Cited by 884Neuroscience and Neural EngineeringAnalog and Mixed-Signal Circuit DesignAdvanced MEMS and NEMS Technologies

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A silicon-based, three-dimensional neural interface: manufacturing processes for an intracortical electrode array

Campbell, P.K., Jones, K.E., Huber, R.J., Horch, K.W., Normann, R.A.·1991·IEEE Transactions on Biomedical Engineering

DOI 10.1109/10.83588

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Abstract

A method has been developed for the manufacture of a "three-dimensional" electrode array geometry for chronic intracortical stimulation. This silicon based array consists of a 4.2 x 4.2 x 0.12 mm thick monocrystalline substrate, from which project 100 conductive, silicon needles sharpened to facilitate cortical penetration. Each needle is electrically isolated from the other needles, and is about 0.09 mm thick at its base and 1.5 mm long. The sharpened end of each needle is coated with platinum to facilitate charge transfer into neural tissue. The following manufacturing processes were used to create this array. 1) Thermomigration of 100 aluminum pads through an n-type silicon block. This creates trails of highly conductive p+ silicon isolated from each other by opposing pn junctions. 2) A combination of mechanical and chemical micromachining which creates individual penetrating needles of the p+ silicon trails. 3) Metal deposition to create active electrode areas and electrical contact pads. 4) Array encapsulation with polyimide. The geometrical, mechanical, and electrical properties of these arrays should make them well suited as interfaces to cortical tissue.

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Authors: Campbell, P. K., Jones, K. E., Huber, R. J., Horch, K. W., & Normann, R. A.
Affiliations: University of Utah (US)
Venue: IEEE Transactions on Biomedical Engineering
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Published: 1991
Volume: 38
Issue: 8
Pages: 758-768
ISSN: 0018-9294 (ISSN-L)
DOI: 10.1109/10.83588
OpenAlex: W2111937020
Cited by: 881
References: 24
Citations by year: 2026: 21 · 2025: 29 · 2024: 41 · 2023: 24 · 2022: 35 · 2021: 32 · 2020: 40 · 2019: 39 · 2018: 34 · 2017: 41 · 2016: 36 · 2015: 41 · 2014: 43 · 2013: 56 · 2012: 41
FWCI: 1.70
Type: journal article
Language: en
Open access: closed
Licence: ieeexplore.ieee.org/Xplorehelp/downloads/license-information/IEEE.html (vor)
Locations: IEEE Transactions on Biomedical Engineering (publishedVersion)
PubMed (publishedVersion)
Topics: Life Sciences › Neuroscience › Cellular and Molecular Neuroscience › Neuroscience and Neural Engineering
Physical Sciences › Engineering › Electrical and Electronic Engineering › Analog and Mixed-Signal Circuit Design
Physical Sciences › Engineering › Electrical and Electronic Engineering › Advanced MEMS and NEMS Technologies
Keywords: neural interfaces, thermomigration, p+ silicon, micromachining, platinum coating, polyimide encapsulation, monocrystalline silicon substrate, galvanic isolation
MeSH terms: Animals, Biocompatible Materials, Cats, Electric Conductivity, Electric Stimulation, Electrodes, Implanted, Materials Testing, Microscopy, Electron, Scanning, Silicon, Somatosensory Cortex, Reproducibility of Results

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A silicon-based, three-dimensional neural interface: manufacturing processes for an intracortical electrode array

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