The DOI matches its Crossref record; 23 of the 24 references it cites were found in a registry or an index.
Understanding BTI in SiC MOSFETs and Its Impact on Circuit Operation
Abstract
The threshold voltage hysteresis in SiC power MOSFETs is rarely studied. This paper investigates the captureand emission-time constants of positive and negative charge trapped in the gate oxide and at the interface as a function of gate bias. We present a measurement technique which enables time-resolved measurement of the real Vthduring applicationrelevant bipolar ac high temperature gate stress. In addition, we use capture and emission time maps to explain the temperature dependence of AVthafter stress and are able to simulate ΔVthafter positive ac stress considering the full stress-history. Furthermore, we will show that the threshold voltage hysteresis has no harmful impact on switching operation in real applications.
Overview
Integrity signals
Registry
Cites
Statistics
Verification
Claims the paper makes
Claims other papers make about this one
Each is checked against this paper’s own text: does it say what the citing paper says it does?
In the citing paper
“Online monitoring of the threshold voltage needs to be fast to capture recoverable Vth due to high interface state densities [65].”
From AC Power Cycling Test Setup and Condition Monitoring Tools for SiC-Based Traction Inverters (2023) · cites this paper as [65]
Citations
Cites
Material Science and Device Physics in SiC Technology for High-Voltage Power Devices
Kimoto, T. (2015) · Japanese Journal of Applied Physics · doi:10.7567/jjap.54.040103 · Cited by 1,176
Lelis, A. J., Green, R., Habersat, D. B., & El, M. (2015) · IEEE Transactions on Electron Devices · doi:10.1109/ted.2014.2356172 · Cited by 477
Grasser, T., Reisinger, H., Wagner, P.-J., Schanovsky, F., Goes, W., & Kaczer, B. (2010) · IEEE International Reliability Physics Symposium proceedings · doi:10.1109/irps.2010.5488859 · Cited by 296
Self-citationSilicon carbide: A unique platform for metal-oxide-semiconductor physics
Liu, G., Tuttle, B., & Dhar, S. (2015) · Applied Physics Reviews · doi:10.1063/1.4922748 · Cited by 293
Analysis of NBTI Degradation- and Recovery-Behavior Based on Ultra Fast VT-Measurements
Reisinger, H., Blank, O., Heinrigs, W., Muehlhoff, A., Gustin, W., & Schlünder, C. (2006) · IEEE International Reliability Physics Symposium proceedings · doi:10.1109/relphy.2006.251260 · Cited by 282
Self-citationReisinger, H., Grasser, T., Gustin, W., & Schlünder, C. (2010) · IEEE International Reliability Physics Symposium proceedings · doi:10.1109/irps.2010.5488858 · Cited by 205
Self-citationAnalytic modeling of the bias temperature instability using capture/emission time maps
Grasser, T., Wagner, P.-J., Reisinger, H., Aichinger, T., Gregor Pobegen, A., Nelhiebel, M., & Kaczer, B. (2011) · Technical digest - International Electron Devices Meeting/Technical digest · doi:10.1109/iedm.2011.6131624 · Cited by 184
Self-citationUnderstanding and modeling AC BTI
Reisinger, H., Grasser, T., Ermisch, K., Nielen, H., Gustin, W., & Schlünder, C. (2011) · IEEE International Reliability Physics Symposium proceedings · doi:10.1109/irps.2011.5784542 · Cited by 108
Self-citationRecent advances in understanding the bias temperature instability
Grasser, T., Kaczer, B., Goes, W., Reisinger, H., Aichinger, T., Hehenberger, P., Wagner, P.-J., Schanovsky, F., Franco, J., Roussel, P. J., et al. (2010) · Technical digest - International Electron Devices Meeting/Technical digest · doi:10.1109/iedm.2010.5703295 · Cited by 107
Self-citationThreshold-voltage bias-temperature instability in commercially-available SiC MOSFETs
Green, R., Lelis, A. J., & Habersat, D. B. (2016) · Japanese Journal of Applied Physics · doi:10.7567/jjap.55.04ea03 · Cited by 87
Research works printed but not linked: 1
- 2011, CPWR-AN08 Application Considerations for SiC MOSFETs
Cited by
Sorted by citations
Review on SiC MOSFETs High-Voltage Device Reliability Focusing on Threshold Voltage Instability
Puschkarsky, K., Grasser, T., Aichinger, T., Gustin, W., & Reisinger, H. (2019) · IEEE Transactions on Electron Devices · doi:10.1109/ted.2019.2938262 · Cited by 219
Self-citationShi, B., Ramones, A. I., Liu, Y., Wang, H., Li, Y., Pischinger, S., & Andert, J. (2023) · IET Power Electronics · doi:10.1049/pel2.12524 · Cited by 177
Evaluation of Aging's Effect on Temperature-Sensitive Electrical Parameters in SiC mosfets
Yang, F., Ugur, E., & Akin, B. (2020) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2019.2950311 · Cited by 121
Farhadi, M., Yang, F., Pu, S., Vankayalapati, B. T., & Akin, B. (2021) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2021.3049394 · Cited by 93
A Novel Non-Intrusive Technique for BTI Characterization in SiC mosfets
Gonzalez, J. A. O., & Alatise, O. M. (2018) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2018.2870067 · Cited by 82
A Physical Explanation of Threshold Voltage Drift of SiC MOSFET Induced by Gate Switching
Jiang, H., Qi, X., Qiu, G., Zhong, X., Tang, L. J., Mao, H., Wu, Z., Chen, H., & Ran, L. (2022) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2022.3161678 · Cited by 76
Design Methodology of DC Power Cycling Test Setup for SiC MOSFETs
Yang, F., Uğur, E., & Akin, B. (2019) · IEEE Journal of Emerging and Selected Topics in Power Electronics · doi:10.1109/jestpe.2019.2914419 · Cited by 62
Gonzalez, J. A. O., & Alatise, O. M. (2020) · IEEE Transactions on Industry Applications · doi:10.1109/tia.2020.3045120 · Cited by 57
Deng, X., Huang, W., Li, X., Li, X., Chen, C., Wen, Y., Ding, J., Chen, W., Sun, Y., & Zhang, B. (2022) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2022.3163930 · Cited by 56
Understanding and modeling transient threshold voltage instabilities in SiC MOSFETs
Puschkarsky, K., Grasser, T., Aichinger, T., Gustin, W., & Reisinger, H. (2018) · IEEE International Reliability Physics Symposium proceedings · doi:10.1109/irps.2018.8353560 · Cited by 56
Self-citationTowards Understanding the Physics of Gate Switching Instability in Silicon Carbide MOSFETs
Feil, M. W., Waschneck, K., Reisinger, H., Berens, J., Aichinger, T., Salmen, P., Rescher, G., Gustin, W., & Grasser, T. (2023) · IEEE International Reliability Physics Symposium proceedings · doi:10.1109/irps48203.2023.10117740 · Cited by 45
Self-citationHofstetter, P., Maier, R. W., & Bakran, M. (2019) · Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition · doi:10.1109/apec.2019.8721772 · Cited by 42
Gonzalez, J. A. O., & Alatise, O. M. (2020) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2020.3012298 · Cited by 42
Investigation on Degradation of SiC MOSFET Under Accelerated Stress in a PFC Converter
Jiang, X., Wang, J., Chen, J., Yu, H., Li, Z., & John Shen, Z. (2021) · IEEE Journal of Emerging and Selected Topics in Power Electronics · doi:10.1109/jestpe.2020.2988447 · Cited by 39
Device Screening Strategy for Suppressing Current Imbalance in Parallel-Connected SiC MOSFETs
Zhao, B., Yu, Q., Sun, P., Cai, Y., & Zhao, Z. (2021) · IEEE Transactions on Device and Materials Reliability · doi:10.1109/tdmr.2021.3116458 · Cited by 37
Wang, M., Chen, Y., He, Z., Wu, Z., & Li, B. (2023) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2023.3257885 · Cited by 35
Xin, J., Du, M., Ouyang, Z., & Wei, K. (2021) · IEEE Transactions on Electron Devices · doi:10.1109/ted.2021.3056634 · Cited by 35
The Potential of SiC Cascode JFETs in Electric Vehicle Traction Inverters
Wu, R., Gonzalez, J. A. O., Davletzhanova, Z., Mawby, P., & Alatise, O. M. (2019) · IEEE Transactions on Transportation Electrification · doi:10.1109/tte.2019.2954654 · Cited by 33
Modeling of NBTS Effects in P-Channel Power VDMOSFETs
Danković, D., Mitrović, N., Prijić, Z., & Stojadinović, N. (2020) · IEEE Transactions on Device and Materials Reliability · doi:10.1109/tdmr.2020.2974131 · Cited by 30
Farhadi, M., Vankayalapati, B. T., Sajadi, R., & Akin, B. (2023) · IEEE Transactions on Transportation Electrification · doi:10.1109/tte.2023.3265386 · Cited by 31
Dynamic Reliability Management in Neuromorphic Computing
Song, S., Hanamshet, J., Balaji, A., Das, A. K., Krichmar, J. L., Dutt, N. D., Kandasamy, N., & Catthoor, F. (2021) · ACM Journal on Emerging Technologies in Computing Systems · doi:10.1145/3462330 · Cited by 29
Zhao, B., Sun, P., Yu, Q., Cai, Y., & Zhao, Z. (2021) · IEEE Transactions on Device and Materials Reliability · doi:10.1109/tdmr.2021.3101719 · Cited by 27
Kempiak, C., & Lindemann, A. (2020) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2020.3039424 · Cited by 29
Shi, L., Qian, J., Jin, M., Bhattacharya, M., Yu, H., Shimbori, A., White, M. H., & Agarwal, A. K. (2024) · Materials Science in Semiconductor Processing · doi:10.1016/j.mssp.2024.108194 · Cited by 24
AC Power Cycling Test Setup and Condition Monitoring Tools for SiC-Based Traction Inverters
Farhadi, M., Vankayalapati, B. T., Sajadi, R., & Akin, B. (2023) · IEEE Transactions on Vehicular Technology · doi:10.1109/tvt.2023.3271251 · Cited by 24
“Online monitoring of the threshold voltage needs to be fast to capture recoverable V th due to high interface state densities [65].”
BackgroundGonzalez, J. A. O., & Alatise, O. M. (2018) · IEEE Energy Conversion Congress and Exposition (ECCE) · doi:10.1109/ecce.2018.8557810 · Cited by 25
Investigation of Reverse Recovery Phenomenon for SiC MOSFETs in High-Temperature Applications
Qian, C., Wang, Z., Zhou, D., Ge, Y., Zhou, Y., Yan, X., Xin, G., & Shi, X. (2023) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2023.3273351 · Cited by 23
Noguchi, M., Koyama, A., Iwamatsu, T., Amishiro, H., WATANABE, H. K., & Miura, N. (2020) · Technical digest - International Electron Devices Meeting/Technical digest · doi:10.1109/iedm13553.2020.9371992 · Cited by 22
Plasma passivation of near-interface oxide traps and voltage stability in SiC MOS capacitors
Sun, Y., Yang, C., Yin, Z., Qin, F., & Wang, D. (2019) · Journal of Applied Physics · doi:10.1063/1.5084759 · Cited by 22
Challenges of Junction Temperature Sensing in SiC Power MOSFETs
Gonzalez, J. A. O., & Alatise, O. M. (2019) · International Conference on Power Electronics and ECCE Asia (ICPE-ECCE Asia) · doi:10.23919/icpe2019-ecceasia42246.2019.8797281 · Cited by 21
Studies of Bias Temperature Instabilities in 4H-SiC DMOSFETs
Ghosh, A. K., Hao, J., Cook, M., Kendrick, C., Suliman, S. A., Hall, G. D. R., Kopley, T., & Awadelkarim, O. O. (2020) · IEEE International Reliability Physics Symposium proceedings · doi:10.1109/irps45951.2020.9128318 · Cited by 21
Three-phase SiC inverter with active limitation of all MOSFETs junction temperature
Stella, F., Pellegrino, G., & Armando, E. G. (2020) · Microelectronics Reliability · doi:10.1016/j.microrel.2020.113659 · Cited by 20
Alatise, O. M., Deb, A., Bashar, E., Gonzalez, J. A. O., Jahdi, S., & Issa, W. R. (2023) · Energies · doi:10.3390/en16114380 · Cited by 21
Investigation on the Degradation Mechanism for SiC Power MOSFETs Under Repetitive Switching Stress
Wei, J., Liu, S., Lou, R., Tang, L., Ye, R., Zhang, L., Zhang, X., Sun, W., & Bai, S. (2019) · IEEE Journal of Emerging and Selected Topics in Power Electronics · doi:10.1109/jestpe.2019.2948836 · Cited by 20
Thermomechanical behaviour of inverse diode in SiC MOSFETs under surge current stress
Palanisamy, S., Lutz, J., Boldyrjew-Mast, R., & Basler, T. (2020) · IEEE International Reliability Physics Symposium proceedings · doi:10.1109/irps45951.2020.9129286 · Cited by 19
Chen, C., Wang, Z., Ye, X., Hu, Y., Wang, H., Chen, H., & Leon, J. I. (2024) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2024.3490172 · Cited by 18
Feil, M. W., Reisinger, H., Kabakow, A., Aichinger, T., Schleich, C., Vasil'ev, A. V., Waldhoer, D., Waltl, M., Gustin, W., & Grasser, T. (2023) · Communications Engineering · doi:10.1038/s44172-023-00053-8 · Cited by 18
Self-citationReliability and reliability investigation of wide-bandgap power devices
Lutz, J., & Franke, J. (2018) · Microelectronics Reliability · doi:10.1016/j.microrel.2018.07.001 · Cited by 18
Zhao, B., Ke, J., Yu, Q., Sun, P., Cai, Y., & Zhao, Z. (2021) · IET Power Electronics · doi:10.1049/pel2.12211 · Cited by 17
Investigation of Threshold Voltage Instability of SiC MOSFETs Under Different Gate Voltage Sequences
Chen, Y., Rao, Y., Wang, M., Gao, R., He, Z., Chen, Y., & Lai, P. (2024) · IEEE Transactions on Electron Devices · doi:10.1109/ted.2024.3365776 · Cited by 17
Gate Oxide Instability against a Wide Range of Negative Electric Field Stress of SiC MOSFETs
Noguchi, M., Koyama, A., Iwamatsu, T., Watanabe, H., & Miura, N. (2021) · Technical digest - International Electron Devices Meeting/Technical digest · doi:10.1109/iedm19574.2021.9720679 · Cited by 16
On the Physical Meaning of Single-Value Activation Energies for BTI in Si and SiC MOSFET Devices
Feil, M. W., Puschkarsky, K., Gustin, W., Reisinger, H., & Grasser, T. (2020) · IEEE Transactions on Electron Devices · doi:10.1109/ted.2020.3036321 · Cited by 16
Self-citationWatanabe, T., Fukui, Y., Hino, S., Tomohisa, S., Miura, N., & Nishikawa, K. (2023) · IEEE Transactions on Device and Materials Reliability · doi:10.1109/tdmr.2023.3234979 · Cited by 15
Working principle and characteristic analysis of SiC MOSFET
Yao, J. (2023) · Journal of Physics Conference Series · doi:10.1088/1742-6596/2435/1/012022 · Cited by 15
Investigation of Aging’s Effect on the Conduction and Switching Loss in SiC MOSFETs
Yang, F., Uğur, E., Pu, S., Akin, B., & Das, M. K. (2019) · IEEE Energy Conversion Congress and Exposition (ECCE) · doi:10.1109/ecce.2019.8912284 · Cited by 15
Gate Oxide Instability of 4H-SiC p-Channel MOSFET Induced by AC Stress at 200 °C
Yang, L., Bai, Y., Li, C., Yang, C., Chen, H., Tang, Y., Hao, J., Tian, X., & Liu, X. (2022) · IEEE Transactions on Electron Devices · doi:10.1109/ted.2022.3224638 · Cited by 14
Dynamic characterization of SiC and GaN devices with BTI stresses
Gonzalez, J. A. O., Hedayati, M. H., Jahdi, S., Stark, B. H., & Alatise, O. M. (2019) · Microelectronics Reliability · doi:10.1016/j.microrel.2019.06.081 · Cited by 14
Mandrile, F., Stella, F., Carpaneto, E., & Bojoi, R. I. (2022) · IEEE Journal of Emerging and Selected Topics in Power Electronics · doi:10.1109/jestpe.2022.3154488 · Cited by 14
Habersat, D. B., Green, R., & Lelis, A. J. (2019) · IEEE International Reliability Physics Symposium proceedings · doi:10.1109/irps.2019.8720538 · Cited by 13
BTI saturation and universal relaxation in SiC power MOSFETs
Sánchez, L., Acurio, E., Crupi, F., Reggiani, S., & Meneghesso, G. (2020) · Microelectronics Reliability · doi:10.1016/j.microrel.2020.113642 · Cited by 11
Chip Screening Method for Suppressing Current Imbalance of Parallel-Connected SiC MOSFETs
Zhao, B., Sun, P., Yu, Q., Cai, Y., Cai, J., & Zhao, Z. (2021) · International Conference on Energy, Electrical and Power Engineering (CEEPE) · doi:10.1109/ceepe51765.2021.9475791 · Cited by 10
Impact of Duty Cycle and Junction Temperature on Dynamic Threshold Drift of SiC MOSFET
Xu, C., Zhong, X., Jiang, H., Qiu, G., Tang, L. J., & Ran, L. (2021) · International Conference on Energy, Electrical and Power Engineering (CEEPE) · doi:10.1109/ceepe51765.2021.9475706 · Cited by 9
Recovery of Quasi-Permanent Bias Temperature Instability in SiC MOSFETs and Its Physical Mechanism
Li, K., Sun, P., He, Z., Huang, X., Li, Q., Chen, L., Luo, Q., & Du, X. (2024) · IEEE Journal of Emerging and Selected Topics in Power Electronics · doi:10.1109/jestpe.2024.3394476 · Cited by 9
Characterization of Oxide Trapping in SiC MOSFETs Under Positive Gate Bias
Liang, Y., Zhang, Y., Zhang, J., He, X., Zhao, Y., Cui, M., Wen, H., Wang, M., & Liu, W. (2022) · IEEE Journal of the Electron Devices Society · doi:10.1109/jeds.2022.3212697 · Cited by 9
Pan, W., Jian, L., & Liu, T. (2022) · Technology Analysis and Strategic Management · doi:10.1080/09537325.2022.2106419 · Cited by 9
Jiang, J., Tang, X., Tan, K., Hu, Z., Tian, M., Xu, Y., Li, H., Zhu, W., Li, H., Hu, C., et al. (2024) · IEEE Transactions on Electron Devices · doi:10.1109/ted.2024.3403956 · Cited by 8
Characterization of BTI in SiC MOSFETs Using Third Quadrant Characteristics
Gonzalez, J. A. O., Alatise, O. M., & Mawby, P. (2019) · IEEE International Symposium on Power Semiconductor Devices and ICs/Proceedings of the International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices and ICs · doi:10.1109/ispsd.2019.8757624 · Cited by 8
Habersat, D. B., Lelis, A. J., & Green, R. (2019) · Materials science forum · doi:10.4028/www.scientific.net/msf.963.757 · Cited by 8
Fast Switching SiC Cascode JFETs for EV Traction Inverters
Wu, R., Gonzalez, J. A. O., Davletzhanova, Z., Mawby, P., & Alatise, O. M. (2020) · Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition · doi:10.1109/apec39645.2020.9124052 · Cited by 8
Aging Modeling and Simulation of the Gate Switching Instability Degradation in SiC MOSFETs
García-Meré, J. R., Gómez, A. A., Roig, J., Rodríguez, J., & Rodríguez, A. (2024) · Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition · doi:10.1109/apec48139.2024.10509430 · Cited by 7
Characteristics and mechanisms of subthreshold voltage hysteresis in 4H-SiC MOSFETs*
Chen, X., Shi, B., Li, X., Fan, H.-Y., Li, C.-Z., Deng, X., Luo, H., Wu, Y., & Zhang, B. (2020) · Chinese Physics B · doi:10.1088/1674-1056/abd391 · Cited by 7
Package Degradation’s Impact on SiC MOSFETs Loss: A Comparison of Kelvin and Non-Kelvin Designs
Yang, F., Pu, S., Akin, B., Butler, S. W., & Wang, G. (2021) · Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition · doi:10.1109/apec42165.2021.9487466 · Cited by 7
Kestler, T., & Bakran, M. (2019) · European Conference on Power Electronics and Applications · doi:10.23919/epe.2019.8915530 · Cited by 7
Characterization and Modeling of BTI in SiC MOSFETs
Cornigli, D., Tallarico, A. N., Reggiani, S., Fiegna, C., SANGIORGI, E., Sanchez, L., Valdivieso, C., Consentino, G., & Crupi, F. (2019) · European Solid-State Device Research Conference · doi:10.1109/essderc.2019.8901761 · Cited by 7
TCAD modeling of bias temperature instabilities in SiC MOSFETs
Carangelo, G., Reggiani, S., Consentino, G., Crupi, F., & Meneghesso, G. (2021) · Solid-State Electronics · doi:10.1016/j.sse.2021.108067 · Cited by 6
Dhyani, M., Singh, S., Tzhayek, N., & Bernstein, J. B. (2025) · Micromachines · doi:10.3390/mi16121351 · Cited by 5
Race, S., Nagel, M., Brandl, A. K., Kovacevic-Badstuebner, I., Popescu, D., Popescu, B., & Großner, U. (2024) · IEEE International Symposium on Power Semiconductor Devices and ICs/Proceedings of the International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices and ICs · doi:10.1109/ispsd59661.2024.10579681 · Cited by 5
Li, K., Sun, P., Zhou, X., Chen, L., & Liu, Q. (2024) · IEEE Journal of Emerging and Selected Topics in Power Electronics · doi:10.1109/jestpe.2024.3485055 · Cited by 4
Boldyrjew-Mast, R., Herrmann, C., Liu, X., Li, X., & Basler, T. (2025) · IEEE International Reliability Physics Symposium proceedings · doi:10.1109/irps48204.2025.10983112 · Cited by 6
Bernstein, J. B., Avraham, T., & Wang, B. (2026) · Micromachines · doi:10.3390/mi17030320 · Cited by 4
Lifetime projection for BTI assuming non-constant power law exponent
Bernstein, J. B. (2026) · Microelectronics Reliability · doi:10.1016/j.microrel.2026.116147 · Cited by 4
Ma, X., Wang, J., & Ding, L. (2023) · Journal of Power Electronics · doi:10.1007/s43236-023-00711-2 · Cited by 4
Dynamic Reverse Bias Test Circuit for SiC MOSFET with Adjustable dV ds/dt
Lu-Wei, Z., Hui, M., Zhou, Z., Yu, B., Haoze, L., & Xin, Z. (2024) · International Power Electronics and Motion Control Conference (EPE-PEMC) · doi:10.1109/ipemc-ecceasia60879.2024.10567430 · Cited by 4
Boldyrjew-Mast, R., Bäumler, C., Wenisch-Kober, F. B., Liu, X., & Basler, T. (2022) · IEEE International Symposium on Power Semiconductor Devices and ICs/Proceedings of the International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices and ICs · doi:10.1109/ispsd49238.2022.9813675 · Cited by 4
Online Monitoring Method for SiC MOSFET Gate Oxide Degradation Based on Gate Voltage Filtering
Liu, J., Yao, B., Wei, X., Zhang, Y., & Wang, H. (2024) · Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition · doi:10.1109/apec48139.2024.10509036 · Cited by 4
Gonzalez, J. A. O., & Alatise, O. M. (2019) · European Conference on Power Electronics and Applications · doi:10.23919/epe.2019.8915508 · Cited by 4
Liao, P., Wang, Y., Guo, J.-B., Sun, Q., Zhang, D. W., & Xu, H. (2025) · IEEE Transactions on Device and Materials Reliability · doi:10.1109/tdmr.2025.3649972 · Cited by 3
Power-Law Degradation and Lifetime Interpretation in Microelectronics Reliability
Bernstein, J. B. (2026) · Applied Sciences · doi:10.3390/app16115387 · Cited by 3
Threshold Voltage Monitoring Method for SiC MOSFET Based on Body Diode Voltage under Body Effect
Xin, J., Zheng, L., Dai, Q., Du, M., Ouyang, Z., & Zhou, E. (2021) · IEEE International Electrical and Energy Conference (CIEEC) · doi:10.1109/cieec50170.2021.9510634 · Cited by 3
On the origin of drain current transients and subthreshold sweep hysteresis in 4H-SiC MOSFETs
Rasinger, F., Hauck, M., Rescher, G., Aichinger, T., Weber, H. B., Krieger, M., & Gregor Pobegen, A. (2019) · Applied Physics Letters · doi:10.1063/1.5117829 · Cited by 3
Self-citationGonzalez, J. A. O., Alatise, O. M., & Mawby, P. (2020) · IEEE International Reliability Physics Symposium proceedings · doi:10.1109/irps45951.2020.9129637 · Cited by 3
Decoupling Effects for Dynamic Switching Stress in SiC MOSFETs
Gómez, A. A., García-Meré, J. R., Rodríguez, A., Rodríguez, J., Jiménez-Guerra, C., & Roig, J. (2025) · IEEE Transactions on Industry Applications · doi:10.1109/tia.2025.3534183 · Cited by 2
Wang, Z., Chen, C., Ye, X., Du, J., Niu, H., Zhai, G., Alcaide, A. M., Leon, J. I., & Franquelo, L. G. (2025) · IEEE Transactions on Device and Materials Reliability · doi:10.1109/tdmr.2025.3604592 · Cited by 2
Trade-offs Between Gate Oxide Protection and Performance in SiC MOSFETs
Gonzalez, J. A. O., Wu, R., & Alatise, O. M. (2020) · IEEE Energy Conversion Congress and Exposition (ECCE) · doi:10.1109/ecce44975.2020.9235843 · Cited by 2
Physical Modeling of Threshold Voltage Shift during Recovery Phase in SiC-based Transistors
Mao, L. (2025) · Semiconductors · doi:10.1134/s1063782624602930 · Cited by 2
Bias-Induced Instability of 4H-SiC CMOS
Wen, Y. X., & Tsui, B. Y. (2023) · Materials science forum · doi:10.4028/p-t5m16p · Cited by 2
Novel Method for Evaluation of Negative Bias Temperature Instability of SiC MOSFETs
Gonzalez, J. A. O., Alatise, O. M., & Mawby, P. (2019) · Materials science forum · doi:10.4028/www.scientific.net/msf.963.749 · Cited by 2
Investigation of Threshold Voltage Shift for SiC MOSFET in Switching Operation
Jin, R., Ren, N., Xu, H., & Sheng, K. (2023) · IEEE International Power Electronics and Application Symposium (PEAS) · doi:10.1109/peas58692.2023.10395298 · Cited by 1
Investigations of Off-line Calibration and Consistency of SiC MOSFETs with Different Gate Structures
Liao, Y., Xu, Z., Wang, H., Ge, X., & Wang, Y. (2024) · International Power Electronics and Motion Control Conference (EPE-PEMC) · doi:10.1109/ipemc-ecceasia60879.2024.10567893 · Cited by 1
Deb, A., Taha, M., Gonzalez, J. A. O., Mawby, P., Jahdi, S., Etoz, B., & Alatise, O. M. (2025) · Microelectronics Reliability · doi:10.1016/j.microrel.2025.115834 · Cited by 1
Li, Y., Zhang, Y., Zhao, B., Sun, P., Zhao, Z., Li, X., Cai, Y., Xu, C., & Chen, Y. (2025) · IEEE International Electrical and Energy Conference (CIEEC) · doi:10.1109/cieec64805.2025.11116658 · Cited by 1
Bias Temperature Instability of SiC Trench MOSFET under DC and AC gate stress
Yu, K., Wang, Q., Wang, Y., & Wang, J. (2025) · IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia) · doi:10.1109/wipda-asia63772.2025.11183909 · Cited by 1
Zhang, Y., An, K., Li, Y., Tian, B., Qu, Z., Sun, P., Zhao, B., Cai, Y., & Zhao, Z. (2025) · IET Power Electronics · doi:10.1049/pel2.70116 · Cited by 1
Correlation of trap generation in SiC MOSFETs under γ-ray irradiation and bias temperature stress
Liang, X., Zhang, D., Wei, Y., Feng, J., Zheng, Q., Wen, L., Yu, X., Guo, Q., Zhang, T., & Li, Y. (2026) · Microelectronics Reliability · doi:10.1016/j.microrel.2026.116007 · Cited by 1
Reliability of Wide Bandgap Semiconductors for Automotive Applications
Kaminski, N., Basler, T., Boldyrjew-Mast, R., El-Barbari, S., Franke, J., Rittner, M., Salmen, P., Schmitt, S., Senftleben, O., Tuellmann, M., et al. (2026) · IEEE Transactions on Electron Devices · doi:10.1109/ted.2026.3672721 · Cited by 2
Linearization of BTI Degradation Across Si, SiC, and GaN
Bernstein, J. B., Avraham, T., & Wang, B. (2026) · Micro · doi:10.3390/micro6020031 · Cited by 1
He, L., Zhang, M., Li, C., Niu, H., Shi, Y., Chen, X., Fang, S., Wang, Z., & Chen, Y. (2026) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2026.3706282 · Cited by 1
A New Method of The Active Gate Driver for Current Balancing in The Parallel MOSFET Circuits
Sulistyo, M. E., Kaleg, S., Waskitho, D. A., Ristiana, R., Muharam, A., Budiman, A. C., Sudirja, S., Amin, A., & Ismail, K. (2023) · Evergreen · doi:10.5109/7151765 · Cited by 1
OPTIMISATION OF THE GATE VOLTAGE IN SiC MOSFETS: EFFICIENCY VS RELIABILITY
Gonzalez, J. A. O., Wu, R., Wu, H., Wang, X., Pickert, V., Mawby, P., & Alatise, O. M. (2021) · IET conference proceedings. · doi:10.1049/icp.2021.1043 · Cited by 1
Wu, Z., Liang, S., Deng, G., & Wang, J. (2022) · IEEE International Power Electronics and Application Conference and Exposition (PEAC) · doi:10.1109/peac56338.2022.9959397 · Cited by 1
Metadata
- Authors
- Puschkarsky, K., Reisinger, H., Aichinger, T., Gustin, W., & Grasser, T.
- Affiliations
- TU Wien (AT)
- Infineon Technologies (Germany) (DE)
- Infineon Technologies (Austria) (AT)
- Venue
- IEEE Transactions on Device and Materials Reliability
- Published
- 2018-06
- Volume
- 18
- Issue
- 2
- Pages
- 144-153
- ISSN
- 1530-4388 (ISSN-L)
- 1558-2574
- OpenAlex
- W2790374843
- Cited by
- 115
- References
- 24
- Citations by year
- 2026: 12 · 2025: 16 · 2024: 13 · 2023: 15 · 2022: 8 · 2021: 13 · 2020: 15 · 2019: 18 · 2018: 5
- FWCI
- 4.88
- Type
- journal article
- Language
- en
- Open access
- closed
- Locations
- IEEE Transactions on Device and Materials Reliability (publishedVersion)
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Silicon Carbide Semiconductor Technologies
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Semiconductor materials and devices
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Radiation Effects in Electronics
- Keywords
- threshold voltage hysteresis, SiC MOSFET, charge trapping, gate oxide, interface trap charge, threshold voltage shift, temperature dependence, switching operations
About these checks
Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
What counts as a claim ›How we measure confidence ›How we check this ›
Are you an author, or do you see a problem with this page? Request a review