2019) · Journal of The Electrochemical Society · doi:10.1149/2.0241906jes · Cited by 11 · see citing works
Ceramic Packages for Acoustically Coupled Neural Implants
Shen, K., & Maharbiz, M. M. (2019) · International IEEE/EMBS Conference on Neural Engineering · doi:10.1109/ner.2019.8716923 · Cited by 12 · see citing works
Kiele, P., Čvančara, P., Langenmair, M., Mueller, M. C., & Stieglitz, T. (2020) · IEEE Transactions on Components Packaging and Manufacturing Technology · doi:10.1109/tcpmt.2020.3026583 · Cited by 11 · see citing works
Active Neural Interface Circuits and Systems for Selective Control of Peripheral Nerves: A Review
Habibollahi, M., Jiang, D., Lancashire, H. T., & Demosthenous, A. (2024) · IEEE Transactions on Biomedical Circuits and Systems · doi:10.1109/tbcas.2024.3430038 · Cited by 11 · see citing works
“Implant packaging methods to provide a biocompatiblity and corrosion protection through hermetic packages and coatings and non-hermetic encapsulants aim to offer device lifetimes of years to decades [213], [214], [215].”
Nanbakhsh, K., Gompel, M. V., Ritasalo, R., Gollhardt, A., Horváth, D., Tóth, K., Meszéna, D., Ulbert, I., Serdijn, W. A., & Giagka, V. (2025) · Small · doi:10.1002/smll.202410141 · Cited by 10 · see citing works
Fused silica microlenses for hermetic packages as part of implantable optrodes
Rudmann, L., Huber, S. D., Ordonez, J. S., & Stieglitz, T. (2015) · Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC) · doi:10.1109/embc.2015.7320039 · Cited by 10 · see citing works
A Chip Integrity Monitor for Evaluating Moisture/Ion Ingress in mm-Sized Single-Chip Implants
Akgun, Ö. C., Nanbakhsh, K., Giagka, V., & Serdijn, W. A. (2020) · IEEE Transactions on Biomedical Circuits and Systems · doi:10.1109/tbcas.2020.3007484 · Cited by 10 · see citing works
Distributed Neural Interfaces: Challenges and Trends in Scaling Implantable Technology
Szostak, K. M., Feng, P., Mazza, F., & Constandinou, T. G. (2021) · Handbook of Neuroengineering · doi:10.1007/978-981-15-2848-4_11-1 · Cited by 10 · see citing works
On Gas Ingression of Hermetic Packages
Fang, L., & Menk, L. A. (2019) · IEEE Transactions on Components Packaging and Manufacturing Technology · doi:10.1109/tcpmt.2019.2915164 · Cited by 10 · see citing works
Kasi, V., Rahman, M. M., Tien, J.-H., Rana, M. M., Vidhyadhiraja, A., Sarnaik, D., Heredia-Rivera, U., Bahr, D. F., & Rahimi, R. (2024) · Applied Materials Today · doi:10.1016/j.apmt.2024.102517 · Cited by 9 · see citing works
Bidirectional mechanisms and emerging strategies for implantable bioelectronic interfaces
Yan, Z., Gao, W., Duan, Y.-Y., Zhou, H., Ni, C., Huang, L., & Ye, Z. (2025) · Bioactive Materials · doi:10.1016/j.bioactmat.2025.06.014 · Cited by 11 · see citing works
Vapor‐Phase Synthesis of Poly(para‐xylylene): From Coatings to Porous and Hierarchical Materials
Hu, S., Lee, C., Ramli, T. C., Christy, J., Chang, Y., Lee, K. J., Chou, F., Chiang, Y., & Chen, H. (2024) · Advanced Functional Materials · doi:10.1002/adfm.202313511 · Cited by 9 · see citing works
Babaroud, N. B., Dekker, R. H., Serdijn, W. A., & Giagka, V. (2020) · Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC) · doi:10.1109/embc44109.2020.9175646 · Cited by 9 · see citing works
Reliability of Neural Implants—Effective Method for Cleaning and Surface Preparation of Ceramics
Kiele, P., Hergesell, J., Bühler, M., Boretius, T., Suaning, G. J., & Stieglitz, T. (2021) · Micromachines · doi:10.3390/mi12020209 · Cited by 9 · see citing works
Fluid Temperature Measurement in Aqueous Solution via Electrochemical Impedance
Baldwin, A., Yoon, E. J., Hudson, T. Q., & Meng, E. F. (2019) · Journal of Microelectromechanical Systems · doi:10.1109/jmems.2019.2939811 · Cited by 8 · see citing works
Zhang, J., Wang, Z., Luo, Y. W., Qian, L., He, C., Qi, N., Fang, P., Huang, Z. K., & Peng, X. (2020) · Journal of Materials Science Materials in Electronics · doi:10.1007/s10854-020-04867-6 · Cited by 8 · see citing works
An Implantable Stimulator With Safety Sensors in Standard CMOS Process for Active Books
Liu, X., Valente, V., Zong, Z., Jiang, D., Donaldson, N., & Demosthenous, A. (2016) · IEEE Sensors Journal · doi:10.1109/jsen.2016.2577688 · Cited by 8 · see citing works
Self-citationSzostak, K. M., & Constandinou, T. G. (2018) · Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC) · doi:10.1109/embc.2018.8513272 · Cited by 8 · see citing works
Jiang, D., Liu, F., Lancashire, H. T., Perkins, T. A., Schormans, M., Vanhoestenberghe, A., Donaldson, N., & Demosthenous, A. (2021) · Frontiers in Neuroscience · doi:10.3389/fnins.2021.681021 · Cited by 8 · see citing works
Self-citationThe Historical Foundations of Bionics
Donaldson, N., & Brindley, G. S. (2016) · doi:10.1002/9781118816028.ch1 · Cited by 8 · see citing works
Self-citationEffects of Soft Encapsulation on the Receive Performance of PMUTs for Implantable Devices
Velea, A. I., Panskus, R., Szabo, B., Oppelt, V., Holzapfel, L., Karuthedath, C. B., Sebastian, A. T., Stieglitz, T., Savoia, A. S., & Giagka, V. (2025) · IEEE Transactions on Ultrasonics Ferroelectrics and Frequency Control · doi:10.1109/tuffc.2025.3592740 · Cited by 7 · see citing works
Advances in Scalable Implantable Systems for Neurostimulation Using Networked ASICs
Liu, X., Zong, Z., Jiang, D., Bougaila, B., Donaldson, N., & Demosthenous, A. (2016) · IEEE Design and Test · doi:10.1109/mdat.2016.2533358 · Cited by 7 · see citing works
Self-citationDensity-functional-theory simulations of the water and ice adhesion on silicene quantum dots
Duan, T., Wu, W., & Choy, K. (2022) · Scientific Reports · doi:10.1038/s41598-022-11943-w · Cited by 7 · see citing works
Fabrication and modeling of recessed traces for silicon-based neural microelectrodes
Nolta, N. F., Ghelich, P., Ersöz, A., & Han, M. (2020) · Journal of Neural Engineering · doi:10.1088/1741-2552/abb9bd · Cited by 7 · see citing works
Sun, D. (2014) · OhioLink ETD Center (Ohio Library and Information Network) · Cited by 6 · see citing works
A Scalable, Low-Maintenance, Smart Water Quality Monitoring System
Malissovas, A., Narayan, N., Boonen, T., & Patki, S. (2022) · Proceedings of IEEE Sensors/Proceedings of IEEE Sensors ... · doi:10.1109/sensors52175.2022.9967336 · Cited by 6 · see citing works
Development of PMUT-Based High Sensitivity Gas Flow Sensor
Pernu, T., Sillanpää, T., Karuthedath, C. B., & Sebastian, A. T. (2023) · Journal of Microelectromechanical Systems · doi:10.1109/jmems.2023.3334497 · Cited by 5 · see citing works
Pires, D. G., Silva, N. M., de Sousa, B. M., Marques, J. L., Ramos, A. M., Ferreira, J., Morais, R., Vieira, S. I., & dos Santos, M. P. S. (2024) · Journal of The Royal Society Interface · doi:10.1098/rsif.2024.0279 · Cited by 5 · see citing works
Connors, P. F., Sur, D., Han, J., & Scully, J. R. (2025) · Materialia · doi:10.1016/j.mtla.2025.102495 · Cited by 5 · see citing works
Design and implementation of a less invasive gastrostimulator
Lonys, L., Vanhoestenberghe, A., Huberty, V., Hiernaux, M., Cauche, N., Julémont, N., Debelle, A., Huberland, F., Acuña, V., Godfraind, C., et al. (2016) · European Journal of Translational Myology · doi:10.4081/ejtm.2016.6019 · Cited by 5 · see citing works
Self-citationWen, Y. F., Demosthenous, A., Donaldson, N., & Liu, X. (2018) · IEEE International Symposium on Circuits and Systems proceedings · doi:10.1109/iscas.2018.8351269 · Cited by 5 · see citing works
Self-citationA diagnostic circuit for crosstalk detection in microelectrode arrays
McNamara, M., Ersoz, A., & Han, M. (2021) · 2021 10th International IEEE/EMBS Conference on Neural Engineering (NER) · doi:10.1109/ner49283.2021.9441164 · Cited by 5 · see citing works
Evaluation of Commercial Connectors for Active Neural Implants
Lancashire, H. T., Habibollahi, M., Jiang, D., & Demosthenous, A. (2021) · International IEEE/EMBS Conference on Neural Engineering · doi:10.1109/ner49283.2021.9441072 · Cited by 5 · see citing works
Preclinical testing of Neural Prostheses
McCreery, D. B. (2016) · doi:10.1002/9781118816028.ch6 · Cited by 5 · see citing works
Corrections to Graham’s Law of Effusion for Predicting Leak Rates Through Hermetic Seals
Lim, W. W., McKenzie, D. R., & Suaning, G. J. (2017) · IEEE Transactions on Components Packaging and Manufacturing Technology · doi:10.1109/tcpmt.2017.2647738 · Cited by 5 · see citing works
Liu, F., Habibollahi, M., Wu, Y., Neshatvar, N., Zhang, J., Zinno, C., Akouissi, O., Bernini, F., Alibrandi, L., Gabisonia, K., et al. (2024) · Bioelectronic Medicine · doi:10.1186/s42234-024-00148-3 · Cited by 4 · see citing works
Akgun, Ö. C., Nanbakhsh, K., Giagka, V., & Serdijn, W. A. (2019) · IEEE Biomedical Circuits and Systems Conference (BioCAS) · doi:10.1109/biocas.2019.8919203 · Cited by 4 · see citing works
Retinal Prostheses: A Brief History
Yue, L., Weiland, J. D., & Humayun, M. S. (2017) · Essentials in ophthalmology/Essentials ophthalmology · doi:10.1007/978-3-319-67260-1_1 · Cited by 4 · see citing works
Cytotoxicity of Catalysed Silicone Resin Coatings for Smart Biomedical Devices
Werner, V. M. K., Kist, A., & Eblenkamp, M. (2019) · Current Directions in Biomedical Engineering · doi:10.1515/cdbme-2019-0042 · Cited by 4 · see citing works
The Human Body: A Special Environment
Clément, C. (2019) · Springer eBooks · doi:10.1007/978-3-030-27852-6_4 · Cited by 4 · see citing works
A Strain Gauge-Based Implantable Bladder Volume Monitoring Sensor
Verstraeten, M., Kheir, G. B., Sandersen, C., Perre, L. V., Raffoul, R., Cerda, J. C., Roumeguère, T., Vanhoestenberghe, A., & Nonclercq, A. (2024) · IEEE International Symposium on Medical Measurements and Applications (MeMeA) · doi:10.1109/memea60663.2024.10596896 · Cited by 3 · see citing works
Self-citationIntegrated Devices for Micro-Package Integrity Monitoring in mm-Scale Neural Implants
Mazza, F., Liu, Y., Donaldson, N., & Constandinou, T. G. (2018) · IEEE Biomedical Circuits and Systems Conference (BioCAS) · doi:10.1109/biocas.2018.8584761 · Cited by 3 · see citing works
Self-citation
- Authors
- Vanhoestenberghe, A., & Donaldson, N.
- Affiliations
- University College London (GB)
- Venue
- Journal of Neural Engineering
- Publisher
- IOP Publishing
- Published
- 2013-05-20
- Volume
- 10
- Issue
- 3
- Pages
- 031002
- ISSN
- 1741-2552 (ISSN-L)
- 1741-2560
- OpenAlex
- W1987796903
- Cited by
- 140
- References
- 57
- Citations by year
- 2026: 6 · 2025: 9 · 2024: 11 · 2023: 10 · 2022: 6 · 2021: 11 · 2020: 18 · 2019: 19 · 2018: 12 · 2017: 7 · 2016: 12 · 2015: 7 · 2014: 7 · 2013: 4
- FWCI
- 1.02
- Type
- journal article
- Language
- en
- Open access
- green
- discovery.ucl.ac.uk
- Licence
- Locations
- Journal of Neural Engineering (publishedVersion)
- PubMed (publishedVersion)
- UCL Discovery (University College London) (submittedVersion)
- Funders
- European Commission (258654)
- Engineering and Physical Sciences Research Council (EP/F009593/1)
- Topics
- Life Sciences › Neuroscience › Cellular and Molecular Neuroscience › Neuroscience and Neural Engineering
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
- Physical Sciences › Engineering › Biomedical Engineering › Wireless Body Area Networks
- Keywords
- corrosion, silicon integrated circuits, implantable electronics, hermetic packaging, encapsulation, lifetime prediction, accelerated testing, acceleration factor, relative humidity, temperature effects, field strength, moisture protection
- MeSH terms
- Corrosion, Electronics, Medical, Materials Testing, Semiconductors, Silicon, Equipment Failure Analysis, Prostheses and Implants, Coated Materials, Biocompatible
About these checks
Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
What counts as a claim ›How we measure confidence ›How we check this ›
Are you an author, or do you see a problem with this page? Request a review
